会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 4. 发明授权
    • Sputtering apparatus
    • 溅射装置
    • US5609739A
    • 1997-03-11
    • US362778
    • 1994-12-23
    • Isamu AokuraHitoshi YamanishiYouichi OhnishiTanejiro Ikeda
    • Isamu AokuraHitoshi YamanishiYouichi OhnishiTanejiro Ikeda
    • C23C14/35H01J37/34C23C14/34
    • H01J37/3426H01J37/3408H01J37/3452
    • A sputtering apparatus for performing sputtering operation by using a rectangular target made of ferromagnetic material, the apparatus includes an electrode in which one first permanent magnet is disposed on each side edge of a front surface of the target, polarities of the first magnets confronting each other with the target interposed between the first magnets are opposite to each other, one second permanent magnet is disposed on each side edge of a rear surface of the target, polarities of the second magnets confronting each other with the target interposed between the second magnets are opposite to each other, and the polarity of each second magnet disposed on the rear surface of the target is the same as that of the first magnet disposed on the front surface of the target.
    • 一种用于通过使用由铁磁材料制成的矩形靶进行溅射操作的溅射装置,该装置包括:电极,其中一个第一永磁体设置在靶的前表面的每个侧边缘上,第一磁体彼此面对的极性 夹在第一磁体之间的目标彼此相对,在目标的后表面的每个侧边缘上设置一个第二永磁体,并且夹在第二磁体之间的目标彼此面对的第二磁体的极性相反 并且设置在靶的后表面上的每个第二磁体的极性与设置在靶的前表面上的第一磁体的极性相同。