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    • 4. 发明授权
    • Method of forming MOSFET gate electrodes having reduced depletion region growth sensitivity to applied electric field
    • 形成具有降低的耗尽区生长灵敏度的施加电场的MOSFET栅电极的方法
    • US06362034B1
    • 2002-03-26
    • US09471815
    • 1999-12-20
    • Justin S. SandfordKaizad R. Mistry
    • Justin S. SandfordKaizad R. Mistry
    • H01L21336
    • H01L21/823842H01L21/823814
    • A method of fabricating a FET having a gate electrode with reduced susceptibility to the carrier depletion effect, includes increasing the amount of n-type dopant in the gate electrode of an n-channel FET. In one embodiment of the present invention, an integrated circuit including NFETs and PFETs is produced with increased n-type doping in the n-channel FET gate electrodes without the use of additional photomasking operations. Prior to polysilicon patterning, a phosphorus doped silica glass (PSG) is deposited over the polysilicon. Subsequent to patterning of the polysilicon, NFET areas are masked, and exposed PFET areas subjected to source/drain extension implant operations. During this sequence, the PSG is removed from PFET areas but remains in the NFET areas. An anneal is performed to drive the phosphorus from the PSG into the NFET gate electrodes. NFET source/drain extensions are formed, and conventional MOSFET processing operations may then be performed to complete the integrated circuit. Embodiments of the present invention achieve the desired higher levels of doping without an additional masking operation, thereby achieving the desired electrical characteristics at a lower manufacturing cost.
    • 制造具有对载流子耗尽效应的敏感性降低的栅电极的FET的方法包括增加n沟道FET的栅电极中的n型掺杂剂的量。 在本发明的一个实施例中,在不使用额外的光掩模操作的情况下,在n沟道FET栅电极中产生具有增加的n型掺杂的NFET和PFET的集成电路。 在多晶硅图案化之前,在多晶硅上沉积磷掺杂石英玻璃(PSG)。 在多晶硅的图案化之后,NFET区域被掩蔽,并且暴露的PFET区域经受源极/漏极延伸注入操作。 在该序列期间,PSG从PFET区域移除,但仍保留在NFET区域中。 执行退火以将磷从PSG驱动到NFET栅电极中。 形成NFET源极/漏极延伸部,然后可以执行常规的MOSFET处理操作来完成集成电路。 本发明的实施例在没有额外的掩蔽操作的情况下实现期望的更高水平的掺杂,从而以较低的制造成本实现期望的电特性。