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    • 3. 发明申请
    • ADJUVANT FOR CONTROLLING POLISHING SELECTIVITY AND CHEMICAL MECHANICAL POLISHING SLURRY COMPRISING THE SAME
    • 用于控制抛光选择性和化学机械抛光浆料的添加剂
    • WO2007067001A1
    • 2007-06-14
    • PCT/KR2006/005314
    • 2006-12-08
    • LG CHEM, LTD.
    • YI, Gi-RaKIM, Jong-PilLEE, Jung-HeeMOON, Kwang-IkKO, Chang-BumJANG, Soon-HoCHO, Seung-BeomHONG, Young-Jun
    • C09K3/14
    • C09K3/1463C09G1/02H01L21/31053
    • Disclosed is an adjuvant for use in simultaneous polishing of a cationically charged material and an anionically charged material, which forms an adsorption layer on the cationically charged material in order to increase polishing selectivity of the anionically charged material, wherein the adjuvant comprises a polyelectrolyte salt containing: (a) a mixture of a linear polyelectrolyte having a weight average molecular weight of 2,000 ∼ 50,000 with a graft type polyelectrolyte that has a weight average molecular weight of 1,000 ∼ 20,000 and comprises a backbone and a side chain; and (b) a basic material. CMP (chemical mechanical polishing) slurry comprising the above adjuvant and abrasive particles is also disclosed. The adjuvant comprising a mixture of a linear polyelectrolyte with a graft type polyelectrolyte makes it possible to increase polishing selectivity as compared to CMP slurry using the linear polyelectrolyte alone, and to obtain a desired range of polishing selectivity by controlling the ratio of the linear polyelectrolyte to the graft type polyelectrolyte.
    • 公开了一种用于同时抛光阳离子电荷材料和阴离子充电材料的佐剂,其在阳离子电荷材料上形成吸附层,以增加阴离子带电材料的抛光选择性,其中助剂包含含有 (a)重均分子量为2000〜50,000的线性聚电解质与重均分子量为1000〜20,000的接枝型聚电解质的混合物,其包含骨架和侧链; 和(b)基本材料。 还公开了包含上述助剂和磨料颗粒的CMP(化学机械抛光)浆料。 包含线性聚电解质与接枝型聚电解质的混合物的佐剂使得可以使用单独的线性聚电解质与CMP浆料相比提高抛光选择性,并且通过控制线性聚电解质与线性聚电解质的比例来获得期望的抛光选择性范围 接枝型聚电解质。