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1. 发明申请

WO2013022477A3 LEAD CARRIER WITH MULTI-MATERIAL PRINT FORMED PACKAGE COMPONENTS 审中-公开
标题翻译：带有多种打印成型包装组件的导线架
公开(公告)号：WO2013022477A3
公开(公告)日：2013-05-16
申请号：PCT/US2012000345
申请日：2012-08-10
申请人： EOPLEX LTD , ROGREN PHILIP E
发明人： ROGREN PHILIP E
IPC分类号： H01L23/495
CPC分类号： H01L23/49541 , H01L21/4828 , H01L21/4832 , H01L21/568 , H01L23/3107 , H01L23/49548 , H01L23/49579 , H01L23/49582 , H01L24/97 , H01L2224/05553 , H01L2224/45144 , H01L2224/45147 , H01L2224/48247 , H01L2224/97 , H01L2924/01015 , H01L2924/01029 , H01L2924/01047 , H01L2924/181 , H01L2924/18301 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： A lead carrier provides support for a semiconductor device during manufacture. The lead carrier includes a temporary support member with multiple package sites. Each site includes a die attach pad surrounded by terminal pads. The pads are formed of multiple materials including a lower layer and a body portion. An upper layer can also be provided over the body portion. A chip is mounted upon the die pad and wire bonds extend from the chip to the terminal pads. These parts are all encapsulated within a mold compound. The body portion is preferably formed by providing a matrix of metal powder and a suspension medium at locations where the pads are to be located. Heat is applied to disperse the suspension medium and sinter the metal powder to form the body portion. After encapsulation the temporary support member can be peeled away and the package sites isolated from each other.
摘要翻译：引线载体在制造期间为半导体器件提供支持。引线架包括具有多个封装位置的临时支撑构件。每个站点都包括一个由端子焊盘包围的管芯连接焊盘。垫片由包括下层和主体部分的多种材料形成。也可以在身体部分上方设置上层。芯片安装在芯片焊盘上，引线键合从芯片延伸到端子焊盘。这些部件都被封装在模具化合物中。身体部分优选通过在垫位于的位置处提供金属粉末和悬浮介质的基体而形成。施加热量以分散悬浮介质并烧结金属粉末以形成主体部分。在封装之后，临时支撑构件可以被剥离并且包装位置彼此隔离。

2. 发明专利

PH12017502212A1 SOLID STATE BATTERY AND FABRICATION PROCESS THEREOF 未知
公开(公告)号：PH12017502212A1
公开(公告)日：2018-07-02
申请号：PH12017502212
申请日：2017-12-04
申请人： EOPLEX LTD
发明人： ROGREN PHILIP E
IPC分类号： H01M10/0562 , H01M4/13 , H01M4/36 , H01M4/74 , H01M10/0585
摘要： A solid state electrochemical cell structure includes at least one integrated anode - current collector structure having a counterpart integrated cathode - current collector structure separated by an electrolyte layer. An integrated anode or cathode - current collector structure can be fabricated as a generally planar or planar layer structure having a surface area greater or much greater than its thickness, and which carries anode or cathode material composition, respectively, in which a current collector layer is enveloped, embedded, or encased; or a porous 3D mesh current collector structure in which an anode material composition or cathode material composition, respectively is enveloped, embedded, or encased by way of residing within a void volume fraction of the 3D mesh current collector structure. Integrated anode - current collector structures, cathode - current collector structures, and electrolyte layers can be fabricated by way of an additive manufacturing process (e.g., 3D printing).

3. 发明专利

PH12017501997A1 LEAD CARRIER WITH PRINT FORMED PACKAGE COMPONENTS AND CONDUCTIVE PATH REDISTRIBUTION STRUCTURES 未知
公开(公告)号：PH12017501997A1
公开(公告)日：2018-03-26
申请号：PH12017501997
申请日：2017-11-02
申请人： EOPLEX LTD
发明人： ROGREN PHILIP E
IPC分类号： H01L23/28 , H01L23/48 , H01L23/495
摘要： A lead carrier includes a temporary support layer, member, medium, or carrier upon which are dispersed a plurality of package sites, organized in a predetermined pattern such as a matrix or array. Each package site within a continuous sheet of mold compound of the lead carrier includes a semiconductor die; a set of terminal structures, each having a top side and an opposing back side that is exposed at a back side of the continuous sheet of mold compound; and a set of electrical current path redistribution structures, each formed as an elongate wiring structure having a first end, a second end distinct from the first end, a top surface, an opposing bottom surface, a width, and a thickness between its top and bottom surfaces. Each redistribution structure as-fabricated is either electrically pre-coupled to a predetermined terminal structure, or electrically isolated from each terminal structure.

4. 发明申请

WO2013006209A3 LEAD CARRIER WITH THERMALLY FUSED PACKAGE COMPONENTS 审中-公开
标题翻译：引线载体，具有热熔封装组件
公开(公告)号：WO2013006209A3
公开(公告)日：2013-04-11
申请号：PCT/US2012000316
申请日：2012-07-03
申请人： EOPLEX LTD , ROGREN PHILIP E
发明人： ROGREN PHILIP E
IPC分类号： H01L23/498 , H01L23/495
CPC分类号： H01L21/4828 , H01L21/561 , H01L21/568 , H01L23/3107 , H01L23/49548 , H01L23/49582 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/92 , H01L24/97 , H01L2224/04042 , H01L2224/32245 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/4866 , H01L2224/48664 , H01L2224/48669 , H01L2224/48684 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/4886 , H01L2224/48864 , H01L2224/48869 , H01L2224/48884 , H01L2224/73265 , H01L2224/85207 , H01L2224/85424 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/85455 , H01L2224/8546 , H01L2224/85464 , H01L2224/85469 , H01L2224/85484 , H01L2224/92247 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2924/30107 , H01L2224/85 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A lead carrier provides support for a semiconductor device during manufacture. The lead carrier includes a temporary support member with multiple package sites. Each package site includes a die attach pad surrounded by a plurality of terminal pads. The pads are formed of a fusible fixing material on a lower portion. A chip is mounted upon the die attach pad and wire bonds extend from the chip to the terminal pads. The pads, chip and wire bonds are all encapsulated within a mold compound. The temporary support member can be heated above a melting temperature of the fusible fixing material and peeled away and then the individual package sites can be isolated from each other to provide completed packages including multiple surface mount joints for mounting within an electronics system board.
摘要翻译：引线载体在制造期间为半导体器件提供支撑。引导载体包括具有多个封装部位的临时支撑部件。每个封装部位包括由多个端子焊盘围绕的管芯附连焊盘。垫在下部由可熔固定材料形成。芯片安装在芯片连接焊盘上，引线键合从芯片延伸到端子焊盘。焊盘，芯片和引线键合都封装在模具化合物内。临时支撑构件可以被加热到易熔固定材料的熔化温度以上并且被剥离，然后各个封装位置可以彼此隔离以提供包括用于安装在电子系统板内的多个表面安装接头的完整封装。

5. 发明申请

WO2014037815A2 LEAD CARRIER WITH PRINT-FORMED TERMINAL PADS 审中-公开
标题翻译：带打印端子垫的导线架
公开(公告)号：WO2014037815A2
公开(公告)日：2014-03-13
申请号：PCT/IB2013002685
申请日：2013-09-05
申请人： EOPLEX LTD
发明人： ROGREN PHILIP E
CPC分类号： H01L23/495 , H01L21/4821 , H01L21/568 , H01L21/77 , H01L23/49541 , H01L23/49548 , H01L23/49579 , H01L24/97 , H01L2224/05553 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , H01L2924/18165 , H01L2924/00014 , H01L2924/00012
摘要： A lead carrier provides support for an integrated circuit chip and associated leads during manufacture as packages containing such chips. The lead carrier includes a temporary support member with multiple package sites. Each package site includes a plurality of terminal pads surrounding a die attach region. The pads are formed of sintered electrically conductive material. A chip is placed at the die attach region and wire bonds extend from the chip to the terminal pads. The pads, chip and wire bonds are all encapsulated within a mold compound. The temporary support member can be peeled away and then the individual package sites can be isolated from each other to provide completed packages including multiple surface mount joints for mounting within an electronic system board. Edges of the pads are contoured to cause the pads to engage with the mold compound to securely hold the pads within the package.
摘要翻译：引线载体在制造期间为集成电路芯片和相关引线提供支持，作为包含这种芯片的封装。引线架包括具有多个封装位置的临时支撑构件。每个封装部位包括围绕裸片附接区域的多个端子焊盘。焊盘由烧结的导电材料形成。芯片放置在芯片附着区域，引线键合从芯片延伸到端子焊盘。焊盘，芯片和引线键都被封装在模具化合物中。临时支撑构件可以被剥离，然后各个包装部位可以彼此隔离以提供完整的包装，包括用于安装在电子系统板内的多个表面安装接头。衬垫的边缘的轮廓是使衬垫与模具化合物接合以将衬垫牢固地保持在包装内。

7. 发明公开

EP2742528A4 LEAD CARRIER WITH MULTI-MATERIAL PRINT FORMED PACKAGE COMPONENTS 审中-公开
标题翻译： LEITUNGSTRÄGERMIT AUS MEHREREN MATERIALIEN DRUCKGEFORMTEN VERPACKUNGSBESTANDTEILEN
公开(公告)号：EP2742528A4
公开(公告)日：2015-03-25
申请号：EP12822250
申请日：2012-08-10
申请人： EOPLEX LTD
发明人： ROGREN PHILIP E
IPC分类号： H01L23/495 , H01L21/48 , H01L21/56
CPC分类号： H01L23/49541 , H01L21/4828 , H01L21/4832 , H01L21/568 , H01L23/3107 , H01L23/49548 , H01L23/49579 , H01L23/49582 , H01L24/97 , H01L2224/05553 , H01L2224/45144 , H01L2224/45147 , H01L2224/48247 , H01L2224/97 , H01L2924/01015 , H01L2924/01029 , H01L2924/01047 , H01L2924/181 , H01L2924/18301 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2924/00014

8. 发明专利

HK1247442A1 帶有印刷成形封裝部件和導電路徑再分布結構的引線載體未知
公开(公告)号：HK1247442A1
公开(公告)日：2018-09-21
申请号：HK18106944
申请日：2018-05-28
申请人： EOPLEX LTD
发明人： ROGREN PHILIP E
IPC分类号： H01L20060101

9. 发明专利

HK1247441A1 不具有裸片附接墊的引線載體結構和由此形成的封裝未知
公开(公告)号：HK1247441A1
公开(公告)日：2018-09-21
申请号：HK18106943
申请日：2018-05-28
申请人： EOPLEX LTD
发明人： ROGREN PHILIP E
IPC分类号： H01L20060101

10. 发明专利

PH12017501998A1 LEAD CARRIER STRUCTURE AND PACKAGES FORMED THEREFROM WITHOUT DIE ATTACH PADS 未知
公开(公告)号：PH12017501998A1
公开(公告)日：2018-03-26
申请号：PH12017501998
申请日：2017-11-02
申请人： EOPLEX LTD
发明人： ROGREN PHILIP E
IPC分类号： H01L21/60 , H01L23/48 , H01L23/49 , H01L23/495
摘要： A lead carrier includes a continuous sheet of mold compound having a top side and an opposing back side, and forms an array of package sites corresponding to semiconductor packages. Each package site when fabricated includes a semiconductor die having a top side, and an opposing treated base exposed at the back side of the continuous sheet of mold compound; a set of terminal pads, each having a top side and an opposing back side exposed at the back side of the continuous sheet of mold compound; a plurality of wire bonds formed between a set of input / output junctions on the top side of the semiconductor die and the top side of each terminal pad; and hardened mold compound encapsulating the semiconductor die, the set of terminal pads, and the plurality of wire bonds. Each package site excludes a die attach pad to which the semiconductor die is fixed.

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