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1. 发明授权

US08269301B2 Submount for optical device and its manufacturing method 有权
标题翻译：光学装置底座及其制造方法
公开(公告)号：US08269301B2
公开(公告)日：2012-09-18
申请号：US12295740
申请日：2007-04-04
申请人： Shohei Hata , Eiji Sakamoto , Naoki Matsushima , Hideaki Takemori , Masatoshi Seki
发明人： Shohei Hata , Eiji Sakamoto , Naoki Matsushima , Hideaki Takemori , Masatoshi Seki
IPC分类号： H01L31/0203 , H01L27/15
CPC分类号： H01L33/486 , H01L25/0753 , H01L33/46 , H01L33/62 , H01L33/641 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/09701 , H01L2924/10253 , H01L2924/00014 , H01L2924/00
摘要： Submounts for mounting optical devices which have an excellent heat radiating property and can be formed in a wafer state in batch are provided.A metallized electrode including optical device mounting parts and wiring parts is formed on a surface of a first substrate containing an insulating material as a main component, a through hole is formed in a glass substrate serving as a second substrate, the optical device mounting parts of the first substrate are aligned to be located inside the through hole of the second substrate, and the first substrate and the second substrate are joined together by use of a method such as anodic bonding.
摘要翻译：提供了用于安装具有优异的散热性并且可以分批地以晶片状态形成的光学器件的安装座。包括光学器件安装部件和布线部件的金属化电极形成在以绝缘材料为主要成分的第一基板的表面上，在作为第二基板的玻璃基板中形成通孔，光学元件安装部第一基板被排列成位于第二基板的通孔内部，并且第一基板和第二基板通过诸如阳极接合的方法接合在一起。

2. 发明授权

US07939938B2 Functional device package with metallization arrangement for improved bondability of two substrates 有权
标题翻译：具有金属化布置的功能器件封装，用于改善两个衬底的粘合性
公开(公告)号：US07939938B2
公开(公告)日：2011-05-10
申请号：US12028108
申请日：2008-02-08
申请人： Shohei Hata , Naoki Matsushima , Eiji Sakamoto , Ryoji Okada , Takanori Aono , Atsushi Kazama , Toshiki Kida
发明人： Shohei Hata , Naoki Matsushima , Eiji Sakamoto , Ryoji Okada , Takanori Aono , Atsushi Kazama , Toshiki Kida
IPC分类号： H01L23/04
CPC分类号： B81C1/00269 , B81C2203/019 , H01L2924/0002 , H01L2924/00
摘要： A packaging structure for hermetically sealing a functional device by solder connection at a wafer level in which a first Si substrate having a concave portion metallized on its internal surface and a second Si substrate metallized at a position opposed to said concave portion are used, the metallization applied to the internal surface of the concave portion of the first Si substrate and the metallization applied to the second Si substrate at the position opposed to the concave portion are connected by molten solder to hermetically seal the functional device between the first Si substrate and the second Si substrate, whereby the wettability of the solder for the two Si substrates is improved, the bondability between the Si substrates is enhanced, and the yield at which the package is manufactured is improved.
摘要翻译：一种封装结构，用于通过在晶片级焊接连接来密封功能器件，其中使用在其内表面上具有金属化的凹部的第一Si衬底和在与所述凹部相对的位置上金属化的第二Si衬底，所述金属化施加到第一Si衬底的凹部的内表面，并且在与凹部相对的位置处施加到第二Si衬底的金属化通过熔融焊料连接，以将功能器件密封在第一Si衬底和第二Si衬底之间 Si衬底，由此提高了用于两个Si衬底的焊料的润湿性，提高了Si衬底之间的粘合性，并提高了制造封装的成品率。

3. 发明申请

US20110080657A1 OPTICAL MODULE 审中-公开
标题翻译：光学模块
公开(公告)号：US20110080657A1
公开(公告)日：2011-04-07
申请号：US12871877
申请日：2010-08-30
申请人： Toshiaki Takai , Eiji Sakamoto , Shohei Hata
发明人： Toshiaki Takai , Eiji Sakamoto , Shohei Hata
IPC分类号： G02B3/08
CPC分类号： G02B6/4206 , G02B6/4214 , G02B6/43 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/01327 , H01L2924/00
摘要： There is provided means of achieving the improvement of optical coupling efficiency between a surface receiving/emitting element and an optical transmission path with a simple structure and low cost. An optical element and a substrate having an optical waveguide layer and electric wiring are connected with each other through a lens having a Fresnel lens shape. A through via is provided in the lens, and the optical element and the electric wiring in the substrate are electrically connected with each other through the through via. Instead of the lens, a unit in which a lens is mounted inside an optical-element mounting substrate may be used.
摘要翻译：提供了以简单的结构和低成本实现表面接收/发射元件和光传输路径之间的光耦合效率的提高的方法。具有光波导层和电布线的光学元件和基板通过具有菲涅尔透镜形状的透镜彼此连接。在透镜中设置通孔，并且基板中的光学元件和电布线通过贯通孔彼此电连接。代替透镜，可以使用其中透镜安装在光学元件安装基板内的单元。

4. 发明申请

US20090219728A1 SUBMOUNT AND ITS MANUFACTURING METHOD 有权
标题翻译： SUBMOUNT及其制造方法
公开(公告)号：US20090219728A1
公开(公告)日：2009-09-03
申请号：US12295740
申请日：2007-04-04
申请人： Shohei Hata , Eiji Sakamoto , Naoki Matsushima , Hideaki Takemori , Masatoshi Seki
发明人： Shohei Hata , Eiji Sakamoto , Naoki Matsushima , Hideaki Takemori , Masatoshi Seki
IPC分类号： F21V19/00 , B32B38/10
CPC分类号： H01L33/486 , H01L25/0753 , H01L33/46 , H01L33/62 , H01L33/641 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/09701 , H01L2924/10253 , H01L2924/00014 , H01L2924/00
摘要： Submounts for mounting optical devices which have an excellent heat radiating property and can be formed in a wafer state in batch are provided.A metallized electrode including optical device mounting parts and wiring parts is formed on a surface of a first substrate containing an insulating material as a main component, a through hole is formed in a glass substrate serving as a second substrate, the optical device mounting parts of the first substrate are aligned to be located inside the through hole of the second substrate, and the first substrate and the second substrate are joined together by use of a method such as anodic bonding.
摘要翻译：提供了用于安装具有优异的散热性并且可以分批地以晶片状态形成的光学器件的安装座。包括光学器件安装部件和布线部件的金属化电极形成在以绝缘材料为主要成分的第一基板的表面上，在作为第二基板的玻璃基板中形成通孔，光学元件安装部第一基板被排列成位于第二基板的通孔内部，并且第一基板和第二基板通过诸如阳极接合的方法接合在一起。

5. 发明申请

US20080233349A1 Functional Device 有权
标题翻译：功能设备
公开(公告)号：US20080233349A1
公开(公告)日：2008-09-25
申请号：US11924924
申请日：2007-10-26
申请人： Shohei Hata , Eiji Sakamoto , Naoki Matsushima
发明人： Shohei Hata , Eiji Sakamoto , Naoki Matsushima
IPC分类号： B32B3/24
CPC分类号： G01P15/0802 , B81B2201/0271 , B81C1/00269 , G01P1/023 , G01P15/0897 , H03H9/105 , H03H9/1057 , H03H9/173 , Y10T428/24273 , Y10T428/24322 , Y10T428/2462 , Y10T428/24826 , Y10T428/265
摘要： The present invention provides a low-cost MEMS functional device by improving air tightness of a jointed section by anode junction in wafer level packaging for MEMS based functional devices. The MEMS functional device comprises a function element section formed by processing a substrate mainly made of Si, a metallized film for sealing formed around the functional element, and a glass substrate jointed to the metallized film for sealing by anode junction. Formed on a surface of the metallized film for sealing is a metallized film containing at least one of Sn and Ti as a main component.
摘要翻译：本发明通过在基于MEMS的功能器件的晶片级封装中改善阳极结的接合部分的气密性来提供低成本MEMS功能器件。 MEMS功能器件包括通过处理主要由Si制成的衬底，形成在功能元件周围形成的用于密封的金属化膜形成的功能元件部分，以及连接到金属化膜的用于通过阳极接合进行密封的玻璃衬底。形成在用于密封的金属化膜的表面上是以Sn和Ti中的至少一种为主要成分的金属化膜。

6. 发明申请

US20080217752A1 Functional Device Package 有权
标题翻译：功能器件封装
公开(公告)号：US20080217752A1
公开(公告)日：2008-09-11
申请号：US12028108
申请日：2008-02-08
申请人： Shohei Hata , Naoki Matsushima , Eiji Sakamoto , Ryoji Okada , Takanori Aono , Atsushi Kazama , Toshiki Kida
发明人： Shohei Hata , Naoki Matsushima , Eiji Sakamoto , Ryoji Okada , Takanori Aono , Atsushi Kazama , Toshiki Kida
IPC分类号： H01L23/02
CPC分类号： B81C1/00269 , B81C2203/019 , H01L2924/0002 , H01L2924/00
摘要： A packaging structure for hermitically sealing a functional device by solder connection at a wafer level in which a first Si substrate having a concave portion metallized on its internal surface and a second Si substrate metallized at a position opposed to said concave portion are used, the metallization applied to the internal surface of the concave portion of the first Si substrate and the metallization applied to the second Si substrate at the position opposed to the concave portion are connected by molten solder to hermetically seal the functional device between the first Si substrate and the second Si substrate, whereby the wettability of the solder for the two Si substrates is improved, the bondability between the Si substrates is enhanced, and the yield at which the package is manufactured is improved.
摘要翻译：一种用于通过在晶片级焊接连接来密封功能器件的封装结构，其中使用在其内表面上具有金属化的凹部的第一Si衬底和在与所述凹部相对的位置上金属化的第二Si衬底，所述金属化施加到第一Si衬底的凹部的内表面，并且在与凹部相对的位置处施加到第二Si衬底的金属化通过熔融焊料连接，以将功能器件密封在第一Si衬底和第二Si衬底之间 Si衬底，由此提高了用于两个Si衬底的焊料的润湿性，提高了Si衬底之间的粘合性，并提高了制造封装的成品率。

7. 发明授权

US08258637B2 Bonding structure and method for manufacturing same 有权
标题翻译：粘结结构及其制造方法
公开(公告)号：US08258637B2
公开(公告)日：2012-09-04
申请号：US12964907
申请日：2010-12-10
申请人： Eiji Sakamoto , Shohei Hata
发明人： Eiji Sakamoto , Shohei Hata
IPC分类号： H01L23/29
CPC分类号： H01L24/29 , H01L23/488 , H01L23/49816 , H01L24/03 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/81 , H01L24/83 , H01L2224/0401 , H01L2224/04026 , H01L2224/05551 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/13099 , H01L2224/13101 , H01L2224/13688 , H01L2224/291 , H01L2224/29101 , H01L2224/29111 , H01L2224/32014 , H01L2224/32245 , H01L2224/81191 , H01L2224/81192 , H01L2224/81193 , H01L2224/81355 , H01L2224/81815 , H01L2224/8189 , H01L2224/81905 , H01L2224/83192 , H01L2224/83424 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/83801 , H01L2224/8389 , H01L2224/83905 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/10272 , H01L2924/1033 , H01L2924/157 , H01L2924/351 , H01L2924/00014 , H01L2924/00
摘要： A bonding structure that a bonding region can endure a high temperature environment and the bonding can be maintained with high reliability is provided as a bonding material capable of maintaining reliable bonding in high temperature environment in place of solder including Pb. In the bonding structure for a first member and a second member, solder and glass are used to bond the first member and the second member together and the glass seals the solder. Thereby, electrical conductivity is ensured and the outflow of melting solder in high temperatures can be inhibited to improve the durability.
摘要翻译：作为能够在高温环境下保持可靠的接合而代替含Pb的焊料的接合材料，可以提供接合区域能够耐受高温环境并且可以高可靠性地保持接合的接合结构。在第一构件和第二构件的接合结构中，使用焊料和玻璃将第一构件和第二构件结合在一起，并且玻璃密封焊料。由此，确保导电性，能够抑制高温熔融焊料的流出，提高耐久性。

8. 发明授权

US08003193B2 Functional device 有权
标题翻译：功能设备
公开(公告)号：US08003193B2
公开(公告)日：2011-08-23
申请号：US11924924
申请日：2007-10-26
申请人： Shohei Hata , Eiji Sakamoto , Naoki Matsushima
发明人： Shohei Hata , Eiji Sakamoto , Naoki Matsushima
IPC分类号： B32B3/24 , B32B17/06
CPC分类号： G01P15/0802 , B81B2201/0271 , B81C1/00269 , G01P1/023 , G01P15/0897 , H03H9/105 , H03H9/1057 , H03H9/173 , Y10T428/24273 , Y10T428/24322 , Y10T428/2462 , Y10T428/24826 , Y10T428/265
摘要： The present invention provides a low-cost MEMS functional device by improving air tightness of a jointed section by anode junction in wafer level packaging for MEMS based functional devices. The MEMS functional device comprises a function element section formed by processing a substrate mainly made of Si, a metallized film for sealing formed around the functional element, and a glass substrate jointed to the metallized film for sealing by anode junction. Formed on a surface of the metallized film for sealing is a metallized film containing at least one of Sn and Ti as a main component.
摘要翻译：本发明通过在基于MEMS的功能器件的晶片级封装中改善阳极结的接合部分的气密性来提供低成本MEMS功能器件。 MEMS功能器件包括通过处理主要由Si制成的衬底，形成在功能元件周围形成的用于密封的金属化膜形成的功能元件部分，以及连接到金属化膜的用于通过阳极接合进行密封的玻璃衬底。形成在用于密封的金属化膜的表面上是以Sn和Ti中的至少一种为主要成分的金属化膜。

9. 发明申请

US20110139856A1 BONDING STRUCTURE AND METHOD FOR MANUFACTURING SAME 有权
标题翻译：粘结结构及其制造方法
公开(公告)号：US20110139856A1
公开(公告)日：2011-06-16
申请号：US12964907
申请日：2010-12-10
申请人： Eiji SAKAMOTO , Shohei Hata
发明人： Eiji SAKAMOTO , Shohei Hata
IPC分类号： B23K31/02 , B23K35/14 , B23K20/24
CPC分类号： H01L24/29 , H01L23/488 , H01L23/49816 , H01L24/03 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/81 , H01L24/83 , H01L2224/0401 , H01L2224/04026 , H01L2224/05551 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/13099 , H01L2224/13101 , H01L2224/13688 , H01L2224/291 , H01L2224/29101 , H01L2224/29111 , H01L2224/32014 , H01L2224/32245 , H01L2224/81191 , H01L2224/81192 , H01L2224/81193 , H01L2224/81355 , H01L2224/81815 , H01L2224/8189 , H01L2224/81905 , H01L2224/83192 , H01L2224/83424 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/83801 , H01L2224/8389 , H01L2224/83905 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/10272 , H01L2924/1033 , H01L2924/157 , H01L2924/351 , H01L2924/00014 , H01L2924/00
摘要： A bonding structure that a bonding region can endure a high temperature environment and the bonding can be maintained with high reliability is provided as a bonding material capable of maintaining reliable bonding in high temperature environment in place of solder including Pb. In the bonding structure for a first member and a second member, solder and glass are used to bond the first member and the second member together and the glass seals the solder. Thereby, electrical conductivity is ensured and the outflow of melting solder in high temperatures can be inhibited to improve the durability.
摘要翻译：作为能够在高温环境下保持可靠的接合而代替含Pb的焊料的接合材料，可以提供接合区域能够耐受高温环境并且可以高可靠性地保持接合的接合结构。在第一构件和第二构件的接合结构中，使用焊料和玻璃将第一构件和第二构件结合在一起，并且玻璃密封焊料。由此，确保导电性，能够抑制高温熔融焊料的流出，提高耐久性。

10. 发明授权

US08449204B2 Optical module 失效
标题翻译：光模块
公开(公告)号：US08449204B2
公开(公告)日：2013-05-28
申请号：US13126898
申请日：2009-06-11
申请人： Toshiaki Takai , Yukio Sakigawa , Shohei Hata
发明人： Toshiaki Takai , Yukio Sakigawa , Shohei Hata
IPC分类号： G02B6/36 , G02B6/42
CPC分类号： G02B6/4246 , G02B6/29367 , H01S5/005 , H01S5/02212 , H01S5/02228 , H01S5/02284 , H01S5/02296 , H01S2301/176
摘要： An optical module in a simple configuration is provided which can suppress optical crosstalk due to leakage light without causing characteristics deterioration and reliability decrease of light-emitting elements to thereby obtain appropriate light receiving sensitivity. In an optical module in which a plurality of light-emitting elements 11 and light-receiving elements 12 are mounted on an optical-element mounting substrate 1, a light-absorbing resin 6 to absorb light with a light-emission wavelength of the light-emitting elements 11 is arranged to cover side surfaces of the light-emitting elements 11 and a non-adhesive layer 7 including a material not adhesive to the light-absorbing resin 6 is arranged between the light-absorbing resin 6 and the optical-element mounting substrate 1.
摘要翻译：提供一种简单结构的光模块，其可以抑制由于漏光引起的光串扰，而不会导致发光元件的特性劣化和可靠性降低，从而获得适当的光接收灵敏度。在其中多个发光元件11和光接收元件12安装在光学元件安装基板1上的光学模块中，用于吸收发光波长的光的光吸收树脂6，发光元件11布置成覆盖发光元件11的侧表面，并且在光吸收树脂6和光学元件安装之间布置有包括不与光吸收树脂6粘合的材料的非粘合层7 基板1。

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