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    • 4. 发明授权
    • Method of optical metrology of unresolved pattern arrays
    • 未解决的图案阵列的光学计量方法
    • US5805290A
    • 1998-09-08
    • US643138
    • 1996-05-02
    • Christopher Perry AusschnittTimothy Allan Brunner
    • Christopher Perry AusschnittTimothy Allan Brunner
    • G01B11/02B81C99/00G03F7/20H01L21/027G01B11/00
    • G03F7/70625G03F7/70633
    • A process for determining critical dimension bias or overlay error in a substrate formed by a lithographic process initially provides an array of elements on a substrate, the array comprising a plurality of spaced, substantially parallel elements having a length and a width. The sum of the width of an element and the spacing of adjacent elements define a pitch of the elements. Edges of the elements are aligned along a line forming opposite array edges, with the distance between array edges comprising the array width. An optical metrology tool used for measurement of the array is adjustable for one or more of i) wavelength of the light source, ii) numerical aperture value or iii) partial coherence. The process includes selecting the pitch of the elements, the wavelength of the light source, the numerical aperture and the partial coherence such that the pitch of the elements is less than or about equal to the ratio of the wavelength of the light source to the numerical aperture value of the optical metrology tool in the direction of the array edges whereby individual elements are not resolved within the array. The edges of the array are resolved with the optical metrology tool and the width of the array is measured to determine bias or overlay error in the substrate. Where the pitch of the array differs in different directions, the optical metrology tool has a non-circular pupil and the numerical aperture value NA of the optical metrology tool in the direction of minimum array pitch is selected to be less than the numerical aperture value NA of the optical metrology tool in a direction of maximum array pitch, such that the array edges are resolved and individual elements are not resolved.
    • 用于确定由光刻工艺形成的衬底中的临界尺寸偏差或重叠误差的过程最初提供了衬底上的元件阵列,所述阵列包括具有长度和宽度的多个间隔开的基本上平行的元件。 元素的宽度和相邻元素的间距的总和定义了元素的间距。 元件的边缘沿着形成相对的阵列边缘的线对齐,阵列边缘之间的距离包括阵列宽度。 用于测量阵列的光学测量工具可以调整光源的i)波长中的一个或多个,ii)数值孔径值或iii)部分相干性。 该过程包括选择元件的间距,光源的波长,数值孔径和部分相干性,使得元件的间距小于或等于光源的波长与数值的比率 在光学计量工具的阵列边缘的方向上的光圈值,其中各个元件在阵列内不被解析。 阵列的边缘用光学测量工具解析,测量阵列的宽度以确定衬底中的偏置或重叠误差。 在阵列的间距在不同方向上不同的情况下,光学计量工具具有非圆形光瞳,光学测量工具在最小阵列间距方向上的数值孔径NA选择为小于数值孔径值NA 的光学计量学工具在最大阵列间距的方向上,使得阵列边缘被解析并且各个元件不被解析。