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1. 发明申请

US20080149739A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20080149739A1
公开(公告)日：2008-06-26
申请号：US12042079
申请日：2008-03-04
申请人： Hirotaka NISHIZAWA , Kenji Osawa , Hideo Koike , Junichiro Osako , Tamaki Wada
发明人： Hirotaka NISHIZAWA , Kenji Osawa , Hideo Koike , Junichiro Osako , Tamaki Wada
IPC分类号： G06K19/00
CPC分类号： G06F13/4081 , G06K19/077 , G06K19/07732
摘要： A semiconductor device includes external interface terminals and processing circuits, and it is fed with an operating power source when detachably set in a host equipment. Power source feeding terminals (VCC, VSS) among the external interface terminals are long enough to keep touching the corresponding terminals of the host equipment for, at least, a predetermined time period since the separation of an extraction detecting terminal among the external interface terminals, from the corresponding terminal of the host equipment, and they are formed to be longer in the extraction direction of the semiconductor device than the extraction detecting terminal. These power source feeding terminals are a power source terminal and a ground terminal, and any power source compensating capacitor is not connected between the power source terminal and the ground terminal. Since a time period required till the cutoff of the power source can be easily ensured, a capacitor for compensating the operating power source at the power source cutoff which occurs midway of an operation is not necessitated.
摘要翻译：半导体器件包括外部接口端子和处理电路，并且当可拆卸地设置在主机设备中时，其被馈送有工作电源。外部接口端子之间的电源馈送端子（VCC，VSS）足够长以至少在从外部接口端子之间分离提取检测端子至少预定的时间段内接触主机设备的相应端子，从主机设备的相应终端，它们形成为比提取检测终端在半导体器件的提取方向上更长。这些电源馈电端子是电源端子和接地端子，电源端子和接地端子之间没有连接任何电源补偿电容器。由于能够容易地确保电源截止所需的时间，所以不需要用于补偿在操作中途出现的电源切断时的工作电源的电容器。

2. 发明申请

US20080153205A1 SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：US20080153205A1
公开(公告)日：2008-06-26
申请号：US12037588
申请日：2008-02-26
申请人： Hirotaka NISHIZAWA , Tamaki Wada , Kenji Osawa , Junichiro Osako , Michiaki Sugiyama
发明人： Hirotaka NISHIZAWA , Tamaki Wada , Kenji Osawa , Junichiro Osako , Michiaki Sugiyama
IPC分类号： H01L21/02
CPC分类号： H01L23/49855 , G06K19/07732 , H01L23/49833 , H01L24/45 , H01L24/48 , H01L24/97 , H01L2224/45144 , H01L2224/48091 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H01L2924/14 , H01L2924/181 , H05K1/145 , H01L2924/00014 , H01L2224/85 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device comprising a first wiring board having a plurality of external connection terminals on one side, semiconductor chips mounted on the other side of the first wiring board and electrically connected to the first wiring board by a plurality of wires, a sealing resin for sealing the semiconductor chips and the wires, and a second wiring board having a plurality of contact points on one side and bonded to the top surface of the sealing resin on the other side, whereinthe upper end portions of the loops of the plurality of wires for electrically connecting the first wiring board to the semiconductor chips are exposed from the top surface of the sealing resin and electrically connected to the second wiring board.
摘要翻译：一种半导体器件，包括：一侧具有多个外部连接端子的第一布线板，安装在所述第一布线板的另一侧上并通过多根电线电连接到所述第一布线基板的半导体芯片，用于密封的密封树脂半导体芯片和电线，以及第二配线基板，其在一侧具有多个接触点，并且在另一侧与所述密封树脂的上表面接合，其中，所述多根电线的所述环的上端部，将第一配线基板与半导体芯片电连接，从密封树脂的顶面露出，并与第二配线基板电连接。

3. 发明申请

US20080073436A1 Memory Card 有权
标题翻译：存储卡
公开(公告)号：US20080073436A1
公开(公告)日：2008-03-27
申请号：US11945745
申请日：2007-11-27
申请人： Hirotaka NISHIZAWA , Akira HIGUCHI , Kenji OSAWA , Tamaki WADA , Michiaki SUGIYAMA , Junichiro OSAKO
发明人： Hirotaka NISHIZAWA , Akira HIGUCHI , Kenji OSAWA , Tamaki WADA , Michiaki SUGIYAMA , Junichiro OSAKO
IPC分类号： G06K19/06
CPC分类号： G06K19/077 , G06K19/07732 , H01L23/5388 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0652 , H01L2224/05554 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/49171 , H01L2224/4943 , H01L2224/73265 , H01L2225/06562 , H01L2924/00014 , H01L2924/01046 , H01L2924/01055 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/3011 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The present invention provides a memory card equipped with an interface controller connected to external connecting terminals, a memory connected to the interface controller, and a security controller connected to the interface controller. A second external connecting terminal capable of supplying an operating power supply to the security controller is provided aside from a first external connecting terminal which supplies an operating power supply to the interface controller and the memory. An interface unit of the interface controller connected to the security controller receives the operating power supply from the second external connecting terminal and thereby enables a stop of the supply of the operating power supply from the first external connecting terminal. Even if the supply of the operating power supply to the interface controller is cut off, the output of the interface unit is not brought to an indefinite state.
摘要翻译：本发明提供了一种存储卡，其配备有连接到外部连接终端的接口控制器，连接到接口控制器的存储器和连接到接口控制器的安全控制器。除了向接口控制器和存储器提供工作电源的第一外部连接端子之外，还提供了能够向安全控制器提供工作电源的第二外部连接端子。连接到安全控制器的接口控制器的接口单元接收来自第二外部连接端子的工作电源，从而能够停止从第一外部连接端子供给工作电源。即使向接口控制器提供工作电源被切断，接口单元的输出也不会变为无限状态。

4. 发明申请

US20100072284A1 SEMICONDUCTOR DEVICE AND ADAPTOR FOR THE SAME 审中-公开
标题翻译：半导体器件及其适配器
公开(公告)号：US20100072284A1
公开(公告)日：2010-03-25
申请号：US12517385
申请日：2007-12-12
申请人： Hirotaka NISHIZAWA , Hideo KOIKE , Hironori IWASAKI , Junichiro OSAKO , Minoru SHINOHARA , Tamaki WADA , Takashi TOTSUKA
发明人： Hirotaka NISHIZAWA , Hideo KOIKE , Hironori IWASAKI , Junichiro OSAKO , Minoru SHINOHARA , Tamaki WADA , Takashi TOTSUKA
IPC分类号： G06K19/07 , H01R24/00
CPC分类号： G06K19/07 , G06K19/07732 , G06K19/07741 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/49171 , H01L2924/19105 , H01R12/714 , H01R12/87 , H01R13/24 , H01L2924/00014
摘要： Connector terminals are arranged at the center of a thin memory card 1802, thereby preventing an electrical short circuit between the terminals. A step is provided to the thin memory card 1802, thereby allowing the IC chips to be stacked in a thick portion. Adhesion portions of the connector terminals 3303 are located at a position on a card insertion port side of a substrate 3002, thereby preventing the destruction of the connector terminals at the time of the card insertion. An upper retainer lid 3003 is provided on an upper portion of the connector terminals 3303, thereby preventing the deflection of the card.
摘要翻译：连接器端子布置在薄的存储卡1802的中心，从而防止端子之间的电短路。向薄型存储卡1802提供一个步骤，从而允许将IC芯片堆叠成较厚的部分。连接器端子3303的粘附部位于基板3002的卡插入口侧的位置，从而防止卡插入时的连接器端子的破坏。上连接器盖3003设置在连接器端子3303的上部，从而防止卡的偏转。

5. 发明申请

US20080272197A1 MEMORY CARD AND SEMICONDUCTOR DEVICE 有权
标题翻译：存储卡和半导体器件
公开(公告)号：US20080272197A1
公开(公告)日：2008-11-06
申请号：US11957469
申请日：2007-12-16
申请人： Hirotaka NISHIZAWA , Akira Higuchi , Kenji Osawa , Junichiro Osako , Tamaki Wada , Michiaki Sugiyama
发明人： Hirotaka NISHIZAWA , Akira Higuchi , Kenji Osawa , Junichiro Osako , Tamaki Wada , Michiaki Sugiyama
IPC分类号： G06K19/067
CPC分类号： G06K19/07732 , G06K19/005 , G06K19/077 , G06K19/07749
摘要： An antenna connection function for a noncontact interface is provided by suppressing a modification in a pin arrangement and a pin shape of a memory card that does not correspond to the noncontact interface. Two antenna connecting pins having the memory card are divided into two areas in which a size of one potential supply pin is the largest and used as a split pin arranged at intervals. Because a size of the two antenna connecting pins is at maximum as large as the size of the potential supply pin, the two antenna connecting pins are provided and the memory card that corresponds to the noncontact interface is obtained by devoting a pin area having the size of the one potential supply pin to the memory card that does not correspond to the noncontact interface. Accordingly, the pin area of the memory card that corresponds to the noncontact interface can be formed without departing from the pin area of the memory card that does not correspond to the noncontact interface.
摘要翻译：通过抑制不对应于非接触式接口的存储卡的引脚布置和引脚形状的修改来提供用于非接触式接口的天线连接功能。具有存储卡的两个天线连接引脚被分成两个区域，其中一个电位引脚的尺寸最大并且用作间隔布置的分离引脚。由于两个天线连接引脚的尺寸与电源引脚的尺寸一样大，所以提供了两个天线连接引脚，并且通过使用具有尺寸的引脚区域来获得与非接触式接口对应的存储卡一个可能的电源引脚与存储卡不对应的非接触式接口。因此，可以形成与非接触式接口相对应的存储卡的引脚区域，而不会脱离与非接触式接口对应的存储卡的引脚区域。

6. 发明申请

US20090181721A1 IC CARD 审中-公开
标题翻译： IC卡
公开(公告)号：US20090181721A1
公开(公告)日：2009-07-16
申请号：US12409470
申请日：2009-03-23
申请人： Hirotaka NISHIZAWA , Haruji ISHIHARA , Atsushi SHIRAISHI , Yosuke YUKAWA
发明人： Hirotaka NISHIZAWA , Haruji ISHIHARA , Atsushi SHIRAISHI , Yosuke YUKAWA
IPC分类号： H04M1/00
CPC分类号： G06K19/0719 , G06K19/072 , G06K19/077 , G06K19/07732 , G06K19/07733 , G06K19/07743 , G06K19/07745 , H01L2224/48137 , H01R27/00
摘要： A multifunction IC card (MFC) has compatibility with a multimedia card, an SD card, etc. in that connector terminals (#1 through #13) are disposed on a card substrate (1) in two rows in a zigzag fashion, and realizes multifunction facilities in that a memory card unit (3) and an SIM (Subscriber Identity Module) card unit (4) are respectively connected and mounted to predetermined terminals of the connector terminals (#1 through #13). The memory card unit (3) and the SIM card unit (4) are respectively separately provided with areas for storing secret codes for security. Thus, one IC card is capable of implementing multifunction facilities different in security level. Owing to the adoption of a plural-column layout corresponding to a form typified by the zigzag fashion in an array of the connector terminals, a relatively simple structure can be adopted in a card slot.
摘要翻译：多功能IC卡（MFC）与多媒体卡，SD卡等的兼容性在该连接器端子（＃1〜＃13）中以锯齿形的方式配置在卡片基板（1）上两行，存储卡单元（3）和SIM（用户识别模块）卡单元（4）分别连接并安装到连接器端子（＃1至＃13）的预定端子上的多功能设施。存储卡单元（3）和SIM卡单元（4）分别设置有用于存储安全密码的区域。因此，一个IC卡能够实现安全级别不同的多功能设备。由于在连接器端子的阵列中采用对应于由之字形形式表示的形式的多列布局，因此可以在卡槽中采用相对简单的结构。

7. 发明申请

US20070102530A1 IC CARD 有权
公开(公告)号：US20070102530A1
公开(公告)日：2007-05-10
申请号：US11619129
申请日：2007-01-02
申请人： Hirotaka NISHIZAWA , Yosuke Yukawa , Takashi Totsuka
发明人： Hirotaka NISHIZAWA , Yosuke Yukawa , Takashi Totsuka
IPC分类号： G06K19/06 , H01L23/02
CPC分类号： G06K19/07735 , G06K19/07 , G06K19/073 , G06K19/07732 , H01L23/5388 , H01L23/60 , H01L23/62 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/16 , H01L25/165 , H01L25/18 , H01L27/0251 , H01L2224/05553 , H01L2224/05554 , H01L2224/05599 , H01L2224/05624 , H01L2224/05647 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48228 , H01L2224/49113 , H01L2224/73265 , H01L2224/85399 , H01L2225/06562 , H01L2924/00014 , H01L2924/01019 , H01L2924/01021 , H01L2924/01039 , H01L2924/01055 , H01L2924/01079 , H01L2924/10161 , H01L2924/1301 , H01L2924/13091 , H01L2924/14 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/3011 , H01L2924/3025 , Y10S257/922 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural connection terminals (3) are exposed. The connection terminals are connected to predetermined external terminals (4) of the semiconductor integrated circuit chip, first overvoltage protection elements (7, 8, 9) connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements such as surface-mount type varistors (11) connected to the connection terminals are mounted on the card substrate. The varistors are variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements. The varistors have been selected by taking into consideration a relationship between the characteristics and the ability of the first overvoltage protection elements contained in the semiconductor integrated circuit chip, and exhibit the effect for preventing the electrostatic damage.

8. 发明申请

US20100277963A1 IC CARD 有权
标题翻译： IC卡
公开(公告)号：US20100277963A1
公开(公告)日：2010-11-04
申请号：US12835847
申请日：2010-07-14
申请人： Hirotaka NISHIZAWA , Yosuke YUKAWA , Takashi TOTSUKA
发明人： Hirotaka NISHIZAWA , Yosuke YUKAWA , Takashi TOTSUKA
IPC分类号： G11C5/02
CPC分类号： G06K19/07735 , G06K19/07 , G06K19/073 , G06K19/07732 , H01L23/5388 , H01L23/60 , H01L23/62 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/16 , H01L25/165 , H01L25/18 , H01L27/0251 , H01L2224/05553 , H01L2224/05554 , H01L2224/05599 , H01L2224/05624 , H01L2224/05647 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48228 , H01L2224/49113 , H01L2224/73265 , H01L2224/85399 , H01L2225/06562 , H01L2924/00014 , H01L2924/01019 , H01L2924/01021 , H01L2924/01039 , H01L2924/01055 , H01L2924/01079 , H01L2924/10161 , H01L2924/1301 , H01L2924/13091 , H01L2924/14 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/3011 , H01L2924/3025 , Y10S257/922 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural connection terminals (3) are exposed. The connection terminals are connected to predetermined external terminals (4) of the semiconductor integrated circuit chip, first overvoltage protection elements (7, 8, 9) connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements such as surface-mount type varistors (11) connected to the connection terminals are mounted on the card substrate. The varistors are variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements. The varistors have been selected by taking into consideration a relationship between the characteristics and the ability of the first overvoltage protection elements contained in the semiconductor integrated circuit chip, and exhibit the effect for preventing the electrostatic damage.
摘要翻译：一种IC卡，其能够增强防止静电损伤，而不会导致半导体集成电路芯片的成本上升。半导体集成电路芯片（2）安装在卡片基板（1）上，多个连接端子（3）露出。连接端子连接到半导体集成电路芯片的预定外部端子（4），连接到外部端子的第一过电压保护元件（7,8,9）集成在半导体集成电路芯片中，第二过电压保护元件因为连接到连接端子的表面安装型变阻器（11）安装在卡片基板上。变阻器是具有比第一过电压保护元件大的电流容许能力的可变电阻器元件。通过考虑包含在半导体集成电路芯片中的第一过电压保护元件的特性和能力之间的关系，已经选择了变阻器，并且具有防止静电损坏的效果。

9. 发明申请

US20080023562A1 IC CARD 有权
标题翻译： IC卡
公开(公告)号：US20080023562A1
公开(公告)日：2008-01-31
申请号：US11865721
申请日：2007-10-01
申请人： Hirotaka NISHIZAWA , Yosuke Yukawa , Takashi Totsuka
发明人： Hirotaka NISHIZAWA , Yosuke Yukawa , Takashi Totsuka
IPC分类号： G06K19/067
CPC分类号： G06K19/07735 , G06K19/07 , G06K19/073 , G06K19/07732 , H01L23/5388 , H01L23/60 , H01L23/62 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/16 , H01L25/165 , H01L25/18 , H01L27/0251 , H01L2224/05553 , H01L2224/05554 , H01L2224/05599 , H01L2224/05624 , H01L2224/05647 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48228 , H01L2224/49113 , H01L2224/73265 , H01L2224/85399 , H01L2225/06562 , H01L2924/00014 , H01L2924/01019 , H01L2924/01021 , H01L2924/01039 , H01L2924/01055 , H01L2924/01079 , H01L2924/10161 , H01L2924/1301 , H01L2924/13091 , H01L2924/14 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/3011 , H01L2924/3025 , Y10S257/922 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural connection terminals (3) are exposed. The connection terminals are connected to predetermined external terminals (4) of the semiconductor integrated circuit chip, first overvoltage protection elements (7, 8, 9) connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements such as surface-mount type varistors (11) connected to the connection terminals are mounted on the card substrate. The varistors are variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements. The varistors have been selected by taking into consideration a relationship between the characteristics and the ability of the first overvoltage protection elements contained in the semiconductor integrated circuit chip, and exhibit the effect for preventing the electrostatic damage.
摘要翻译：一种IC卡，其能够增强防止静电损伤，而不会导致半导体集成电路芯片的成本上升。半导体集成电路芯片（2）安装在卡片基板（1）上，多个连接端子（3）露出。连接端子连接到半导体集成电路芯片的预定的外部端子（4），连接到外部端子的第一过电压保护元件（7,8,9）集成在半导体集成电路芯片中，第二过电压保护元件因为连接到连接端子的表面安装型变阻器（11）安装在卡片基板上。变阻器是具有比第一过电压保护元件大的电流容许能力的可变电阻器元件。通过考虑包含在半导体集成电路芯片中的第一过电压保护元件的特性和能力之间的关系，已经选择了变阻器，并且具有防止静电损坏的效果。

10. 发明申请

US20070102799A1 IC CARD 失效
标题翻译： IC卡
公开(公告)号：US20070102799A1
公开(公告)日：2007-05-10
申请号：US11619135
申请日：2007-01-02
申请人： Hirotaka NISHIZAWA , Yosuke Yukawa , Takashi Totsuka
发明人： Hirotaka NISHIZAWA , Yosuke Yukawa , Takashi Totsuka
IPC分类号： H01L23/02
CPC分类号： G06K19/07735 , G06K19/07 , G06K19/073 , G06K19/07732 , H01L23/5388 , H01L23/60 , H01L23/62 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/16 , H01L25/165 , H01L25/18 , H01L27/0251 , H01L2224/05553 , H01L2224/05554 , H01L2224/05599 , H01L2224/05624 , H01L2224/05647 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48228 , H01L2224/49113 , H01L2224/73265 , H01L2224/85399 , H01L2225/06562 , H01L2924/00014 , H01L2924/01019 , H01L2924/01021 , H01L2924/01039 , H01L2924/01055 , H01L2924/01079 , H01L2924/10161 , H01L2924/1301 , H01L2924/13091 , H01L2924/14 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/3011 , H01L2924/3025 , Y10S257/922 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural connection terminals (3) are exposed. The connection terminals are connected to predetermined external terminals (4) of the semiconductor integrated circuit chip, first overvoltage protection elements (7, 8, 9) connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements such as surface-mount type varistors (11) connected to the connection terminals are mounted on the card substrate. The varistors are variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements. The varistors have been selected by taking into consideration a relationship between the characteristics and the ability of the first overvoltage protection elements contained in the semiconductor integrated circuit chip, and exhibit the effect for preventing the electrostatic damage.
摘要翻译：一种IC卡，其能够增强防止静电损伤，而不会导致半导体集成电路芯片的成本上升。半导体集成电路芯片（2）安装在卡片基板（1）上，多个连接端子（3）露出。连接端子连接到半导体集成电路芯片的预定外部端子（4），连接到外部端子的第一过电压保护元件（7,8,9）集成在半导体集成电路芯片中，第二过电压保护元件因为连接到连接端子的表面安装型变阻器（11）安装在卡片基板上。变阻器是具有比第一过电压保护元件大的电流容许能力的可变电阻器元件。通过考虑包含在半导体集成电路芯片中的第一过电压保护元件的特性和能力之间的关系，已经选择了变阻器，并且具有防止静电损坏的效果。

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