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    • 4. 发明授权
    • Electrical energy generator
    • 电能发电机
    • US08975805B2
    • 2015-03-10
    • US13396208
    • 2012-02-14
    • Sung-min KimSeung-nam Cha
    • Sung-min KimSeung-nam Cha
    • H01L41/113
    • H02N2/186Y02E10/549
    • According to an example embodiment, an electrical energy generator includes at least one piezoelectric structure, a semiconductor layer and a contact layer. The at least one piezoelectric structure includes a material having piezoelectric characteristics. One surface of each piezoelectric structure forms a p-n junction with the semiconductor layer. The other end of each piezoelectric structure contacts the contact layer that is formed of a material having metal-insulator transition (MIT) characteristics. The piezoelectric structure may be an elongated member, such as a nanowire.
    • 根据示例性实施例,电能发生器包括至少一个压电结构,半导体层和接触层。 所述至少一个压电结构包括具有压电特性的材料。 每个压电结构的一个表面与半导体层形成p-n结。 每个压电结构的另一端接触由具有金属 - 绝缘体转变(MIT)特性的材料形成的接触层。 压电结构可以是细长构件,例如纳米线。
    • 8. 发明申请
    • SEMICONDUCTOR DEVICE WITH FINFET AND METHOD OF FABRICATING THE SAME
    • 具有FINFET的半导体器件及其制造方法
    • US20090239346A1
    • 2009-09-24
    • US12477348
    • 2009-06-03
    • Sung-min KimMin-sang KimEun-jung Yun
    • Sung-min KimMin-sang KimEun-jung Yun
    • H01L21/336
    • H01L29/785H01L29/42384H01L29/66795
    • A FinFET semiconductor device has an active region formed of a semiconductor substrate and projecting from a surface of the substrate. A fin having a first projection and a second projection composed of the active region are arranged in parallel and at each side of a central trench formed in a central portion of the active region. Upper surfaces and side surfaces of the first projection and the second projection comprise a channel region. A channel ion implantation layer is provided at a bottom of the central trench and at a lower portion of the fin. A gate oxide layer is provided on the fin. A gate electrode is provided on the gate oxide layer. A source region and a drain region are provided in the active region at sides of the gate electrode. A method of forming such a device is also provided.
    • FinFET半导体器件具有由半导体衬底形成并从衬底的表面突出的有源区。 具有第一突起和由有源区组成的第二突起的翅片平行布置在形成在有源区的中心部分的中心沟槽的每一侧。 第一突起和第二突起的上表面和侧表面包括通道区域。 通道离子注入层设置在中央沟槽的底部和鳍片的下部。 在鳍片上设置栅极氧化层。 栅电极设置在栅氧化层上。 源极区域和漏极区域设置在栅电极侧的有源区域中。 还提供了一种形成这种装置的方法。
    • 9. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE WITH STACKED MEMORY CELL AND METHOD OF MANUFACTURING THE STACKED MEMORY CELL
    • 具有堆叠存储单元的半导体存储器件和制造堆叠存储器单元的方法
    • US20090168493A1
    • 2009-07-02
    • US12273225
    • 2008-11-18
    • Sung-min KimEun-jung YunJong-soo SeoDu-eung KimBeak-hyung ChoByung-seo Kim
    • Sung-min KimEun-jung YunJong-soo SeoDu-eung KimBeak-hyung ChoByung-seo Kim
    • G11C11/00H01L21/00H01L47/00
    • G11C13/003G11C5/02G11C7/18G11C11/15G11C11/56G11C11/5678G11C13/0004G11C13/0023G11C13/0026G11C13/0064G11C13/0069G11C2013/0071G11C2213/71G11C2213/74G11C2213/79H01L27/24
    • In a semiconductor memory device and method, resistive-change memory cells are provided, each including a plurality of control transistors formed on different layers and variable resistance devices comprising a resistive-change memory. Each resistive-change memory cell includes a plurality of control transistors formed on different layers, and a variable resistance device formed of a resistive-change memory. In one example, the number of the control transistors is two. The semiconductor memory device includes a global bit line; a plurality of local bit lines connected to or disconnected from the global bit line via local bit line selection circuits which correspond to the local bit lines, respectively; and a plurality of resistive-change memory cell groups storing data while being connected to the local bit lines, respectively. Each of the resistive-change memory cells of each of the resistive-change memory cell groups comprises a plurality of control transistors formed on different layers, and a variable resistance device formed of a resistive-change memory. In addition, the semiconductor memory device has a hierarchical bit line structure that uses a global bit line and local bit lines. Accordingly, it is possible to increase both the integration density of the semiconductor memory device and the amount of current flowing through each of the resistive-change memory cells.
    • 在半导体存储器件和方法中,提供了电阻变化存储单元,每个包括形成在不同层上的多个控制晶体管和包括电阻变化存储器的可变电阻器件。 每个电阻变化存储单元包括形成在不同层上的多个控制晶体管和由电阻变化存储器形成的可变电阻器件。 在一个示例中,控制晶体管的数量是两个。 半导体存储器件包括全局位线; 通过分别对应于本地位线的本地位线选择电路分别连接到全局位线或与全局位线断开的多个局部位线; 以及分别在连接到本地位线时存储数据的多个电阻变化存储单元组。 每个电阻变化存储单元组中的每个电阻变化存储单元包括形成在不同层上的多个控制晶体管和由电阻变化存储器形成的可变电阻器件。 此外,半导体存储器件具有使用全局位线和局部位线的分层位线结构。 因此,可以增加半导体存储器件的集成密度和流过每个电阻变化存储单元的电流量。
    • 10. 发明授权
    • Non-volatile memory devices including divided charge storage structures
    • 非易失性存储器件包括分开的电荷存储结构
    • US07442987B2
    • 2008-10-28
    • US12014276
    • 2008-01-15
    • Sung-min KimDong-won KimEun-jung Yun
    • Sung-min KimDong-won KimEun-jung Yun
    • H01L29/788
    • H01L29/66833H01L21/28282H01L29/7923
    • A semiconductor memory device includes a substrate having first and second source/drain regions therein and a channel region therebetween. The device also includes first and second charge storage layers on the channel region, a first insulating layer on the channel region between the first and second charge storage layers, and a gate electrode on the insulating layer opposite the channel region and between inner sidewalls of the first and second charge storage layers. The gate electrode extends away from the substrate beyond the first and second charge storage layers. The device further includes second and third insulating layers extending from adjacent the inner sidewalls of the first and second charge storage layers along portions of the gate electrode beyond the first and second charge storage layers. Related methods of fabrication are also discussed.
    • 半导体存储器件包括其中具有第一和第二源极/漏极区域以及它们之间的沟道区域的衬底。 该器件还包括沟道区上的第一和第二电荷存储层,位于第一和第二电荷存储层之间的沟道区上的第一绝缘层,以及与沟道区相对的绝缘层上的第一绝缘层, 第一和第二电荷存储层。 栅电极远离基板延伸超过第一和第二电荷存储层。 该器件还包括从第一和第二电荷存储层的内侧壁相邻延伸的第二和第三绝缘层,沿栅电极的一部分延伸超过第一和第二电荷存储层。 还讨论了相关的制造方法。