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    • 1. 发明授权
    • Quantum device, manufacturing method of the same and controlling method of the same
    • 量子器件及其制造方法及其控制方法
    • US07795694B2
    • 2010-09-14
    • US12292235
    • 2008-11-14
    • Haizhi SongTatsuya Usuki
    • Haizhi SongTatsuya Usuki
    • H01L21/00
    • H01L29/66977G01Q80/00H01L29/127Y10S438/962Y10S977/938
    • By bringing a tip of an AFM into contact with the surface of a GaAs substrate or an AlGaAs substrate, for example, applying a negative bias to the tip, and applying a positive bias to the GaAs substrate or the AlGaAs substrate, a donut-shaped oxide film is formed. Then, the oxide film is removed. As a result, a ring-shaped groove is formed in the surface of the GaAs substrate or the AlGaAs substrate. The oxide film can be removed by chemical etching, ultrasonic cleaning with water, a treatment with atomic hydrogen in a vacuum, or the like. Thereafter, a semiconductor film (InAs film or InGaAs film, for example) is epitaxially grown in the groove. Then, a capping layer which covers the semiconductor film and the GaAs substrate or the AlGaAs substrate is formed.
    • 通过使AFM的尖端与GaAs衬底或AlGaAs衬底的表面接触,例如向尖端施加负偏压,并向GaAs衬底或AlGaAs衬底施加正偏压,形成环形 形成氧化膜。 然后,除去氧化膜。 结果,在GaAs衬底或AlGaAs衬底的表面中形成环形沟槽。 可以通过化学蚀刻,用水进行超声波清洗,在真空中用原子氢处理等除去氧化膜。 此后,在槽内外延生长半导体膜(InAs膜或InGaAs膜)。 然后,形成覆盖半导体膜和GaAs衬底或AlGaAs衬底的覆盖层。
    • 3. 发明授权
    • Quantum device, manufacturing method of the same and controlling method of the same
    • 量子器件及其制造方法及其控制方法
    • US07465595B2
    • 2008-12-16
    • US11064497
    • 2005-02-24
    • Haizhi SongTatsuya Usuki
    • Haizhi SongTatsuya Usuki
    • H01L21/00
    • H01L29/66977G01Q80/00H01L29/127Y10S438/962Y10S977/938
    • By bringing a tip of an AFM into contact with the surface of a GaAs substrate or an AlGaAs substrate, for example, applying a negative bias to the tip, and applying a positive bias to the GaAs substrate or the AlGaAs substrate, a donut-shaped oxide film is formed. Then, the oxide film is removed. As a result, a ring-shaped groove is formed in the surface of the GaAs substrate or the AlGaAs substrate. The oxide film can be removed by chemical etching, ultrasonic cleaning with water, a treatment with atomic hydrogen in a vacuum, or the like. Thereafter, a semiconductor film (InAs film or InGaAs film, for example) is epitaxially grown in the groove. Then, a capping layer which covers the semiconductor film and the GaAs substrate or the AlGaAs substrate is formed.
    • 通过使AFM的尖端与GaAs衬底或AlGaAs衬底的表面接触,例如向尖端施加负偏压,并向GaAs衬底或AlGaAs衬底施加正偏压,形成环形 形成氧化膜。 然后,除去氧化膜。 结果,在GaAs衬底或AlGaAs衬底的表面中形成环形沟槽。 可以通过化学蚀刻,用水进行超声波清洗,在真空中用原子氢处理等除去氧化膜。 此后,在槽内外延生长半导体膜(InAs膜或InGaAs膜)。 然后,形成覆盖半导体膜和GaAs衬底或AlGaAs衬底的覆盖层。