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1. 发明申请

US20100229646A1 OSCILLATING ANGULAR SPEED SENSOR 失效
标题翻译：振动角速度传感器
公开(公告)号：US20100229646A1
公开(公告)日：2010-09-16
申请号：US12722707
申请日：2010-03-12
申请人： Hirofumi HIGUCHI , Akitoshi Yamanaka , Tetsuo Fujii
发明人： Hirofumi HIGUCHI , Akitoshi Yamanaka , Tetsuo Fujii
IPC分类号： G01C19/56
CPC分类号： G01C19/5719
摘要： An oscillating angular speed sensor includes a detector, a driving portion, and a separating portion. When an angular speed is generated while the detector is driven to oscillate by the driving portion, Coriolis force is applied to the detector. Therefore, the angular speed is detected based on a capacitance variation in accordance with a variation of an interval between a movable electrode and a fixed electrode of the detector. The separating portion is distanced from the detector and the driving portion, and is configured to separate a first space accommodating the detector and a second space accommodating the driving portion.
摘要翻译：振动角速度传感器包括检测器，驱动部分和分离部分。当检测器被驱动部分驱动振荡时产生角速度时，将科里奥利力施加到检测器。因此，根据检测器的可动电极和固定电极之间的间隔的变化，基于电容变化来检测角速度。分离部分远离检测器和驱动部分，并且被配置为分离容纳检测器的第一空间和容纳驱动部分的第二空间。

2. 发明授权

US08210040B2 Oscillating angular speed sensor 失效
标题翻译：振荡角速度传感器
公开(公告)号：US08210040B2
公开(公告)日：2012-07-03
申请号：US12722707
申请日：2010-03-12
申请人： Hirofumi Higuchi , Akitoshi Yamanaka , Tetsuo Fujii
发明人： Hirofumi Higuchi , Akitoshi Yamanaka , Tetsuo Fujii
IPC分类号： G01C19/56 , G01P9/04 , G01P1/02
CPC分类号： G01C19/5719
摘要： An oscillating angular speed sensor includes a detector, a driving portion, and a separating portion. When an angular speed is generated while the detector is driven to oscillate by the driving portion, Coriolis force is applied to the detector. Therefore, the angular speed is detected based on a capacitance variation in accordance with a variation of an interval between a movable electrode and a fixed electrode of the detector. The separating portion is distanced from the detector and the driving portion, and is configured to separate a first space accommodating the detector and a second space accommodating the driving portion.
摘要翻译：振动角速度传感器包括检测器，驱动部分和分离部分。当检测器被驱动部分驱动振荡时产生角速度时，将科里奥利力施加到检测器。因此，根据检测器的可动电极和固定电极之间的间隔的变化，基于电容变化来检测角速度。分离部分远离检测器和驱动部分，并且被配置为分离容纳检测器的第一空间和容纳驱动部分的第二空间。

3. 发明授权

US08169082B2 Semiconductor device and method for manufacturing the same 有权
公开(公告)号：US08169082B2
公开(公告)日：2012-05-01
申请号：US13287188
申请日：2011-11-02
申请人： Tetsuo Fujii , Akitoshi Yamanaka , Hisanori Yokura
发明人： Tetsuo Fujii , Akitoshi Yamanaka , Hisanori Yokura
IPC分类号： H01L23/48
CPC分类号： G01P15/125 , B81B7/007 , B81B2207/097 , G01C19/5719 , G01C19/5783 , G01P15/0802 , G01P2015/0814 , H01L23/481 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/94 , H01L25/0657 , H01L25/16 , H01L2224/0401 , H01L2224/05558 , H01L2224/114 , H01L2224/116 , H01L2224/13009 , H01L2224/13011 , H01L2224/13025 , H01L2224/13099 , H01L2224/13144 , H01L2224/2518 , H01L2224/45144 , H01L2224/48 , H01L2224/48463 , H01L2224/80001 , H01L2224/81805 , H01L2225/06513 , H01L2225/06541 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01022 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01072 , H01L2924/01079 , H01L2924/01322 , H01L2924/014 , H01L2924/10157 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H01L2924/1461 , H01L2924/15747 , H01L2924/15787 , H01L2924/15788 , H01L2924/19041 , H01L2924/30105 , H01L2924/3025 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device includes: a sensor including a sensor structure on a first side of the sensor and a periphery element surrounding the sensor structure; and a cap covering the sensor structure and having a second side bonded to the first side of the sensor. The cap includes a first wiring layer on the second side of the cap. The first wiring layer steps over the periphery element. The sensor further includes a sensor side connection portion, and the cap further includes a cap side connection portion. The sensor side connection portion is bonded to the cap side connection portion. At least one of the sensor side connection portion and the cap side connection portion provides an eutectic alloy so that the sensor side connection portion and the cap side connection portion are bonded to each other.

4. 发明授权

US08089144B2 Semiconductor device and method for manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US08089144B2
公开(公告)日：2012-01-03
申请号：US12654087
申请日：2009-12-10
申请人： Tetsuo Fujii , Akitoshi Yamanaka , Hisanori Yokura
发明人： Tetsuo Fujii , Akitoshi Yamanaka , Hisanori Yokura
IPC分类号： H01L23/48
CPC分类号： G01P15/125 , B81B7/007 , B81B2207/097 , G01C19/5719 , G01C19/5783 , G01P15/0802 , G01P2015/0814 , H01L23/481 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/94 , H01L25/0657 , H01L25/16 , H01L2224/0401 , H01L2224/05558 , H01L2224/114 , H01L2224/116 , H01L2224/13009 , H01L2224/13011 , H01L2224/13025 , H01L2224/13099 , H01L2224/13144 , H01L2224/2518 , H01L2224/45144 , H01L2224/48 , H01L2224/48463 , H01L2224/80001 , H01L2224/81805 , H01L2225/06513 , H01L2225/06541 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01022 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01072 , H01L2924/01079 , H01L2924/01322 , H01L2924/014 , H01L2924/10157 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H01L2924/1461 , H01L2924/15747 , H01L2924/15787 , H01L2924/15788 , H01L2924/19041 , H01L2924/30105 , H01L2924/3025 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device includes: a sensor including a sensor structure on a first side of the sensor and a periphery element surrounding the sensor structure; and a cap covering the sensor structure and having a second side bonded to the first side of the sensor. The cap includes a first wiring layer on the second side of the cap. The first wiring layer steps over the periphery element. The sensor further includes a sensor side connection portion, and the cap further includes a cap side connection portion. The sensor side connection portion is bonded to the cap side connection portion. At least one of the sensor side connection portion and the cap side connection portion provides an eutectic alloy so that the sensor side connection portion and the cap side connection portion are bonded to each other.
摘要翻译：半导体器件包括：传感器，包括在传感器的第一侧上的传感器结构和围绕传感器结构的外围元件; 以及盖，其覆盖所述传感器结构并具有结合到所述传感器的第一侧的第二侧。盖包括在盖的第二面上的第一布线层。第一布线层跨越周边元件。传感器还包括传感器侧连接部分，盖子还包括帽侧连接部分。传感器侧连接部分接合到盖侧连接部分。传感器侧连接部和盖侧连接部中的至少一方提供共晶合金，使得传感器侧连接部和盖侧连接部彼此接合。

5. 发明授权

US08413507B2 Semiconductor dynamic quantity sensor and method of manufacturing the same 有权
标题翻译：半导体动态量传感器及其制造方法
公开(公告)号：US08413507B2
公开(公告)日：2013-04-09
申请号：US12801405
申请日：2010-06-08
申请人： Tetsuo Fujii , Hisanori Yokura , Hirofumi Higuchi
发明人： Tetsuo Fujii , Hisanori Yokura , Hirofumi Higuchi
IPC分类号： G01C19/56 , G01P15/125
CPC分类号： H01L27/1203 , B81B2201/025 , B81B2201/0257 , B81B2201/0285 , B81B2201/047 , B81C1/00182 , G01C19/5755 , G01P15/0802 , G01P15/125 , G01P2015/0814 , H01L21/84
摘要： A semiconductor dynamic quantity sensor has a substrate including a semiconductor substrate, an insulation layer on a main surface of the semiconductor substrate, and a semiconductor layer on the insulation layer. The main surface has a projection that is trapezoidal or triangular in cross section. The semiconductor layer is divided by a through hole into a movable portion. A tip of the projection is located directly below the movable portion and spaced from the movable portion by a predetermined distance in a thickness direction of the substrate. A width of the tip of the projection is less than a width of the movable portion in a planar direction of the substrate. The distance between the tip of the projection and the movable portion is equal to a thickness of the insulation layer.
摘要翻译：半导体动态量传感器具有包括半导体衬底，半导体衬底的主表面上的绝缘层和绝缘层上的半导体层的衬底。主表面具有横截面为梯形或三角形的突起。半导体层由通孔分割成可动部。突出部的尖端位于可动部的正下方，与基板的厚度方向与可动部隔开预定的距离。突起的尖端的宽度小于基板的平面方向上的可动部的宽度。突起的尖端和可动部之间的距离等于绝缘层的厚度。

6. 发明申请

US20100050767A1 Angular velocity sensor 有权
标题翻译：角速度传感器
公开(公告)号：US20100050767A1
公开(公告)日：2010-03-04
申请号：US12585052
申请日：2009-09-01
申请人： Hirofumi Higuchi , Tetsuo Fujii , Masaki Inoue
发明人： Hirofumi Higuchi , Tetsuo Fujii , Masaki Inoue
IPC分类号： G01C19/56
CPC分类号： G01C19/5719
摘要： An angular velocity sensor includes first and second oscillators and a coupling beam. The coupling beam couples the first and second oscillators together in such a manner that the first and second oscillators vibrate relative to each other in a predetermined direction. The coupling beam includes a first post portion joined to a surface of the first oscillator, a second post portion joined to a surface of the second oscillator, and a spring portion that joins the first post portion to the second post portion. The spring portion is spaced from the first and second oscillators and has elasticity in the predetermined direction.
摘要翻译：角速度传感器包括第一和第二振荡器和耦合梁。耦合光束以第一和第二振荡器在预定方向上相对于彼此振动的方式将第一和第二振荡器耦合在一起。耦合梁包括接合到第一振荡器的表面的第一柱部分，与第二振荡器的表面接合的第二柱部分，以及将第一柱部分连接到第二柱部分的弹簧部分。弹簧部分与第一和第二振荡器间隔开，并且在预定方向上具有弹性。

7. 发明授权

US08234920B2 Angular velocity sensor having drive member coupling beam spaced apart from drive members 有权
标题翻译：角速度传感器具有与驱动构件间隔开的驱动构件联接梁
公开(公告)号：US08234920B2
公开(公告)日：2012-08-07
申请号：US12585052
申请日：2009-09-01
申请人： Hirofumi Higuchi , Tetsuo Fujii , Masaki Inoue
发明人： Hirofumi Higuchi , Tetsuo Fujii , Masaki Inoue
IPC分类号： G01P9/04 , G01C19/56
CPC分类号： G01C19/5719
摘要： An angular velocity sensor includes first and second oscillators and a coupling beam. The coupling beam couples the first and second oscillators together in such a manner that the first and second oscillators vibrate relative to each other in a predetermined direction. The coupling beam includes a first post portion joined to a surface of the first oscillator, a second post portion joined to a surface of the second oscillator, and a spring portion that joins the first post portion to the second post portion. The spring portion is spaced from the first and second oscillators and has elasticity in the predetermined direction.
摘要翻译：角速度传感器包括第一和第二振荡器和耦合梁。耦合光束以第一和第二振荡器在预定方向上相对于彼此振动的方式将第一和第二振荡器耦合在一起。耦合梁包括接合到第一振荡器的表面的第一柱部分，与第二振荡器的表面接合的第二柱部分，以及将第一柱部分连接到第二柱部分的弹簧部分。弹簧部分与第一和第二振荡器间隔开，并且在预定方向上具有弹性。

8. 发明授权

US08578761B2 Concentration sensor device and concentration detecting method 有权
标题翻译：浓度传感器装置及浓度检测方法
公开(公告)号：US08578761B2
公开(公告)日：2013-11-12
申请号：US12733694
申请日：2009-03-25
申请人： Kenji Fukumura , Tetsuo Yoshioka , Tetsuo Fujii , Takaaki Kawai , Hirofumi Higuchi , Teruo Oda , Yasuyuki Okuda
发明人： Kenji Fukumura , Tetsuo Yoshioka , Tetsuo Fujii , Takaaki Kawai , Hirofumi Higuchi , Teruo Oda , Yasuyuki Okuda
IPC分类号： G01N33/00
CPC分类号： G01N27/226 , G01N33/28
摘要： A concentration sensor device includes a sensor unit, a substrate, and a sedimentation limit unit. The sensor unit detects a concentration of a specific component contained in liquid. The substrate has a face to which the sensor unit is arranged. The sedimentation limit unit is integrally arranged with the sensor unit or arranged at an upstream side of the sensor unit in a flowing direction of the liquid. The sedimentation limit unit is configured to prevent sedimentation of a foreign object on the sensor unit. The sedimentation limit unit includes a piezoelectric element to vibrate when electricity is supplied so as to promote the foreign object to be separated from the sensor unit. The substrate has a recess recessed in a thickness direction of the substrate.
摘要翻译：浓度传感器装置包括传感器单元，基板和沉降限制单元。传感器单元检测液体中包含的特定成分的浓度。基板具有布置传感器单元的面。沉降限制单元与传感器单元一体地布置或者沿着液体的流动方向布置在传感器单元的上游侧。沉淀限制单元被配置为防止异物在传感器单元上的沉降。沉降限制单元包括压电元件，当供电时振动，以促进异物与传感器单元分离。基板具有在基板的厚度方向上凹陷的凹部。

9. 发明申请

US20100307246A1 Semiconductor dynamic quantity sensor and method of manufacturing the same 有权
标题翻译：半导体动态量传感器及其制造方法
公开(公告)号：US20100307246A1
公开(公告)日：2010-12-09
申请号：US12801405
申请日：2010-06-08
申请人： Tetsuo Fujii , Hisanori Yokura , Hirofumi Higuchi
发明人： Tetsuo Fujii , Hisanori Yokura , Hirofumi Higuchi
IPC分类号： G01P15/00 , H01L21/02 , H01L29/84
CPC分类号： H01L27/1203 , B81B2201/025 , B81B2201/0257 , B81B2201/0285 , B81B2201/047 , B81C1/00182 , G01C19/5755 , G01P15/0802 , G01P15/125 , G01P2015/0814 , H01L21/84
摘要： A semiconductor dynamic quantity sensor has a substrate including a semiconductor substrate, an insulation layer on a main surface of the semiconductor substrate, and a semiconductor layer on the insulation layer. The main surface has a projection that is trapezoidal or triangular in cross section. The semiconductor layer is divided by a through hole into a movable portion. A tip of the projection is located directly below the movable portion and spaced from the movable portion by a predetermined distance in a thickness direction of the substrate. A width of the tip of the projection is less than a width of the movable portion in a planar direction of the substrate. The distance between the tip of the projection and the movable portion is equal to a thickness of the insulation layer.
摘要翻译：半导体动态量传感器具有包括半导体衬底，半导体衬底的主表面上的绝缘层和绝缘层上的半导体层的衬底。主表面具有横截面为梯形或三角形的突起。半导体层由通孔分割成可动部。突出部的尖端位于可动部的正下方，与基板的厚度方向与可动部隔开预定的距离。突起的尖端的宽度小于基板的平面方向上的可动部的宽度。突起的尖端和可动部之间的距离等于绝缘层的厚度。

10. 发明申请

US20100235107A1 CONCENTRATION SENSOR DEVICE AND CONCENTRATION DETECTING METHOD 有权
标题翻译：浓度传感器装置和浓度检测方法
公开(公告)号：US20100235107A1
公开(公告)日：2010-09-16
申请号：US12733694
申请日：2009-03-25
申请人： Kenji Fukumura , Tetsuo Yoshioka , Tetsuo Fujii , Takaaki Kawai , Hirofumi Higuchi , Teruo Oda , Yasuyuki Okuda
发明人： Kenji Fukumura , Tetsuo Yoshioka , Tetsuo Fujii , Takaaki Kawai , Hirofumi Higuchi , Teruo Oda , Yasuyuki Okuda
IPC分类号： G01N27/22 , G01N33/00
CPC分类号： G01N27/226 , G01N33/28
摘要： A concentration sensor device includes a sensor unit, a substrate, and a sedimentation limit unit. The sensor unit detects a concentration of a specific component contained in liquid. The substrate has a face to which the sensor unit is arranged. The sedimentation limit unit is integrally arranged with the sensor unit or arranged at an upstream side of the sensor unit in a flowing direction of the liquid. The sedimentation limit unit is configured to prevent sedimentation of a foreign object on the sensor unit. The sedimentation limit unit includes a piezoelectric element to vibrate when electricity is supplied so as to promote the foreign object to be separated from the sensor unit. The substrate has a recess recessed in a thickness direction of the substrate.
摘要翻译：浓度传感器装置包括传感器单元，基板和沉降限制单元。传感器单元检测液体中包含的特定成分的浓度。基板具有布置传感器单元的面。沉降限制单元与传感器单元一体地布置或者沿着液体的流动方向布置在传感器单元的上游侧。沉淀限制单元被配置为防止异物在传感器单元上的沉降。沉降限制单元包括压电元件，当供电时振动，以促进异物与传感器单元分离。基板具有在基板的厚度方向上凹陷的凹部。

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