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    • 5. 发明申请
    • METHOD FOR FORMING HIGH-RESOLUTION PATTERN WITH DIRECT WRITING MEANS
    • 用于形成具有直接书写方式的高分辨率图案的方法
    • WO2006121298A1
    • 2006-11-16
    • PCT/KR2006/001769
    • 2006-05-12
    • LG CHEM, LTD.
    • SHIN, Dong-YounSHIN, Bu-Gon
    • H01L21/32
    • G03F7/70383C09D11/30H01L21/312H05K3/0032H05K3/048H05K3/125H05K3/1258H05K2203/013H05K2203/0568
    • Disclosed is a method for forming a pattern which comprises the steps of: (a) providing a substrate having a sacrificial layer made of a first material, partially or totally formed on the substrate; (b) forming pattern grooves, which are free from the first material and have a line width of a first resolution or lower, on the sacrificial layer by using a first means, by which the sacrificial layer is directly processed to form a line; (c) filling the pattern grooves with a second material to a second resolution by using a second means, to form a pattern of the second material on the substrate. A substrate having a pre-pattern formed by the method is also disclosed. The method for forming a pattern provides a high-resolution pattern with little or no waste of the second material, thereby reducing production costs. The method includes use of the first means with a high resolution, such as focused energy beams of laser, combined with the second means with a low resolution, such as ink-jet, and provides a high-resolution pattern with high processing efficiency.
    • 公开了一种用于形成图案的方法,包括以下步骤:(a)提供具有由第一材料制成的牺牲层的基板,部分地或全部地形成在基板上; (b)通过使用第一装置在牺牲层上形成没有第一材料并且具有第一分辨率或更低的线宽的图案凹槽,通过该第一装置直接处理牺牲层以形成线; (c)通过使用第二装置用第二材料将图案凹槽填充到第二分辨率,以在基底上形成第二材料的图案。 还公开了通过该方法形成的预制图案的基板。 形成图案的方法提供了高分辨率图案,几乎或不浪费第二材料,从而降低了生产成本。 该方法包括使用具有高分辨率的第一装置,例如与诸如喷墨的低分辨率与第二装置结合的激光的聚焦能量束,并且提供具有高处理效率的高分辨率图案。
    • 8. 发明申请
    • METHOD FOR PREPARING LIGHT EMITTING DIODE DEVICE HAVING HEAT DISSIPATION RATE ENHANCEMENT
    • 用于制备具有加热排放速率增强的发光二极管装置的方法
    • WO2007001144A1
    • 2007-01-04
    • PCT/KR2006/002478
    • 2006-06-27
    • LG CHEM, LTD.
    • LEE, Jae-SeungCHOI, Min-HoSHIN, Bu-GonKANG, Jong-HoonYU, Min-AHA, Duk-SikKHO, Dong-HanCHUN, Sang-KiCHANG, Suk-KyPARK, Soo-Min
    • H01L33/00
    • H01L33/0079H01L33/0095H01L2224/45144H01L2224/48091H01L2224/48247H01L2224/49107H01L2224/73265H01L2924/00014H01L2924/00
    • Disclosed are a method for fabricating a light emitting diode device having a light emitting diode section grown on a sapphire substrate, a boded structure fabricated through the method, a unit chip separated from the bonded structure, and a light emitting diode device having the unit chip. The method includes the steps of (a) bonding the light emitting diode section grown on a first surface of the sapphire substrate to a first surface of a first substrate by means of a first binder; (b) bonding a second surface of the first substrate to a first surface of a second substrate by means of a second binder; (c) removing the second substrate from a bonded structure obtained as a result of step (b) after polishing a second surface of the sapphire substrate; (d) separating the bonded structure into unit chips after the second substrate has been removed from the bonded structure; and (e) bonding the second surface of the polished sapphire substrate provided in each unit chip to a lead frame, and then removing the first substrate. In the manufacture of high-output light emitting diodes, such a method can remarkably improve heat dissipation efficiency by intentionally reducing the thickness of the sapphire substrate.
    • 公开了一种制造发光二极管器件的方法,该发光二极管器件具有在蓝宝石衬底上生长的发光二极管部分,通过该方法制造的结构结构,与接合结构分离的单元芯片和具有单元芯片的发光二极管器件 。 该方法包括以下步骤:(a)借助于第一粘结剂将在蓝宝石衬底的第一表面上生长的发光二极管部分与第一衬底的第一表面接合; (b)借助于第二粘合剂将所述第一基板的第二表面接合到第二基板的第一表面; (c)在抛光蓝宝石衬底的第二表面之后,从作为步骤(b)的结果获得的接合结构去除第二衬底; (d)在从接合结构移除第二基板之后将接合结构分离成单元芯片; 和(e)将设置在每个单元芯片中的经抛光的蓝宝石衬底的第二表面接合到引线框架,然后移除第一衬底。 在高输出发光二极管的制造中,通过有意地减小蓝宝石衬底的厚度,可以显着提高散热效率。