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1. 发明申请

WO2018182656A1 ULTRA-LOW PROFILE PACKAGE SHIELDING TECHNIQUE USING MAGNETIC AND CONDUCTIVE LAYERS FOR INTEGRATED SWITCHING VOLTAGE REGULATOR 审中-公开
公开(公告)号：WO2018182656A1
公开(公告)日：2018-10-04
申请号：PCT/US2017/025208
申请日：2017-03-30
申请人： INTEL CORPORATION , RADHAKRISHNAN, Kaladhar
发明人： RADHAKRISHNAN, Kaladhar , LEE, Jaejin , HSU, Hao-Han , CHEN, Chung-Hao, J. , HAN, Dong-Ho
IPC分类号： H01L23/552 , H01L23/522 , H01L23/64 , H01L23/66
CPC分类号： H01L23/5227 , H01L23/5225 , H01L23/552 , H01L23/645 , H01L23/66 , H01L2223/6666 , H01L2223/6677
摘要： Semiconductor packages and a method of forming a semiconductor package are described. The semiconductor package has a foundation layer, a conductive layer formed in the foundation layer, and a magnetic layer formed between the conductive and the foundation layer. The conductive layer and the magnetic layer are coupled to form a low-profile inductor shield. The semiconductor package also has a dielectric layer formed between the magnetic and foundation layer. The foundation layer is mounted between a motherboard and a semiconductor die, where the foundation layer is attached to the motherboard with solder balls. Accordingly, the low-profile inductor shield may include a z-height that is less than a z-height of the solder balls. The low-profile inductor shield may have solder pads that are coupled to the conductive layer. The foundation layer may include at least one of voltage regulator and inductor, where the inductor is located above the low-profile inductor shield.

2. 发明申请

WO2018063262A1 PACKAGE-LEVEL NOISE FILTERING FOR EMI RFI MITIGATION 审中-公开
标题翻译：用于EMI RFI降低的封装级噪声滤波
公开(公告)号：WO2018063262A1
公开(公告)日：2018-04-05
申请号：PCT/US2016/054556
申请日：2016-09-29
申请人： INTEL CORPORATION
发明人： HSU, Hao-Han , HAN, Dong-Ho , WACHTMAN, Steven C. , KUHLMANN, Ryan K.
IPC分类号： H01L23/552 , H01L23/64 , H01L23/00 , H01L23/66
摘要： A semiconductor package and a packaged electronic device are described. The semiconductor package has a foundation layer and a planar filtering circuit. The circuit is formed in the foundation layer to provide EMI/RFI mitigation. The circuit has one or more conductive traces that are patterned to form an equivalent circuit of inductors and capacitors. The one or more conductive traces include planar metal shapes, such as meanders, loops, inter-digital fingers, and patterned shapes, to reduce the z-height of the package. The packaged electronic device has a semiconductor die, a foundation layer, a motherboard, a package, and the circuit. The circuit removes undesirable interferences generated from the semiconductor die. The circuit has a z-height that is less than a z-height of solder balls used to attach the foundation layer to the motherboard. A method of forming a planar filtering circuit in a foundation layer is also described.
摘要翻译：描述了半导体封装和封装的电子器件。半导体封装具有基础层和平面滤波电路。该电路形成在基层中以提供EMI / RFI缓解。该电路具有一个或多个图案化的导电迹线以形成电感器和电容器的等效电路。一个或多个导电迹线包括平面金属形状，诸如曲折线，环形，数字间指状物和图案化形状，以减小封装的z高度。封装的电子器件具有半导体管芯，基础层，主板，封装和电路。该电路去除了从半导体管芯产生的不希望的干扰。该电路的z高度小于用于将基础层连接到主板的焊球的z高度。还描述了在基础层中形成平面滤波电路的方法。

3. 发明申请

WO2016209479A1 RETENTION MECHANISM FOR SHIELDED FLEX CABLE TO IMPROVE EMI/RFI FOR HIGH SPEED SIGNALING 审中-公开
标题翻译：用于屏蔽柔性电缆的保持机构，用于提高EMI / RFI的高速信号
公开(公告)号：WO2016209479A1
公开(公告)日：2016-12-29
申请号：PCT/US2016/033968
申请日：2016-05-24
申请人： INTEL CORPORATION
发明人： LI, Xiang , LING, Yun , CHEN, Chung-Hao J. , HSU, Hao-Han , MOHAN, Shyamjith , CHEN, Kuan-Yu
IPC分类号： H01R13/648 , H01R12/77 , H01R13/24 , H01R11/12 , H01R13/658 , H01R13/6581
CPC分类号： H01R12/7076 , H01R12/594 , H01R12/7011 , H01R12/774 , H01R12/775 , H01R12/79 , H01R12/88 , H01R13/6585 , H01R13/6592
摘要： A retention apparatus for a shielded cable is described. In one embodiment, the apparatus comprises a substrate having a ground; a connector coupled to the substrate; a cable shielded with a conductive material and having an end connectable to the connector to electrically connect with the connector; an electrically conductive material coupled to the ground of the substrate; and a grounding retention mechanism to cause the electrically conductive material to electrically connect the cable to the ground of the substrate by applying a force to the cable shield.
摘要翻译：描述了屏蔽电缆的保持装置。在一个实施例中，该装置包括具有地面的基板; 耦合到所述基板的连接器; 用导电材料屏蔽的电缆，其一端可连接到连接器上以与连接器电连接; 耦合到所述衬底的接地的导电材料; 以及接地保持机构，用于通过向电缆屏蔽件施加力使导电材料将电缆电连接到基板的地面。

4. 发明申请

WO2014004282A1 THIN CHASSIS NEAR FIELD COMMUNICATION (NFC) ANTENNA INTEGRATION 审中-公开
标题翻译：近场通信（NFC）天线集成
公开(公告)号：WO2014004282A1
公开(公告)日：2014-01-03
申请号：PCT/US2013/046997
申请日：2013-06-21
申请人： INTEL CORPORATION , YANG, Songnan , HSU, Hao-Han , KARACAOGLU, Ulun , KONANUR, Anand, S. , HONG, Yee Wei
发明人： YANG, Songnan , HSU, Hao-Han , KARACAOGLU, Ulun , KONANUR, Anand, S. , HONG, Yee Wei
IPC分类号： G06F1/16
CPC分类号： H04B5/0081 , H01Q1/22 , H01Q1/2216 , H01Q1/2266 , H01Q1/243 , H01Q1/44 , H01Q1/48 , H01Q7/00 , H04M1/026 , H04M1/0266 , H04W4/80
摘要： Described herein are techniques related one or more systems, apparatuses, methods, etc. for integrating a near field communications (NFC) coil antenna in a portable device. For example, the NFC antenna is integrated under a metal chassis of the portable device. The metal chassis and a conductive coating - that is integrated underneath the full metal chassis - are designed to include one or more slots to provide high impedance to Eddy current induced in the conductive coating.
摘要翻译：这里描述的是涉及用于将近场通信（NFC）线圈天线集成在便携式设备中的一个或多个系统，装置，方法等的技术。例如，NFC天线集成在便携式设备的金属底盘下方。金属底盘和集成在全金属底盘下方的导电涂层被设计为包括一个或多个槽，以在导电涂层中引起的涡流电流提供高阻抗。

5. 发明申请

WO2013165421A1 MODULAR ANTENNA FOR NEAR FIELD COUPLING INTEGRATION INTO METALLIC CHASSIS DEVICES 审中-公开
标题翻译：用于近场耦合整合到金属底座装置中的模块化天线
公开(公告)号：WO2013165421A1
公开(公告)日：2013-11-07
申请号：PCT/US2012/036249
申请日：2012-05-03
申请人： INTEL CORPORATION , YANG, Songnan , KONANUR, Anand S. , HSU, Hao-Han , SHENG, Changsong , KARACAOGLU, Ulun
发明人： YANG, Songnan , KONANUR, Anand S. , HSU, Hao-Han , SHENG, Changsong , KARACAOGLU, Ulun
IPC分类号： H01Q7/00 , H01Q17/00 , H05K9/00 , H04B5/00
CPC分类号： H01Q1/526 , H01Q1/2266 , H01Q7/00 , H01Q7/08 , H04B5/0031 , H04B5/0037 , H04B5/0081
摘要： Described herein are techniques related to near field communication and wireless power transfers. A portable device may include a modular antenna that offers consistent characteristics independent of integration environment. The modular antenna may include a continuous loop of coil antenna and a ferrite material that are encapsulated by a shield. The shield may form a "U" shape configuration to encapsulate the top layer coil antenna and the middle layer ferrite material in all three sides, which are defined by a bottom portion, an outer wall, and an inner wall. Furthermore, the shield may include an outer rim and an inner rim to maintain the same coil antenna characteristics in the modular antenna.
摘要翻译：这里描述了与近场通信和无线功率传输相关的技术。便携式设备可以包括提供与集成环境无关的一致特征的模块化天线。模块化天线可以包括由屏蔽件封装的线圈天线和铁氧体材料的连续环路。屏蔽可以形成“U”形构造，以将由顶部，外壁和内壁限定的三层侧的顶层线圈天线和中间层铁氧体材料封装起来。此外，屏蔽件可以包括外缘和内缘，以在模块化天线中保持相同的线圈天线特性。

6. 发明申请

WO2013137892A1 NEAR FIELD CO (NFC) AND PROXIMITY SENSOR FOR PORTABLE DEVICES 审中-公开
标题翻译：近场（NFC）和便携式设备的接近传感器
公开(公告)号：WO2013137892A1
公开(公告)日：2013-09-19
申请号：PCT/US2012/029301
申请日：2012-03-15
申请人： INTEL CORPORATION , YANG, Songnan , KONANUR, Anand, S. , KARACAOGLU, Ulun , HSU, Hao-Han
发明人： YANG, Songnan , KONANUR, Anand, S. , HSU, Hao-Han
IPC分类号： G06K17/00 , G06K19/077
CPC分类号： H04B5/0043 , G06K7/10237 , H04B1/006 , H04B5/0012 , H04B5/0031 , H04B5/005 , H04B5/0081 , H04L25/03006 , H04L2025/03375 , H04W4/80
摘要： Described herein are techniques related to near field coupling and proximity sensing operations. For example, a proximity sensor uses a coil antenna that is utilized for near field communications (NFC) functions. The proximity sensor may be integrated into an NFC module to form a single module.
摘要翻译：这里描述了与近场耦合和接近感测操作有关的技术。例如，接近传感器使用用于近场通信（NFC）功能的线圈天线。接近传感器可以集成到NFC模块中以形成单个模块。

7. 发明申请

WO2018125424A1 SHIELD FOR CONNECTOR 审中-公开
公开(公告)号：WO2018125424A1
公开(公告)日：2018-07-05
申请号：PCT/US2017/062197
申请日：2017-11-17
申请人： INTEL CORPORATION
发明人： LEE, Jaejin , HSU, Hao-Han
IPC分类号： H01R13/6581
CPC分类号： H01R13/6581 , H01R12/724 , H01R13/6594 , H01R13/6598 , H01R43/26 , H01R2201/06 , H05K9/0022
摘要： Particular embodiments described herein provide for a connector shield that can include a main body, a shield portion to shield electromagnetic radiation from a connector, and a support portion. The main body can be removably secured to the connector. In an example, the shield portion includes lossy material and the shield portion is not grounded. The connector can include connection lines and the connection lines are at least partially inside a cavity of the shield portion.

8. 发明申请

WO2018080676A1 FLOATING PACKAGE STIFFENER 审中-公开
标题翻译：浮动包装增强器
公开(公告)号：WO2018080676A1
公开(公告)日：2018-05-03
申请号：PCT/US2017/052792
申请日：2017-09-21
申请人： INTEL CORPORATION
发明人： HSU, Hao-Han , HO, Ying Ern , LEE, Jaejin
IPC分类号： H01L23/12 , H01L23/48 , H01L23/485 , H01L23/00
CPC分类号： H01L23/562 , H01L23/498 , H01L23/552 , H01L23/66 , H01L2223/6644 , H01L2223/6677 , H01L2224/32225 , H01L2924/15311 , H01L2924/3511
摘要： Embodiments herein may relate to a package with one or more layers. A silicon die may be coupled with the one or more layers via an adhesive. A package stiffener may also be coupled with the adhesive adjacent to the die. A magnetic thin film may be coupled with the package stiffener. Other embodiments may be described and/or claimed.
摘要翻译：这里的实施例可以涉及具有一个或多个层的封装。硅裸片可以通过粘合剂与一个或多个层耦合。包装加强件也可以与邻近于模具的粘合剂连接。磁性薄膜可以与封装加强件耦合。其他实施例可以被描述和/或要求保护。

9. 发明申请

WO2013191896A1 EDGE-EMITTING ANTENNAS FOR ULTRA SLIM WIRELESS MOBILE DEVICES 审中-公开
标题翻译：用于超薄无线移动设备的边缘发射天线
公开(公告)号：WO2013191896A1
公开(公告)日：2013-12-27
申请号：PCT/US2013/044134
申请日：2013-06-04
申请人： INTEL CORPORATION , HSU, Hao-Han , HAN, Dong-Ho , YANG, Songnan , KONANUR, Anand, S. , CHEN, Chung Hao Joseph
发明人： HSU, Hao-Han , HAN, Dong-Ho , YANG, Songnan , KONANUR, Anand, S. , CHEN, Chung Hao Joseph
IPC分类号： H01Q7/06 , H01Q1/24 , H02J17/00
CPC分类号： H01Q7/08 , H02J7/025 , H02J17/00 , H02J50/10 , H02J50/70 , H04B5/0037 , H04B5/0081
摘要： Described herein are techniques related to near field coupling and wireless power transfers. A mobile device may include an edge-emitting antenna that offers ultra slim, all-metallic chassis packaging option with no cutout, uses lesser area, has robust mechanical strength, and provides EMI/ESD protection. In one example, an inductor coil is wrapped around a magnetic core and a pair of conductive layers is configured to interpose the magnetic core and the inductor coil between them to expose an edge of the magnetic core. The inductor coil being operable in a transmit mode to generate a magnetic field in response to a current passing through it. The edge is configured to enhance outward radiation of the magnetic field. Based on simulation results, the edge-emitting antenna occupies less space and provides an acceptable level of performance for coupling coefficients compared to conventional antenna.
摘要翻译：这里描述了与近场耦合和无线功率传输相关的技术。移动设备可以包括边缘发射天线，其提供超薄，全金属底盘封装选项，没有切口，使用较小的面积，具有坚固的机械强度，并提供EMI / ESD保护。在一个示例中，电感线圈缠绕在磁芯周围，并且一对导电层被配置为将磁芯和电感线圈插入它们之间以暴露磁芯的边缘。电感线圈可在发射模式下工作，以响应于通过它的电流而产生磁场。边缘被配置为增强磁场的向外辐射。基于仿真结果，与常规天线相比，边缘发射天线占用更少的空间并且提供了可接受的耦合系数的性能水平。

10. 发明申请

WO2020068268A1 ELECTROMAGNETIC INTERFERENCE SHIELDING FOR A CIRCUIT BOARD 审中-公开
公开(公告)号：WO2020068268A1
公开(公告)日：2020-04-02
申请号：PCT/US2019/044438
申请日：2019-07-31
申请人： INTEL CORPORATION
发明人： LEE, Jaejin , CHEN, Chung-Hao , HSU, Hao-Han , LI, Xiang , LIAO, Jun
IPC分类号： H05K9/00 , G06F1/18 , H05K1/02
摘要： An electromagnetic interference (EMI) shielding can be couplable to a circuit board. The EMI shielding can include a fence couplable to the circuit board, a lid couplable to the fence, and a shield arm extending from the lid and being configured to couple to the fence. The shield arm can be hingedly or rotatably coupled to the lid. The shield arm can be magnetically couplable to the lid. The shield arm and/or the fence can include a magnet to provide a magnetic attraction between the shield arm and the fence.

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