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    • 1. 发明授权
    • Methods of fabricating vertical twin-channel transistors
    • 制造垂直双通道晶体管的方法
    • US07897463B2
    • 2011-03-01
    • US12651688
    • 2010-01-04
    • Eun-Jung YunSung-Young LeeMin-Sang KimSung-Min KimHye-Jin Cho
    • Eun-Jung YunSung-Young LeeMin-Sang KimSung-Min KimHye-Jin Cho
    • H01L21/336
    • H01L29/7827H01L29/0653H01L29/513H01L29/66666H01L29/7831
    • A transistor includes first and second pairs of vertically overlaid source/drain regions on a substrate. Respective first and second vertical channel regions extend between the overlaid source/drain regions of respective ones of the first and second pairs of overlaid source/drain regions. Respective first and second insulation regions are disposed between the overlaid source/drain regions of the respective first and second pairs of overlaid source/drain regions and adjacent respective ones of the first and second vertical channel regions. Respective first and second gate insulators are disposed on respective ones of the first and second vertical channel regions. A gate electrode is disposed between the first and second gate insulators. The first and second vertical channel regions may be disposed near adjacent edges of the overlaid source/drain regions.
    • 晶体管包括在衬底上的第一对和第二对垂直重叠的源/漏区。 相应的第一和第二垂直沟道区域在第一和第二对覆盖的源极/漏极区域中的相应的第一和第二对重叠的源极/漏极区域之间延伸。 相应的第一和第二绝缘区域设置在相应的第一和第二对重叠的源极/漏极区域的重叠的源极/漏极区域之间并且相邻的第一和第二垂直沟道区域中的相应的第一和第二绝缘区域。 相应的第一和第二栅极绝缘体设置在第一和第二垂直沟道区域中的相应的一个上。 栅电极设置在第一和第二栅极绝缘体之间。 第一和第二垂直沟道区域可以设置在覆盖的源极/漏极区域的邻近边缘附近。
    • 4. 发明申请
    • Methods of Fabricating Electromechanical Non-Volatile Memory Devices
    • 制造机电非易失性存储器件的方法
    • US20100129976A1
    • 2010-05-27
    • US12693783
    • 2010-01-26
    • Eun Jung YunSung-Young LeeMin-Sang KimSung-Min Kim
    • Eun Jung YunSung-Young LeeMin-Sang KimSung-Min Kim
    • H01L21/02
    • H01L27/10G11C23/00
    • Electromechanical non-volatile memory devices are provided including a semiconductor substrate having an upper surface including insulation characteristics. A first electrode pattern is provided on the semiconductor substrate. The first electrode pattern exposes portions of a surface of the semiconductor substrate therethrough. A conformal bit line is provided on the first electrode pattern and the exposed surface of semiconductor substrate. The bit line is spaced apart from a sidewall of the first electrode pattern and includes a conductive material having an elasticity generated by a voltage difference. An insulating layer pattern is provided on an upper surface of the bit line located on the semiconductor substrate. A second electrode pattern is spaced apart from the bit line and provided on the insulating layer pattern. The second electrode pattern faces the first electrode pattern. Related methods are also provided.
    • 提供了包括具有包括绝缘特性的上表面的半导体衬底的机电非易失性存储器件。 第一电极图案设置在半导体衬底上。 第一电极图案暴露半导体衬底的表面的部分通过其中。 在第一电极图案和半导体衬底的暴露表面上提供保形位线。 位线与第一电极图案的侧壁间隔开,并且包括具有由电压差产生的弹性的导电材料。 绝缘层图案设置在位于半导体衬底上的位线的上表面上。 第二电极图案与位线间隔开并设置在绝缘层图案上。 第二电极图案面向第一电极图案。 还提供了相关方法。
    • 5. 发明申请
    • METHODS OF FABRICATING VERTICAL TWIN-CHANNEL TRANSISTORS
    • 制作垂直双通道晶体管的方法
    • US20100105181A1
    • 2010-04-29
    • US12651688
    • 2010-01-04
    • Eun-Jung YunSung-Young LeeMin-Sang KimSung-Min KimHye-Jin Cho
    • Eun-Jung YunSung-Young LeeMin-Sang KimSung-Min KimHye-Jin Cho
    • H01L21/336H01L21/28
    • H01L29/7827H01L29/0653H01L29/513H01L29/66666H01L29/7831
    • A transistor includes first and second pairs of vertically overlaid source/drain regions on a substrate. Respective first and second vertical channel regions extend between the overlaid source/drain regions of respective ones of the first and second pairs of overlaid source/drain regions. Respective first and second insulation regions are disposed between the overlaid source/drain regions of the respective first and second pairs of overlaid source/drain regions and adjacent respective ones of the first and second vertical channel regions. Respective first and second gate insulators are disposed on respective ones of the first and second vertical channel regions. A gate electrode is disposed between the first and second gate insulators. The first and second vertical channel regions may be disposed near adjacent edges of the overlaid source/drain regions.
    • 晶体管包括在衬底上的第一对和第二对垂直重叠的源/漏区。 相应的第一和第二垂直沟道区域在第一和第二对覆盖的源极/漏极区域中的相应的第一和第二对重叠的源极/漏极区域之间延伸。 相应的第一和第二绝缘区域设置在相应的第一和第二对重叠的源极/漏极区域的重叠的源极/漏极区域之间并且相邻的第一和第二垂直沟道区域中的相应的第一和第二绝缘区域。 相应的第一和第二栅极绝缘体设置在第一和第二垂直沟道区域中的相应的一个上。 栅电极设置在第一和第二栅极绝缘体之间。 第一和第二垂直沟道区域可以设置在覆盖的源极/漏极区域的邻近边缘附近。
    • 6. 发明申请
    • METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A MULTI-CHANNEL TYPE MOS TRANSISTOR
    • 制造具有多通道型MOS晶体管的半导体器件的制造方法
    • US20080099849A1
    • 2008-05-01
    • US11876613
    • 2007-10-22
    • Min-Sang KimSung-Young LeeSung-Min KimEun-Jung YunIn-Hyuk Choi
    • Min-Sang KimSung-Young LeeSung-Min KimEun-Jung YunIn-Hyuk Choi
    • H01L29/78H01L21/336
    • H01L29/78696H01L29/42392H01L29/66787
    • In a method of manufacturing a semiconductor device, an active channel pattern is formed on a substrate. The active channel pattern includes preliminary gate patterns and single crystalline silicon patterns that are alternately stacked with each other. A source/drain layer is formed on a sidewall of the active channel pattern. Mask pattern structures including a gate trench are formed on the active channel pattern and the source/drain layer. The patterns are selectively etched to form tunnels. The gate trench is then filled with a gate electrode. The gate electrode surrounds the active channel pattern. The gate electrode is protruded from the active channel pattern. The mask pattern structures are then removed. Impurities are implanted into the source/drain regions to form source/drain regions. A silicidation process is carried out on the source/drain regions to form a metal silicide layer, thereby completing a semiconductor device having a MOS transistor.
    • 在制造半导体器件的方法中,在衬底上形成有源沟道图案。 有源沟道图案包括彼此交替堆叠的初步栅极图案和单晶硅图案。 源极/漏极层形成在有源沟道图案的侧壁上。 在有源沟道图案和源极/漏极层上形成包括栅极沟槽的掩模图案结构。 选择性地蚀刻图案以形成隧道。 然后用栅电极填充栅极沟槽。 栅电极围绕有源沟道图案。 栅电极从有源沟道图案突出。 然后去除掩模图案结构。 将杂质注入源/漏区以形成源/漏区。 在源极/漏极区域上进行硅化处理以形成金属硅化物层,从而完成具有MOS晶体管的半导体器件。
    • 8. 发明授权
    • Method of manufacturing multibit electro-mechanical memory device having movable electrode
    • 具有可动电极的多位机电存储器件的制造方法
    • US08222067B2
    • 2012-07-17
    • US13116374
    • 2011-05-26
    • Eun-Jung YunMin-Sang KimSung-Min KimSung-Young LeeJi-Myoung LeeIn-Hyuk Choi
    • Eun-Jung YunMin-Sang KimSung-Min KimSung-Young LeeJi-Myoung LeeIn-Hyuk Choi
    • H01L21/00H01L29/66H01L29/84
    • H01L27/10G11C11/50H01L27/115
    • A multibit electro-mechanical memory device comprises a substrate, a bit line on the substrate, a first interlayer insulating film on the bit line, first and second lower word lines on the first interlayer insulating film, the first and second lower word lines separated horizontally from each other by a trench, a spacer abutting a sidewall of each of the first and second lower word lines, a pad electrode inside a contact hole, first and second cantilever electrodes suspended over first and second lower voids that correspond to upper parts of the first and second lower word lines provided in both sides on the pad electrode, the first and second cantilever electrodes being separated from each other by the trench, and being curved in a third direction that is perpendicular to the first and second direction; a second interlayer insulating film on the pad electrode, first and second trap sites supported by the second interlayer insulating film to have first and second upper voids on the first and second cantilever electrodes, and first and second upper word lines on the first and second trap sites.
    • 多位机电存储器件包括衬底,衬底上的位线,位线上的第一层间绝缘膜,第一层间绝缘膜上的第一和第二下字线,第一和第二下字线水平分开 通过沟槽彼此相邻的间隔件,邻接第一和第二下部字线中的每一个的侧壁的间隔件,接触孔内的焊盘电极,悬挂在第一和第二下部空隙中的第一和第二悬臂电极,其对应于 第一和第二下部字线设置在焊盘电极的两侧,第一和第二悬臂电极通过沟槽彼此分离,并且在垂直于第一和第二方向的第三方向上弯曲; 在所述焊盘电极上的第二层间绝缘膜,由所述第二层间绝缘膜支撑的第一和第二陷阱位置,以在所述第一和第二悬臂电极上具有第一和第二上部空隙,以及在所述第一和第二阱上的第一和第二上部字线 网站。
    • 10. 发明申请
    • Semiconductor device having a multi-channel type MOS transistor
    • 具有多沟道型MOS晶体管的半导体器件
    • US20100155827A1
    • 2010-06-24
    • US12659008
    • 2010-02-23
    • Min-Sang KimSung-Young LeeSung-Min KimEun-Jung YunIn-Hyuk Choi
    • Min-Sang KimSung-Young LeeSung-Min KimEun-Jung YunIn-Hyuk Choi
    • H01L29/78
    • H01L29/78696H01L29/42392H01L29/66787
    • In a method of manufacturing a semiconductor device, an active channel pattern is formed on a substrate. The active channel pattern includes preliminary gate patterns and single crystalline silicon patterns that are alternately stacked with each other. A source/drain layer is formed on a sidewall of the active channel pattern. Mask pattern structures including a gate trench are formed on the active channel pattern and the source/drain layer. The patterns are selectively etched to form tunnels. The gate trench is then filled with a gate electrode. The gate electrode surrounds the active channel pattern. The gate electrode is protruded from the active channel pattern. The mask pattern structures are then removed. Impurities are implanted into the source/drain regions to form source/drain regions. A silicidation process is carried out on the source/drain regions to form a metal silicide layer, thereby completing a semiconductor device having a MOS transistor.
    • 在制造半导体器件的方法中,在衬底上形成有源沟道图案。 有源沟道图案包括彼此交替堆叠的初步栅极图案和单晶硅图案。 源极/漏极层形成在有源沟道图案的侧壁上。 在有源沟道图案和源极/漏极层上形成包括栅极沟槽的掩模图案结构。 选择性地蚀刻图案以形成隧道。 然后用栅电极填充栅极沟槽。 栅电极围绕有源沟道图案。 栅电极从有源沟道图案突出。 然后去除掩模图案结构。 将杂质注入源/漏区以形成源/漏区。 在源极/漏极区域上进行硅化处理以形成金属硅化物层,从而完成具有MOS晶体管的半导体器件。