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    • 7. 发明授权
    • Determination of waveguide parameters
    • 波导参数的确定
    • US07110900B2
    • 2006-09-19
    • US10820088
    • 2004-04-07
    • Frank AdlerEverhard Muyzert
    • Frank AdlerEverhard Muyzert
    • G01R23/16
    • G01V1/30
    • A method of determining at least one parameter of a waveguide (3) from wavefield data acquired from wave propagation in the waveguide including obtaining first and second dispersion curves (9a, 9b, 9c) in the frequency domain from the wavefield data. A frequency interval between the first dispersion curve and the second dispersion curve is found, and this is used in the determination of at least one parameter of the waveguide. The frequency separation Δƒ(V) between the first and second dispersion curves may be found at a particular value of the phase velocity V, and the thickness h of the waveguide can be found using: Δ ⁢ ⁢ f ⁡ ( V ) = c 1 2 ⁢ h ⁢ 1 - c 1 2 V 2 Here, c1 is the velocity of wave propagation in the waveguide. This may be found from the asymptotic velocity values of the dispersion curves.
    • 一种从波导中的波传播获得的波场数据中确定波导(3)的至少一个参数的方法,包括从波场数据获得频域中的第一和第二色散曲线(9a,9b,9c)。 找到第一色散曲线和第二色散曲线之间的频率间隔,并将其用于确定波导的至少一个参数。 可以在相速度V的特定值处找到第一和第二色散曲线之间的频率间隔Deltaf(V),并且可以使用以下方式找到波导的厚度h: Delta f = 1 2 1 > 这里,c 1是波导中波传播的速度。 这可以从色散曲线的渐近速度值找到。
        • 8. 发明授权
        • Method of checking electrical connections between a memory module and a semiconductor memory chip
        • 检查存储器模块和半导体存储器芯片之间的电连接的方法
        • US06836440B2
        • 2004-12-28
        • US10356921
        • 2003-01-30
        • Frank AdlerThomas HuberManfred Moser
        • Frank AdlerThomas HuberManfred Moser
        • G11C2900
        • G11C29/025G11C29/02G11C2207/105
        • Two methods check functional capability of electrical connections between address lines of a printed circuit board of a memory module and address line contacts of an integrated semiconductor memory chip mounted on the printed circuit board. Ruptured solder contacts are conventionally examined optically or investigated by electrical resistance measurements; however, the latter do not work in the case of memory modules with a number of semiconductor chips, the pin contacts of which are connected in parallel by the address lines. The methods make it possible to locate interrupted contacts on individual address lines by the indirect use of a write-read access to the semiconductor memory chip, specifically utilizing the misrouting of writing and reading commands produced by defective contact connections.
        • 两种方法检查存储器模块的印刷电路板的地址线和安装在印刷电路板上的集成半导体存储器芯片的地址线触点之间的电连接的功能性。 通常通过电阻测量光学地检查破裂的焊料接触点; 然而,后者在具有多个半导体芯片的存储器模块的情况下不起作用,其引脚触点由地址线并联连接。 这些方法可以通过间接使用对半导体存储器芯片的写入访问来定位各个地址线上的中断的触点,特别是利用写入和读取由缺陷接触连接产生的命令的错误路由。