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1. 发明公开

EP2772684A1 System for cooling devices 有权
标题翻译：系统fürKühlvorrichtungen
公开(公告)号：EP2772684A1
公开(公告)日：2014-09-03
申请号：EP14156421.1
申请日：2014-02-24
申请人： General Electric Company
发明人： Seeley, Charles Erklin , Weaver, Stanton Earl , Rush, Brian Magann , Giammattei, Mark Howard
IPC分类号： F21V29/00 , F15D1/00 , F04B17/00 , F15D1/08 , H01L23/467 , F04B43/04
CPC分类号： F15D1/007 , F04B43/046 , F04B43/095 , F04B45/027 , F21V29/60 , F21V29/63 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A cooling system (200) is provided. The cooling system includes an enclosure (202). The enclosure is defined by walls among which at least one is movable. The enclosure further includes at least one aperture (204) on at least one wall. The system further includes an amplification element (206) that is coupled with at least one walls of the enclosure. Further, the cooling system includes an actuation unit (208) mechanically coupled with the amplification element. The actuation unit includes at least one actuation signal triggered actuator configured to cause a displacement the amplification element. In the cooling system, the amplification element is configured to amplify the actuator caused displacement through to the at least one wall of the enclosure such that fluid enters and exits the enclosure from the at least one aperture.
摘要翻译：提供冷却系统（200）。冷却系统包括外壳（202）。外壳由墙壁限定，其中至少一个是可移动的。外壳还包括在至少一个壁上的至少一个孔（204）。该系统还包括与外壳的至少一个壁耦合的放大元件（206）。此外，冷却系统包括与放大元件机械耦合的致动单元（208）。致动单元包括至少一个致动信号触发的致动器，其被配置成使放大元件发生位移。在冷却系统中，放大元件被配置为放大致动器，使得位移通过外壳的至少一个壁，使得流体从至少一个孔进入和离开外壳。

2. 发明公开

EP2930587A1 SYSTEMS AND METHODS FOR USING ADDITIVE MANUFACTURING FOR THERMAL MANAGEMENT 有权
标题翻译：系统和方法中应用的附加材料生产热能管理
公开(公告)号：EP2930587A1
公开(公告)日：2015-10-14
申请号：EP15162670.2
申请日：2015-04-07
申请人： General Electric Company
发明人： Rush, Brian Magann , Gerstler, William Dwight , Lassini, Stefano Angelo Mario , Wetzel, Todd Garrett
IPC分类号： G06F1/20 , H05K7/20 , F28D15/02 , F28D15/04
摘要： According to one embodiment, a thermal management system for electronic devices (610,620), including a heat frame (625), a conformal slot portion, chassis frame, and heat fins (670) wherein the heat frame, conformal slot, chassis frame, and heat fins are integrally formed as a unitary structure by additive manufacturing. In another example, there is a modular vapor assembly for electronic components having a vapor chamber (600) comprising a component surface (680) and a top surface (675) with a vapor channel formed therebetween with at least one liquid receptacle (690) and having a wick structure (650) on at least some of an interior of the component surface. In operation, there is a circuit card with at least some of the electronic components (610,620) coupled to the vapor chamber component surface and the wick structures transfer at least some of the liquid from the receptacle towards the electronic components, wherein the liquid turns to a vapor that moves towards the receptacle.
摘要翻译：。根据一个实施例，用于电子设备（610.620），包括热框架（625），共形狭槽部，底盘框架和散热翅片（670）worin热帧，保形槽，底盘框架的热管理系统，和散热翅片形成为一体，通过添加制造一个整体的结构。在另一实施例，存在一种用于具有蒸汽腔（600）包括一个部件表面（680）和一个顶面（675）与至少一个液体容器（690）之间形成有一个蒸汽通道的电子部件和模块化蒸气组件具有在至少一些所述部件表面的内部的毛细结构（650）。在外科手术中，有一个电路卡至少一些耦合到蒸汽腔室部件表面上的电子元件（610.620）和所述毛细结构传递中的至少一些从朝向所述电子元件的容器中的液体的，worin液体变成蒸气做朝向容器移动。

3. 发明公开

EP4368395A3 SYSTEMS AND METHODS FOR USING ADDITIVE MANUFACTURING FOR THERMAL MANAGEMENT 审中-实审
公开(公告)号：EP4368395A3
公开(公告)日：2024-08-07
申请号：EP24166693.2
申请日：2015-04-07
申请人： General Electric Company
发明人： Rush, Brian Magann , Gerstler, William Dwight , Lassini, Stefano Angelo Mario , Wetzel, Todd Garrett
IPC分类号： G06F1/20 , H05K7/20 , F28D15/02 , F28D15/04 , B22F3/11 , B22F10/20 , B33Y10/00 , B33Y80/00
CPC分类号： F28D15/0233 , F28D15/046 , G06F1/20 , G06F2200/20120130101 , H05K7/20672 , H05K7/20336 , B33Y80/00 , B33Y10/00 , B22F10/20 , B22F3/1103
摘要： According to one embodiment, a thermal management system for electronic devices (610, 620), including a heat frame (625), a conformal slot portion, chassis frame, and heat fins (670) wherein the heat frame, conformal slot, chassis frame, and heat fins are integrally formed as a unitary structure by additive manufacturing. In another example, there is a modular vapor assembly for electronic components having a vapor chamber (600) comprising a component surface (680) and a top surface (675) with a vapor channel formed therebetween with at least one liquid receptacle (690) and having a wick structure (650) on at least some of an interior of the component surface. In operation, there is a circuit card with at least some of the electronic components (610, 620) coupled to the vapor chamber component surface and the wick structures transfer at least some of the liquid from the receptacle towards the electronic components, wherein the liquid turns to a vapor that moves towards the receptacle.

4. 发明授权

EP2930587B1 SYSTEMS AND METHODS FOR USING ADDITIVE MANUFACTURING FOR THERMAL MANAGEMENT 有权
公开(公告)号：EP2930587B1
公开(公告)日：2020-03-18
申请号：EP15162670.2
申请日：2015-04-07
申请人： General Electric Company
发明人： Rush, Brian Magann , Gerstler, William Dwight , Lassini, Stefano Angelo Mario , Wetzel, Todd Garrett
IPC分类号： G06F1/20 , H05K7/20 , F28D15/02 , F28D15/04

5. 发明授权

EP2772684B1 System for cooling devices 有权
标题翻译：冷却装置系统
公开(公告)号：EP2772684B1
公开(公告)日：2017-07-19
申请号：EP14156421.1
申请日：2014-02-24
申请人： General Electric Company
发明人： Seeley, Charles Erklin , Weaver, Stanton Earl , Rush, Brian Magann , Giammattei, Mark Howard
IPC分类号： F21V29/00 , F15D1/00 , F04B17/00 , F15D1/08 , H01L23/467 , F04B43/04
CPC分类号： F15D1/007 , F04B43/046 , F04B43/095 , F04B45/027 , F21V29/60 , F21V29/63 , H01L23/467 , H01L2924/0002 , H01L2924/00

6. 发明公开

EP2253919A2 High Performance Heat Transfer Device, Methods Of Manufacture Thereof And Articles Comprising The Same 审中-公开
标题翻译：高性能的传热装置，涉及它们的制备方法，以及含有这些物品
公开(公告)号：EP2253919A2
公开(公告)日：2010-11-24
申请号：EP10163003.6
申请日：2010-05-17
申请人： General Electric Company
发明人： Rush, Brian Magann , De Bock, Hendrik Pieter Jacobus , Deng, Tao , Russ, Boris Alexander , Varanasi, Kripa Kiran , Weaver Jr., Stanton Earl
IPC分类号： F28D15/04 , B22F1/02 , H01L23/427
CPC分类号： F28D15/046 , B22F3/1121 , B22F7/004 , F28F2245/02 , F28F2245/04 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： Disclosed herein is an heat transfer device (100) comprising a shell (20); the shell (20) being an enclosure that prevents matter from within the shell (20) from being exchanged with matter outside the shell (20); the shell (20) having an outer surface and an inner surface; and a porous layer disposed on the inner surface of the shell (20); the porous layer having a thickness effective to enclose a region (24) between opposing faces (21 and 23); the region (24) providing a passage for the transport of a fluid; the porous layer having a thermal conductivity of about 0.1 to about 2000 watts per meter-Kelvin and a mass flow rate of about 10 -9 to about 10 -4 kilograms per second.
摘要翻译：公开了包括壳（20）的内部的热传递装置（100）; 作为一个封闭的外壳（20）从与物质交换的壳的外部做防止物质从所述外壳（20）内（20）; 具有上外表面和上内表面壳（20）; 和多孔层设置在所述壳体（20）的内表面上; 具有厚度有效地相对面（21和23）之间包围的区域（24）的多孔层; 的区域（24）提供用于流体的传输通道; 具有每米 - 开尔文约0.1至约2000瓦的热导率和大约10 -9的质量流率，以每秒约10 -4公斤的多孔层。

7. 发明公开

EP4368395A2 SYSTEMS AND METHODS FOR USING ADDITIVE MANUFACTURING FOR THERMAL MANAGEMENT 审中-实审
公开(公告)号：EP4368395A2
公开(公告)日：2024-05-15
申请号：EP24166693.2
申请日：2015-04-07
申请人： General Electric Company
发明人： Rush, Brian Magann , Gerstler, William Dwight , Lassini, Stefano Angelo Mario , Wetzel, Todd Garrett
IPC分类号： B33Y80/00
CPC分类号： F28D15/0233 , F28D15/046 , G06F1/20 , G06F2200/20120130101 , H05K7/20672 , H05K7/20336 , B33Y80/00 , B33Y10/00 , B22F10/20 , B22F3/1103
摘要： According to one embodiment, a thermal management system for electronic devices (610, 620), including a heat frame (625), a conformal slot portion, chassis frame, and heat fins (670) wherein the heat frame, conformal slot, chassis frame, and heat fins are integrally formed as a unitary structure by additive manufacturing. In another example, there is a modular vapor assembly for electronic components having a vapor chamber (600) comprising a component surface (680) and a top surface (675) with a vapor channel formed therebetween with at least one liquid receptacle (690) and having a wick structure (650) on at least some of an interior of the component surface. In operation, there is a circuit card with at least some of the electronic components (610, 620) coupled to the vapor chamber component surface and the wick structures transfer at least some of the liquid from the receptacle towards the electronic components, wherein the liquid turns to a vapor that moves towards the receptacle.

8. 发明公开

EP3702884A1 SYSTEMS AND METHODS FOR USING ADDITIVE MANUFACTURING FOR THERMAL MANAGEMENT 有权
公开(公告)号：EP3702884A1
公开(公告)日：2020-09-02
申请号：EP20163552.1
申请日：2015-04-07
申请人： General Electric Company
发明人： Rush, Brian Magann , Gerstler, William Dwight , Lassini, Stefano Angelo Mario , Wetzel, Todd Garrett
IPC分类号： G06F1/20 , H05K7/20 , F28D15/02 , F28D15/04
摘要： According to one embodiment, a thermal management system for electronic devices (610, 620), including a heat frame (625), a conformal slot portion, chassis frame, and heat fins (670) wherein the heat frame, conformal slot, chassis frame, and heat fins are integrally formed as a unitary structure by additive manufacturing. In another example, there is a modular vapor assembly for electronic components having a vapor chamber (600) comprising a component surface (680) and a top surface (675) with a vapor channel formed therebetween with at least one liquid receptacle (690) and having a wick structure (650) on at least some of an interior of the component surface. In operation, there is a circuit card with at least some of the electronic components (610, 620) coupled to the vapor chamber component surface and the wick structures transfer at least some of the liquid from the receptacle towards the electronic components, wherein the liquid turns to a vapor that moves towards the receptacle.

9. 发明公开

EP2253919A3 High Performance Heat Transfer Device, Methods Of Manufacture Thereof And Articles Comprising The Same 审中-公开
标题翻译：高性能的传热装置，涉及它们的制备方法，以及含有这些物品
公开(公告)号：EP2253919A3
公开(公告)日：2013-11-06
申请号：EP10163003.6
申请日：2010-05-17
申请人： General Electric Company
发明人： Rush, Brian Magann , De Bock, Hendrik Pieter Jacobus , Deng, Tao , Russ, Boris Alexander , Varanasi, Kripa Kiran , Weaver Jr., Stanton Earl
IPC分类号： F28D15/04 , B22F1/02 , H01L23/427
CPC分类号： F28D15/046 , B22F3/1121 , B22F7/004 , F28F2245/02 , F28F2245/04 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： Disclosed herein is an heat transfer device (100) comprising a shell (20); the shell (20) being an enclosure that prevents matter from within the shell (20) from being exchanged with matter outside the shell (20); the shell (20) having an outer surface and an inner surface; and a porous layer disposed on the inner surface of the shell (20); the porous layer having a thickness effective to enclose a region (24) between opposing faces (21 and 23); the region (24) providing a passage for the transport of a fluid; the porous layer having a thermal conductivity of about 0.1 to about 2000 watts per meter-Kelvin and a mass flow rate of about 10 -9 to about 10 -4 kilograms per second.

10. 发明公开

EP3633305A1 ADDITIVELY MANUFACTURED COOLING ASSEMBLIES FOR THERMAL AND/OR MECHANICAL SYSTEMS, AND METHODS FOR MANUFACTURING THE ASSEMBLIES 有权
公开(公告)号：EP3633305A1
公开(公告)日：2020-04-08
申请号：EP19200941.3
申请日：2019-10-01
申请人： General Electric Company
发明人： Rush, Brian Magann , Bourassa, Corey , Osusky, Lana , Gerstler, William Dwight , Mandrusial, Gary
IPC分类号： F28D21/00
摘要： A multi-domain cooling assembly 100 configured to be coupled with one or more heat sources 104 includes a body 118 having an outer surface 102 and at least one cooling chamber 106, 114 disposed inside the body 118. The at least one cooling chamber 106, 114 extends in at least two orthogonal dimensions and includes a working fluid to extract thermal energy from the one or more heat sources 104. The assembly 100 includes a cooling channel 108 disposed within the body 118 and fluidly coupled with a passageway 110, 112 that carries cooling fluid into and out of the cooling channel 108. At least a portion of the cooling fluid is a liquid phase, a gas phase, or a liquid-gas mix phase. The cooling channel 108 is fluidly separate from the at least one cooling chamber 106, 114. The cooling channel 108 is thermally coupled with the at least one cooling chamber 106, 114. The at least one cooling chamber 106, 114 transfers thermal energy from the working fluid to the cooling fluid.

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