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1. 发明申请

US20090014775A1 SEMICONDUCTOR NONVOLATILE MEMORY DEVICE 有权
标题翻译：半导体非易失性存储器件
公开(公告)号：US20090014775A1
公开(公告)日：2009-01-15
申请号：US12233670
申请日：2008-09-19
申请人： Digh Hisamoto , Kan Yasui , Tetsuya Ishimaru , Shinichiro Kimura , Daisuke Okada
发明人： Digh Hisamoto , Kan Yasui , Tetsuya Ishimaru , Shinichiro Kimura , Daisuke Okada
IPC分类号： H01L29/00
CPC分类号： G11C16/0425 , G11C16/12 , G11C16/14 , G11C16/26 , G11C16/3454 , G11C16/3459
摘要： An operation scheme for operating stably a semiconductor nonvolatile memory device is provided.When hot-hole injection is conducted in the semiconductor nonvolatile memory device of a split gate structure, the hot-hole injection is verified using a crossing point that does not change with time. Thus, an erased state can be verified without being aware of any time-varying changes.Also, programming or programming/erasure is conducted by repeating pulse voltage or multi-step voltage application to a gate section multiple times.
摘要翻译：提供一种稳定运行半导体非易失性存储器件的操作方案。当在分裂栅极结构的半导体非易失性存储器件中进行热空穴注入时，使用不随时间变化的交叉点来验证热孔注入。因此，可以验证擦除状态，而不知道任何时变变化。此外，通过将多次脉冲电压或多级电压施加到栅极部分进行编程或编程/擦除。

2. 发明申请

US20070210371A1 NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND ITS FABRICATION METHOD 有权
标题翻译：非易失性半导体存储器件及其制造方法
公开(公告)号：US20070210371A1
公开(公告)日：2007-09-13
申请号：US11653832
申请日：2007-01-17
申请人： Digh Hisamoto , Kan Yasui , Shinichiro Kimura , Daisuke Okada
发明人： Digh Hisamoto , Kan Yasui , Shinichiro Kimura , Daisuke Okada
IPC分类号： H01L29/788
CPC分类号： H01L29/792 , H01L21/28282 , H01L27/115 , H01L27/11568 , H01L29/42344 , H01L29/66833
摘要： A memory cell includes a selective gate and a memory gate arranged on one side surface of the selective gate. The memory gate includes one part formed on one side surface of the selective gate and the other part electrically isolated from the selective gate and a p-well through an ONO layer formed below the memory gate. A sidewall-shaped silicon oxide is formed on side surfaces of the selective gate, and a sidewall-shaped silicon dioxide layer and a silicon dioxide layer are formed on side surfaces of the memory gate. The ONO layer formed below the memory gate is terminated below the silicon oxide, and prevents generation of a low breakdown voltage region in the silicon oxide near an end of the memory gate during deposition of the silicon dioxide layer.
摘要翻译：存储单元包括布置在选择栅极的一个侧表面上的选择栅极和存储栅极。存储器栅极包括形成在选择栅极的一个侧表面上的一个部分和与选择栅极电隔离的另一部分，以及通过形成在存储栅极下方的ONO层的p阱。在选择栅极的侧面上形成侧壁状的氧化硅，在存储栅的侧面形成侧壁状的二氧化硅层和二氧化硅层。形成在存储器栅下方的ONO层终止在氧化硅的下方，并且防止在沉积二氧化硅层期间在存储栅的端部附近的硅氧化物中产生低的击穿电压区域。

3. 发明申请

US20070183206A1 Semiconductor nonvolatile memory device 失效
标题翻译：半导体非易失性存储器件
公开(公告)号：US20070183206A1
公开(公告)日：2007-08-09
申请号：US11727592
申请日：2007-03-27
申请人： Digh Hisamoto , Kan Yasui , Tetsuya Ishimaru , Shinichiro Kimura , Daisuke Okada
发明人： Digh Hisamoto , Kan Yasui , Tetsuya Ishimaru , Shinichiro Kimura , Daisuke Okada
IPC分类号： G11C11/34 , G11C16/04
CPC分类号： G11C16/0425 , G11C16/12 , G11C16/14 , G11C16/26 , G11C16/3454 , G11C16/3459
摘要： An operation scheme for operating stably a semiconductor nonvolatile memory device is provided. When hot-hole injection is conducted in the semiconductor nonvolatile memory device of a split gate structure, the hot-hole injection is verified using a crossing point that does not change with time. Thus, an erased state can be verified without being aware of any time-varying changes. Also, programming or programming/erasure is conducted by repeating pulse voltage or multi-step voltage application to a gate section multiple times.
摘要翻译：提供一种稳定运行半导体非易失性存储器件的操作方案。当在分裂栅极结构的半导体非易失性存储器件中进行热空穴注入时，使用不随时间变化的交叉点来验证热孔注入。因此，可以验证擦除状态，而不知道任何时变变化。此外，通过将多次脉冲电压或多级电压施加到栅极部分进行编程或编程/擦除。

4. 发明授权

US08472258B2 Semiconductor nonvolatile memory device 有权
标题翻译：半导体非易失性存储器件
公开(公告)号：US08472258B2
公开(公告)日：2013-06-25
申请号：US13269425
申请日：2011-10-07
申请人： Digh Hisamoto , Kan Yasui , Tetsuya Ishimaru , Shinichiro Kimura , Daisuke Okada
发明人： Digh Hisamoto , Kan Yasui , Tetsuya Ishimaru , Shinichiro Kimura , Daisuke Okada
IPC分类号： G11C11/34 , G11C16/04 , G11C16/06
CPC分类号： G11C16/0425 , G11C16/12 , G11C16/14 , G11C16/26 , G11C16/3454 , G11C16/3459
摘要： An operation scheme for operating stably a semiconductor nonvolatile memory device is provided.When hot-hole injection is conducted in the semiconductor nonvolatile memory device of a split gate structure, the hot-hole injection is verified using a crossing point that does not change with time. Thus, an erased state can be verified without being aware of any time-varying changes.Also, programming or programming/erasure is conducted by repeating pulse voltage or multi-step voltage application to a gate section multiple times.
摘要翻译：提供一种稳定运行半导体非易失性存储器件的操作方案。当在分裂栅极结构的半导体非易失性存储器件中进行热空穴注入时，使用不随时间变化的交叉点来验证热孔注入。因此，可以验证擦除状态，而不知道任何时变变化。此外，通过将多次脉冲电压或多级电压施加到栅极部分进行编程或编程/擦除。

5. 发明授权

US08076709B2 Nonvolatile semiconductor memory device 有权
标题翻译：非易失性半导体存储器件
公开(公告)号：US08076709B2
公开(公告)日：2011-12-13
申请号：US12873679
申请日：2010-09-01
申请人： Tetsuya Ishimaru , Digh Hisamoto , Kan Yasui , Shinichiro Kimura
发明人： Tetsuya Ishimaru , Digh Hisamoto , Kan Yasui , Shinichiro Kimura
IPC分类号： H01L29/792 , G11C16/04
CPC分类号： G11C16/0466 , H01L21/28282 , H01L29/66833 , H01L29/792
摘要： In a situation where a memory cell includes an ONO film, which comprises a silicon nitride film for charge storage and oxide films positioned above and below the silicon nitride film; a memory gate above the ONO film; a select gate, which is adjacent to a lateral surface of the memory gate via the ONO film; a gate insulator positioned below the select gate; a source region; and a drain region, an erase operation is performed by injecting holes generated by BTBT into the silicon nitride film while applying a positive potential to the source region, applying a negative potential to the memory gate, applying a positive potential to the select gate, and flowing a current from the drain region to the source region, thus improving the characteristics of a nonvolatile semiconductor memory device.
摘要翻译：在存储单元包括ONO膜的情况下，其包括用于电荷存储的氮化硅膜和位于氮化硅膜上方和下方的氧化膜; 在ONO电影上方的记忆门; 选择栅极，其经由ONO膜与存储栅的侧表面相邻; 位于选择门下方的栅极绝缘体; 源区; 和漏极区域，通过将BTBT产生的空穴注入氮化硅膜，同时向源极区域施加正电位，向存储栅极施加负电位，向选择栅极施加正电位，进行擦除操作，以及使电流从漏极区域流向源极区域，从而改善非易失性半导体存储器件的特性。

6. 发明授权

US08064261B2 Semiconductor nonvolatile memory device 有权
标题翻译：半导体非易失性存储器件
公开(公告)号：US08064261B2
公开(公告)日：2011-11-22
申请号：US12787158
申请日：2010-05-25
申请人： Digh Hisamoto , Kan Yasui , Tetsuya Ishimaru , Shinichiro Kimura , Daisuke Okada
发明人： Digh Hisamoto , Kan Yasui , Tetsuya Ishimaru , Shinichiro Kimura , Daisuke Okada
IPC分类号： G11C11/34 , G11C16/04 , G11C16/06
CPC分类号： G11C16/0425 , G11C16/12 , G11C16/14 , G11C16/26 , G11C16/3454 , G11C16/3459
摘要： An operation scheme for operating stably a semiconductor nonvolatile memory device is provided.When hot-hole injection is conducted in the semiconductor nonvolatile memory device of a split gate structure, the hot-hole injection is verified using a crossing point that does not change with time. Thus, an erased state can be verified without being aware of any time-varying changes.Also, programming or programming/erasure is conducted by repeating pulse voltage or multi-step voltage application to a gate section multiple times.
摘要翻译：提供一种稳定运行半导体非易失性存储器件的操作方案。当在分裂栅结构的半导体非易失性存储器件中进行热孔注入时，使用不随时间变化的交叉点来验证热孔注入。因此，可以验证擦除状态，而不知道任何时变变化。此外，通过将多次脉冲电压或多级电压施加到栅极部分进行编程或编程/擦除。

7. 发明授权

US07671404B2 Fabrication method and structure of semiconductor non-volatile memory device 有权
标题翻译：半导体非易失性存储器件的制造方法和结构
公开(公告)号：US07671404B2
公开(公告)日：2010-03-02
申请号：US11589095
申请日：2006-10-30
申请人： Digh Hisamoto , Shinichiro Kimura , Kan Yasui , Nozomu Matsuzaki
发明人： Digh Hisamoto , Shinichiro Kimura , Kan Yasui , Nozomu Matsuzaki
IPC分类号： H01L29/94
CPC分类号： H01L27/11531 , H01L21/28282 , H01L27/115 , H01L27/11526 , H01L27/11546 , H01L27/11568 , H01L29/42344 , H01L29/792
摘要： A non-volatile semiconductor memory device with good write/erase characteristics is provided. A selection gate is formed on a p-type well of a semiconductor substrate via a gate insulator, and a memory gate is formed on the p-type well via a laminated film composed of a silicon oxide film, a silicon nitride film, and a silicon oxide film. The memory gate is adjacent to the selection gate via the laminated film. In the regions on both sides of the selection gate and the memory gate in the p-type well, n-type impurity diffusion layers serving as the source and drain are formed. The region controlled by the selection gate and the region controlled by the memory gate located in the channel region between said impurity diffusion layers have the different charge densities of the impurity from each other.
摘要翻译：提供具有良好写入/擦除特性的非易失性半导体存储器件。通过栅极绝缘体在半导体衬底的p型阱上形成选择栅极，并且通过由氧化硅膜，氮化硅膜和氮化硅膜构成的层叠膜在p型阱上形成存储栅极氧化硅膜。存储器栅极通过层叠膜与选择栅极相邻。在p型阱中的选择栅极和存储栅极的两侧的区域中，形成用作源极和漏极的n型杂质扩散层。由选择栅极控制的区域和由位于所述杂质扩散层之间的沟道区域中的存储栅极控制的区域具有彼此不同的杂质的电荷密度。

8. 发明申请

US20100322013A1 Nonvolatile Semiconductor Memory Device 有权
标题翻译：非易失性半导体存储器件
公开(公告)号：US20100322013A1
公开(公告)日：2010-12-23
申请号：US12873679
申请日：2010-09-01
申请人： Tetsuya Ishimaru , Digh Hisamoto , Kan Yasui , Shinichiro Kimura
发明人： Tetsuya Ishimaru , Digh Hisamoto , Kan Yasui , Shinichiro Kimura
IPC分类号： G11C16/04 , H01L29/792
CPC分类号： G11C16/0466 , H01L21/28282 , H01L29/66833 , H01L29/792
摘要： In a situation where a memory cell includes an ONO film, which comprises a silicon nitride film for charge storage and oxide films positioned above and below the silicon nitride film; a memory gate above the ONO film; a select gate, which is adjacent to a lateral surface of the memory gate via the ONO film; a gate insulator positioned below the select gate; a source region; and a drain region, an erase operation is performed by injecting holes generated by BTBT into the silicon nitride film while applying a positive potential to the source region, applying a negative potential to the memory gate, applying a positive potential to the select gate, and flowing a current from the drain region to the source region, thus improving the characteristics of a nonvolatile semiconductor memory device.
摘要翻译：在存储单元包括ONO膜的情况下，其包括用于电荷存储的氮化硅膜和位于氮化硅膜上方和下方的氧化膜; 在ONO电影上方的记忆门; 选择栅极，其经由ONO膜与存储栅的侧表面相邻; 位于选择门下方的栅极绝缘体; 源区; 和漏极区域，通过将BTBT产生的空穴注入氮化硅膜，同时向源极区域施加正电位，向存储栅极施加负电位，向选择栅极施加正电位，进行擦除操作，以及使电流从漏极区域流向源极区域，从而改善非易失性半导体存储器件的特性。

9. 发明授权

US07847343B2 Semiconductor device and manufacturing method of semiconductor device 有权
标题翻译：半导体器件及半导体器件的制造方法
公开(公告)号：US07847343B2
公开(公告)日：2010-12-07
申请号：US12368538
申请日：2009-02-10
申请人： Digh Hisamoto , Kan Yasui , Shinichiro Kimura , Tetsuya Ishimaru
发明人： Digh Hisamoto , Kan Yasui , Shinichiro Kimura , Tetsuya Ishimaru
IPC分类号： H01L29/792
CPC分类号： H01L27/11568 , G11C16/0433 , H01L21/2815 , H01L21/28273 , H01L21/28282 , H01L21/84 , H01L27/115 , H01L27/11521 , H01L27/1203 , H01L29/66825 , H01L29/66833 , H01L29/792
摘要： Provided is a nonvolatile semiconductor memory device having a split gate structure, wherein a memory gate is formed over a convex shaped substrate and side surfaces of it is used as a channel. The nonvolatile semiconductor memory device according to the present invention is excellent in read current driving power even if a memory cell is scaled down.
摘要翻译：提供了一种具有分割栅极结构的非易失性半导体存储器件，其中存储栅极形成在凸形基板上，并且其侧表面用作沟道。根据本发明的非易失性半导体存储器件即使存储单元按比例缩小也具有优异的读取电流驱动功率。

10. 发明授权

US07751255B2 Semiconductor nonvolatile memory device 有权
标题翻译：半导体非易失性存储器件
公开(公告)号：US07751255B2
公开(公告)日：2010-07-06
申请号：US12233670
申请日：2008-09-19
申请人： Digh Hisamoto , Kan Yasui , Tetsuya Ishimaru , Shinichiro Kimura , Daisuke Okada
发明人： Digh Hisamoto , Kan Yasui , Tetsuya Ishimaru , Shinichiro Kimura , Daisuke Okada
IPC分类号： G11C11/34 , G11C16/04 , G11C16/06
CPC分类号： G11C16/0425 , G11C16/12 , G11C16/14 , G11C16/26 , G11C16/3454 , G11C16/3459
摘要： An operation scheme for operating stably a semiconductor nonvolatile memory device is provided.When hot-hole injection is conducted in the semiconductor nonvolatile memory device of a split gate structure, the hot-hole injection is verified using a crossing point that does not change with time. Thus, an erased state can be verified without being aware of any time-varying changes.Also, programming or programming/erasure is conducted by repeating pulse voltage or multi-step voltage application to a gate section multiple times.
摘要翻译：提供一种稳定运行半导体非易失性存储器件的操作方案。当在分裂栅极结构的半导体非易失性存储器件中进行热空穴注入时，使用不随时间变化的交叉点来验证热孔注入。因此，可以验证擦除状态，而不知道任何时变变化。此外，通过将多次脉冲电压或多级电压施加到栅极部分进行编程或编程/擦除。

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