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1. 发明申请

WO2003030223A3 SUBSTRATE PROCESSING APPARATUS AND METHOD 审中-公开
公开(公告)号：WO2003030223A3
公开(公告)日：2003-04-10
申请号：PCT/JP2002/009255
申请日：2002-09-11
申请人： EBARA CORPORATION , KOBATA, Itsuki , SHIRAKASHI, Mitsuhiko , KUMEKAWA, Masayuki , SAITO, Takayuki , TOMA, Yasushi , SUZUKI, Tsukuru , YAMADA, Kaoru , MAKITA, Yuji , YASUDA, Hozumi
发明人： KOBATA, Itsuki , SHIRAKASHI, Mitsuhiko , KUMEKAWA, Masayuki , SAITO, Takayuki , TOMA, Yasushi , SUZUKI, Tsukuru , YAMADA, Kaoru , MAKITA, Yuji , YASUDA, Hozumi
IPC分类号： C25D17/10
摘要： There is a provided a substrate processing apparatus that can perform an electrolytic processing, which is different from a common, conventional etching, to remove (clean off) a conductive material (film) formed on or adhering to a bevel portion, etc. of a substrate or process a peripheral portion of a substrate through an electrochemical action. The substrate processing apparatus includes: an electrode section having a plurality of electrodes which are laminated with insulators being interposed, and having a holding portion which is to be opposed to a peripheral portion of a substrate; an ion exchanger disposed in the holding portion of the electrode section; a liquid supply section for supplying a liquid to the holding position of the electrode section; and a power source for applying a voltage to the electrodes of the electrode section so that the electrodes alternately have different polarities.

2. 发明申请

WO2005090648A3 ELECTROLYTIC PROCESSING APPARATUS AND ELECTROLYTIC PROCESSING METHOD 审中-公开
公开(公告)号：WO2005090648A3
公开(公告)日：2005-09-29
申请号：PCT/JP2005/005301
申请日：2005-03-16
申请人： EBARA CORPORATION , NOJI, Ikutaro , YASUDA, Hozumi , IIZUMI, Takeshi , KOBATA, Itsuki , HIROKAWA, Kazuto , SAITO, Takayuki , SUZUKI, Tsukuru , TOMA, Yasushi , KODERA, Akira
发明人： NOJI, Ikutaro , YASUDA, Hozumi , IIZUMI, Takeshi , KOBATA, Itsuki , HIROKAWA, Kazuto , SAITO, Takayuki , SUZUKI, Tsukuru , TOMA, Yasushi , KODERA, Akira
IPC分类号： C25F3/00
摘要： An electrolytic processing apparatus can maintain a difference in electric resistance between a recessed portion and a raised portion in the surface of a workpiece, thereby providing a processed surface with improved flatness. The electrolytic processing apparatus including: a processing electrode capable of bringing into contact with or closing to a workpiece; a feeding electrode for feeding electricity to the workpiece; a contact member disposed between the workpiece and at least one of the processing electrode and the feeding electrode, the degree of deformation of said contact member by a contact load applied from the workpiece being smal

3. 发明申请

WO2004034452A1 ELECTROLYTIC PROCESSING APPARATUS 审中-公开
标题翻译：电解处理设备
公开(公告)号：WO2004034452A1
公开(公告)日：2004-04-22
申请号：PCT/JP2003/012651
申请日：2003-10-02
申请人： EBARA CORPORATION , TOMA, Yasushi , KOBATA, Itsuki
发明人： TOMA, Yasushi , KOBATA, Itsuki
IPC分类号： H01L21/3063
CPC分类号： C25F7/00 , B23H3/02 , B23H9/00
摘要： An electrolytic processing apparatus has at least one processing electrode (86) and at least feeding electrode (86) disposed on the same side as the processing electrode (86) with respect to a substrate (W). An organic compound having an ion exchange group is chemically bonded to at least one of a surface of the processing electrode (86) and a surface of the feeding electrode (86b) to form an ion exchanger (90). The electrolytic processing apparatus also has a substrate holder (42) for holding the substrate (W) and bringing the substrate (W) into contact with or close to the processing electrode (86). The electrolytic processing apparatus includes a power supply (48) for applying a voltage between the processing electrode (86) and the feeding electrode (86), and a fluid supply unit (92, 94) for supplying a fluid between the substrate (W) and the processing electrode (86).
摘要翻译：电解处理装置具有至少一个处理电极（86），并且至少馈送电极（86）相对于衬底（W）设置在与处理电极（86）相同的一侧上。具有离子交换基团的有机化合物与处理电极（86）的表面和供电电极（86b）的表面中的至少一个化学键合，形成离子交换体（90）。电解处理装置还具有用于保持基板（W）并使基板（W）与处理电极（86）接触或靠近的基板保持架（42）。电解处理装置包括用于在处理电极（86）和供电电极（86）之间施加电压的电源（48），以及用于在衬底（W）和衬底（W）之间提供流体的流体供应单元（92,94）和处理电极（86）。

4. 发明申请

WO2004097078A1 ELECTROLYTIC PROCESSING APPARATUS AND METHOD 审中-公开
标题翻译：电解处理设备和方法
公开(公告)号：WO2004097078A1
公开(公告)日：2004-11-11
申请号：PCT/JP2004/005766
申请日：2004-04-22
申请人： EBARA CORPORATION , MORI, Yuzo , KOBATA, Itsuki , TOMA, Yasushi
发明人： MORI, Yuzo , KOBATA, Itsuki , TOMA, Yasushi
IPC分类号： C25F7/00
CPC分类号： C25F7/00 , C25F3/00 , H01L21/32115
摘要： The present invention provides an electrolytic processing apparatus which can suppress the growth of a gas, which is inevitably generated during electrochemical processing, into bubbles thereby effectively preventing the formation of pits in a surface of a workpiece. The electrolytic processing apparatus includes an electrode section (44) including processing electrodes (76) and feeding electrodes (78) both having a diameter of not more than 1 mm, a substrate holder (42) for holding a workpiece (W), a power source (46) for applying a voltage between the processing electrodes and the feeding electrodes, a fluid supply section (72) for supplying a fluid between the electrode section and the workpiece, and a drive section (56, 62) for moving the electrode section and the workpiece relative to each other in such a manner that the processing electrodes pass every point in a processing surface of the workpiece.
摘要翻译：本发明提供一种电解处理装置，其可以将电化学处理中不可避免地产生的气体的生长抑制成气泡，从而有效地防止在工件的表面中形成凹坑。所述电解处理装置包括具有直径不大于1mm的处理电极（76）和馈电电极（78）的电极部（44），用于保持工件（W）的基板保持架（42）用于在处理电极和馈电电极之间施加电压的源极（46），用于在电极部分和工件之间提供流体的流体供应部分（72），以及用于使电极部分以及相对于彼此的工件，使得处理电极通过工件的处理表面中的每个点。

5. 发明申请

WO2003057948A1 ELECTROLYTIC PROCESSING APPARATUS AND METHOD 审中-公开
标题翻译：电解处理设备和方法
公开(公告)号：WO2003057948A1
公开(公告)日：2003-07-17
申请号：PCT/JP2003/000038
申请日：2003-01-07
申请人： EBARA CORPORATION , MORI, Yuzo , SHIRAKASHI, Mitsuhiko , KUMEKAWA, Masayuki , YASUDA, Hozumi , KOBATA, Itsuki , TOMA, Yasushi
发明人： MORI, Yuzo , SHIRAKASHI, Mitsuhiko , KUMEKAWA, Masayuki , YASUDA, Hozumi , KOBATA, Itsuki , TOMA, Yasushi
IPC分类号： C25F3/00
CPC分类号： B23H3/08 , B23H3/00 , B23H5/08 , C25F3/00 , C25F7/00
摘要： There is provided an electrolytic processing apparatus and method that can effect processing of a substrate with high processing precision and can produce an intended form of processed substrate with high accuracy of form. The electrolytic processing apparatus includes: a holder (30) for holding a substrate (W); a processing electrode (32) that can come close to the substrate; a feeding electrode (34) for feeding electricity to the substrate; an ion exchanger (40) disposed in the space between the substrate and the processing electrode, or the substrate and the feeding electrode; a fluid supply section (70) for supplying a fluid into the space; a power source (68) for applying a voltage between the processing electrode and the feeding electrode; a drive sections (44, 56 and 60) for allowing the substrate and the processing electrode, facing each other, to make a relative movement; and a numerical controller (72) for effecting a numerical control of the drive sections.
摘要翻译：提供了可以以高加工精度对基板进行加工的电解处理装置和方法，并且可以以高精度的形式产生预期形式的处理基板。电解处理装置包括：用于保持基板（W）的保持器（30）。可以靠近所述基板的处理电极（32）; 用于向基板供电的供电电极（34）; 设置在基板和处理电极之间的空间中的离子交换器（40），或基板和馈电电极; 用于将流体供应到所述空间中的流体供应部分（70）用于在所述处理电极和所述馈电电极之间施加电压的电源（68）; 用于允许基板和处理电极彼此面对的驱动部分（44,56和60）进行相对运动; 以及用于对驱动部进行数值控制的数值控制器（72）。

6. 发明申请

WO2003046263A1 METHOD AND DEVICE FOR REGENERATING ION EXCHANGER, AND ELECTROLYTIC PROCESSING APPARATUS 审中-公开
标题翻译：用于再生离子交换器的方法和装置，以及电解处理装置
公开(公告)号：WO2003046263A1
公开(公告)日：2003-06-05
申请号：PCT/JP2002/012519
申请日：2002-11-29
申请人： EBARA CORPORATION , SAITO, Takayuki , SUZUKI, Tsukuru , MAKITA, Yuji , YAMADA, Kaoru , SHIRAKASHI, Mitsuhiko , TOMA, Yasushi , KOBATA, Itsuki , KUMEKAWA, Masayuki , YASUDA, Hozumi , NABEYA, Osamu , HIROKAWA, Kazuto
发明人： SAITO, Takayuki , SUZUKI, Tsukuru , MAKITA, Yuji , YAMADA, Kaoru , SHIRAKASHI, Mitsuhiko , TOMA, Yasushi , KOBATA, Itsuki , KUMEKAWA, Masayuki , YASUDA, Hozumi , NABEYA, Osamu , HIROKAWA, Kazuto
IPC分类号： C25F3/00
CPC分类号： C25F3/00 , B01J49/30 , C25F7/00
摘要： There is provided a method and device for regenerating an ion exchanger which can regenerate an ion exchanger easily and quickly, and can minimize a load upon cleaning of the regenerated ion exchanger and disposal of waste liquid. A method for regenerating a contaminated ion exchanger includes: providing a pair of a regeneration electrode and a counter electrode, a partition disposed between the electrodes, and an electrode to be regenerated disposed between the counter electrode and the partition; and applying a voltage between the regeneration electrode and the coutner electrode while supplying a liquid between the partition and the regeneration electrode and also supplying a liquid between the partition and the counter electrode.
摘要翻译：提供了一种再生离子交换器的方法和装置，其可以容易且快速地再生离子交换器，并且可以最小化清洁再生离子交换器时的负载和废液的处理。再生污染离子交换器的方法包括：提供一对再生电极和对电极，设置在电极之间的隔板和设置在对电极和隔板之间的待再生电极; 并在再生电极和辅助电极之间施加电压，同时在隔板和再生电极之间供应液体，并且还在分隔件和对电极之间供应液体。

7. 发明申请

WO2003030223A2 SUBSTRATE PROCESSING APPARATUS AND METHOD 审中-公开
标题翻译：基板加工装置和方法
公开(公告)号：WO2003030223A2
公开(公告)日：2003-04-10
申请号：PCT/JP2002/009255
申请日：2002-09-11
申请人： EBARA CORPORATION , KOBATA, Itsuki , SHIRAKASHI, Mitsuhiko , KUMEKAWA, Masayuki , SAITO, Takayuki , TOMA, Yasushi , SUZUKI, Tsukuru , YAMADA, Kaoru , MAKITA, Yuji , YASUDA, Hozumi
发明人： KOBATA, Itsuki , SHIRAKASHI, Mitsuhiko , KUMEKAWA, Masayuki , SAITO, Takayuki , TOMA, Yasushi , SUZUKI, Tsukuru , YAMADA, Kaoru , MAKITA, Yuji , YASUDA, Hozumi
IPC分类号： H01L21/00
CPC分类号： H01L21/6708 , C25F3/00 , C25F7/00
摘要： There is a provided a substrate processing apparatus that can perform an electrolytic processing, which is different from a common, conventional etching, to remove (clean off) a conductive material (film) formed on or adhering to a bevel portion, etc. of a substrate or process a peripheral portion of a substrate through an electrochemical action. The substrate processing apparatus includes: an electrode section having a plurality of electrodes which are laminated with insulators being interposed, and having a holding portion which is to be opposed to a peripheral portion of a substrate; an ion exchanger disposed in the holding portion of the electrode section; a liquid supply section for supplying a liquid to the holding position of the electrode section; and a power source for applying a voltage to the electrodes of the electrode section so that the electrodes alternately have different polarities.
摘要翻译：提供了一种基板处理装置，其能够执行与普通的常规蚀刻不同的电解处理，以去除（清除）形成在或附着在斜面部分上的导电材料（膜）等通过电化学作用衬底或处理衬底的外围部分。基板处理装置包括：具有多个电极的电极部，该多个电极层叠有绝缘体，并且具有与基板的周边部相对的保持部; 设置在电极部的保持部中的离子交换部; 液体供应部分，用于将液体供应到电极部分的保持位置; 以及用于向电极部分的电极施加电压使得电极交替具有不同极性的电源。

8. 发明申请

WO2003029531A3 ELECTROLYTIC PROCESSING APPARATUS AND METHOD 审中-公开
公开(公告)号：WO2003029531A3
公开(公告)日：2003-04-10
申请号：PCT/JP2002/009256
申请日：2002-09-11
申请人： EBARA CORPORATION , KOBATA, Itsuki , SHIRAKASHI, Mitsuhiko , KUMEKAWA, Masayuki , SAITO, Takayuki , TOMA, Yasushi , SUZUKI, Tsukuru , YAMADA, Kaoru , MAKITA, Yuji , YASUDA, Hozumi , NOJI, Ikutaro , FUJIWARA, Kunio , NABEYA, Osamu
发明人： KOBATA, Itsuki , SHIRAKASHI, Mitsuhiko , KUMEKAWA, Masayuki , SAITO, Takayuki , TOMA, Yasushi , SUZUKI, Tsukuru , YAMADA, Kaoru , MAKITA, Yuji , YASUDA, Hozumi , NOJI, Ikutaro , FUJIWARA, Kunio , NABEYA, Osamu
IPC分类号： C25F1/00
摘要： There is provided an electrolytic processing apparatus and method which, while omitting a CMP treatment entirely or reducing a load upon a CMP treatment to the least possible extent, can process a conductive material formed in the surface of a substrate to flatten the material, or can remove (clean) extraneous matter adhering to the surface of a workpiece such as a substrate. The electrolytic processing apparatus includes: a pair of electrodes disposed at a given distance; an ion exchange disposed between the pair of electrodes; and a liquid supply section for supplying a liquid between the pair of electrodes. The electrolytic processing method includes: providing an electrode section having a pair of electrodes disposed at a given distance with an ion exchanger being interposed; and bringing the electrode into contact with or close to a workpiece while supplying a fluid to the ion exchanger, thereby processing the surface of the workpiece.

9. 发明申请

WO2003029531A2 ELECTROLYTIC PROCESSING APPARATUS AND METHOD 审中-公开
标题翻译：电解处理设备和方法
公开(公告)号：WO2003029531A2
公开(公告)日：2003-04-10
申请号：PCT/JP2002/009256
申请日：2002-09-11
申请人： EBARA CORPORATION , KOBATA, Itsuki , SHIRAKASHI, Mitsuhiko , KUMEKAWA, Masayuki , SAITO, Takayuki , TOMA, Yasushi , SUZUKI, Tsukuru , YAMADA, Kaoru , MAKITA, Yuji , YASUDA, Hozumi , NOJI, Ikutaro , FUJIWARA, Kunio , NABEYA, Osamu
发明人： KOBATA, Itsuki , SHIRAKASHI, Mitsuhiko , KUMEKAWA, Masayuki , SAITO, Takayuki , TOMA, Yasushi , SUZUKI, Tsukuru , YAMADA, Kaoru , MAKITA, Yuji , YASUDA, Hozumi , NOJI, Ikutaro , FUJIWARA, Kunio , NABEYA, Osamu
IPC分类号： C25F1/00
CPC分类号： B23H5/08 , C23F3/00 , C25F1/00 , C25F3/00 , C25F7/00 , H01L21/32115 , H01L21/32125 , H01L21/32134
摘要： There is provided an electrolytic processing apparatus and method which, while omitting a CMP treatment entirely or reducing a load upon a CMP treatment to the least possible extent, can process a conductive material formed in the surface of a substrate to flatten the material, or can remove (clean) extraneous matter adhering to the surface of a workpiece such as a substrate. The electrolytic processing apparatus includes: a pair of electrodes disposed at a given distance; an ion exchange disposed between the pair of electrodes; and a liquid supply section for supplying a liquid between the pair of electrodes. The electrolytic processing method includes: providing an electrode section having a pair of electrodes disposed at a given distance with an ion exchanger being interposed; and bringing the electrode into contact with or close to a workpiece while supplying a fluid to the ion exchanger, thereby processing the surface of the workpiece.
摘要翻译：提供了一种电解处理装置和方法，其可以在完全省略CMP处理或尽可能减少CMP处理时的负载的同时，处理形成在基板表面上的导电材料以使材料变平，或者可以去除（清洁）附着在诸如基板的工件的表面上的外来物质。电解处理装置包括：以一定距离设置的一对电极; 设置在所述一对电极之间的离子交换器; 以及用于在一对电极之间提供液体的液体供应部分。电解处理方法包括：提供具有一对电极的电极部分，所述电极部分设置在与离子交换器相隔一定距离处; 并且使电极与工件接触或接近工件，同时向离子交换器供应流体，从而处理工件的表面。

10. 发明申请

WO2002103771A1 ELECTROLYTIC PROCESSING DEVICE AND SUBSTRATE PROCESSING APPARATUS 审中-公开
标题翻译：电解处理装置和基板处理装置
公开(公告)号：WO2002103771A1
公开(公告)日：2002-12-27
申请号：PCT/JP2002/001545
申请日：2002-02-21
申请人： EBARA CORPORATION , KOBATA, Itsuki , SHIRAKASHI, Mitsuhiko , KUMEKAWA, Masayuki , SAITO, Takayuki , TOMA, Yasushi , SUZUKI, Tsukuru , YAMADA, Kaoru , MAKITA, Yuji
发明人： KOBATA, Itsuki , SHIRAKASHI, Mitsuhiko , KUMEKAWA, Masayuki , SAITO, Takayuki , TOMA, Yasushi , SUZUKI, Tsukuru , YAMADA, Kaoru , MAKITA, Yuji
IPC分类号： H01L21/306
CPC分类号： H01L21/6723 , B23H5/08 , C25F7/00 , H01L21/6708 , H01L21/67173
摘要： There is provided an electrolytic processing device including: a processing electrode brought into contact with or close to a workpiece; a feeding electrode for supplying electricity to the workpiece; an ion exchanger disposed in at least one of the spaces between the workpiece and the processing electrode, and between the workpiece and the feeding electrode; a power source for applying a voltage between the processing electrode and the feeding electrode; and a liquid supply section for supplying a liquid to the space between the workpiece and at least one of the processing electrode and the feeding electrode, in which the ion exchanger is present. A substrate processing apparatus having the electrolytic processing device is also provided.
摘要翻译：提供了一种电解处理装置，包括：与工件接触或接近工件的处理电极; 用于向工件供电的供电电极; 离子交换器，其设置在所述工件和所述处理电极之间的至少一个空间中，以及所述工件与所述供电电极之间; 用于在处理电极和馈电电极之间施加电压的电源; 以及液体供给部，用于将液体供给到工件与存在有离子交换器的处理电极和供电电极中的至少一个之间的空间。还提供了具有电解处理装置的基板处理装置。

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