专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08569856B2 Pad design for circuit under pad in semiconductor devices 有权
标题翻译：垫片设计用于半导体器件衬底下的电路
公开(公告)号：US08569856B2
公开(公告)日：2013-10-29
申请号：US13288731
申请日：2011-11-03
申请人： Yin Qian , Hsin-Chih Tai , Keh-Chiang Ku , Vincent Venezia , Duli Mao , Wei Zheng , Howard E. Rhodes
发明人： Yin Qian , Hsin-Chih Tai , Keh-Chiang Ku , Vincent Venezia , Duli Mao , Wei Zheng , Howard E. Rhodes
IPC分类号： H01L21/00
CPC分类号： H01L23/481 , H01L21/6835 , H01L23/522 , H01L24/05 , H01L27/14636 , H01L27/1464 , H01L2221/6835 , H01L2224/05548 , H01L2224/05553 , H01L2224/05567 , H01L2924/00014 , H01L2924/12043 , H01L2224/05552 , H01L2924/00
摘要： Embodiments of a semiconductor device that includes a semiconductor substrate and a cavity disposed in the semiconductor substrate that extends at least from a first side of the semiconductor substrate to a second side of the semiconductor substrate. The semiconductor device also includes an insulation layer disposed over the first side of the semiconductor substrate and coating sidewalls of the cavity. A conductive layer including a bonding pad is disposed over the insulation layer. The conductive layer extends into the cavity and connects to a metal stack disposed below the second side of the semiconductor substrate. A through silicon via pad is disposed below the second side of the semiconductor substrate and connected to the metal stack. The through silicon via pad is position to accept a through silicon via.
摘要翻译：半导体器件的实施例包括半导体衬底和设置在半导体衬底中的至少从半导体衬底的第一侧至半导体衬底的第二侧延伸的空腔。半导体器件还包括设置在半导体衬底的第一侧上并涂覆空腔的侧壁的绝缘层。包括接合焊盘的导电层设置在绝缘层上。导电层延伸到空腔中并且连接到设置在半导体衬底的第二侧下方的金属叠层。贯穿硅通孔焊盘设置在半导体衬底的第二侧下方并连接到金属堆叠。贯穿硅通孔焊盘的位置是接受硅通孔。

2. 发明申请

US20130092982A1 PARTIAL BURIED CHANNEL TRANSFER DEVICE FOR IMAGE SENSORS 有权
标题翻译：用于图像传感器的部分通道传输设备
公开(公告)号：US20130092982A1
公开(公告)日：2013-04-18
申请号：US13273026
申请日：2011-10-13
申请人： Gang Chen , Sing-Chung Hu , Hsin-Chih Tai , Duli Mao , Manoj Bikumandla , Wei Zheng , Yin Qian , Zhibin Xiong , Vincent Venezia , Keh-Chiang Ku , Howard E. Rhodes
发明人： Gang Chen , Sing-Chung Hu , Hsin-Chih Tai , Duli Mao , Manoj Bikumandla , Wei Zheng , Yin Qian , Zhibin Xiong , Vincent Venezia , Keh-Chiang Ku , Howard E. Rhodes
IPC分类号： H01L27/148 , H01L31/18 , H01L31/101
CPC分类号： H01L27/14616 , H01L27/14689
摘要： Embodiments of an image sensor pixel that includes a photosensitive element, a floating diffusion region, and a transfer device. The photosensitive element is disposed in a substrate layer for accumulating an image charge in response to light. The floating diffusion region is dispose in the substrate layer to receive the image charge from the photosensitive element. The transfer device is disposed between the photosensitive element and the floating diffusion region to selectively transfer the image charge from the photosensitive element to the floating diffusion region. The transfer device includes a buried channel device including a buried channel gate disposed over a buried channel dopant region. The transfer device also includes a surface channel device including a surface channel gate disposed over a surface channel region. The surface channel device is in series with the buried channel device. The surface channel gate has the opposite polarity of the buried channel gate.
摘要翻译：包括感光元件，浮动扩散区域和转印装置的图像传感器像素的实施例。感光元件设置在基板层中，用于响应于光积累图像电荷。浮动扩散区域设置在衬底层中以从感光元件接收图像电荷。转移装置设置在感光元件和浮动扩散区域之间以选择性地将图像电荷从感光元件转移到浮动扩散区域。传输装置包括掩埋沟道器件，其包括设置在掩埋沟道掺杂区域上的掩埋沟道栅极。转移装置还包括表面通道装置，其包括设置在表面通道区域上的表面通道门。表面通道装置与掩埋通道装置串联。表面沟道栅极具有与掩埋沟道栅极相反的极性。

3. 发明授权

US08405748B2 CMOS image sensor with improved photodiode area allocation 有权
标题翻译： CMOS图像传感器具有改进的光电二极管面积分配
公开(公告)号：US08405748B2
公开(公告)日：2013-03-26
申请号：US12837870
申请日：2010-07-16
申请人： Duli Mao , Hsin-Chih Tai , Vincent Venezia , Yin Qian , Howard E. Rhodes
发明人： Duli Mao , Hsin-Chih Tai , Vincent Venezia , Yin Qian , Howard E. Rhodes
IPC分类号： H04N3/14
CPC分类号： H04N5/3696 , H01L27/14621 , H01L27/1464 , H04N9/04
摘要： Embodiments of an apparatus comprising a pixel array comprising a plurality of macropixels. Each macropixel includes a pair of first pixels each including a color filter for a first color, the first color being one to which pixels are most sensitive, a second pixel including a color filter for a second color, the second color being one to which the pixels are least sensitive and a third pixel including a color filter for a third color, the third color being one to which pixels have a sensitivity between the least sensitive and the most sensitive, wherein the first pixels each occupy a greater proportion of the light-collection area of the macropixel than either the second pixel or the third pixel. Corresponding process and system embodiments are disclosed and claimed.
摘要翻译：包括包括多个宏像素的像素阵列的装置的实施例。每个宏像素包括一对第一像素，每个第一像素包括用于第一颜色的滤色器，第一颜色是像素最敏感的一个，第二像素包括用于第二颜色的滤色器，第二颜色是像素是最不灵敏的，并且第三像素包括用于第三颜色的滤色器，第三颜色是像素在最不灵敏和最敏感之间具有灵敏度的一个，其中第一像素每个占据较大比例的发光元件，大小像素的收集区域比第二像素还是第三像素。公开和要求保护相应的过程和系统实施例。

4. 发明授权

US08338856B2 Backside illuminated image sensor with stressed film 有权
标题翻译：具有应力膜的背面照明图像传感器
公开(公告)号：US08338856B2
公开(公告)日：2012-12-25
申请号：US12853803
申请日：2010-08-10
申请人： Hsin-Chih Tai , Howard E. Rhodes , Wei Zheng , Vincent Venezia , Yin Qian , Duli Mao
发明人： Hsin-Chih Tai , Howard E. Rhodes , Wei Zheng , Vincent Venezia , Yin Qian , Duli Mao
IPC分类号： H01L31/0328
CPC分类号： H01L27/1464 , H01L27/14621 , H01L27/14627 , H01L27/1463 , H01L27/14638
摘要： A backside illuminated (“BSI”) complementary metal-oxide semiconductor (“CMOS”) image sensor includes a photosensitive region disposed within a semiconductor layer and a stress adjusting layer. The photosensitive region is sensitive to light incident on a backside of the BSI CMOS image sensor to collect an image charge. The stress adjusting layer is disposed on a backside of the semiconductor layer to establish a stress characteristic that encourages photo-generated charge carriers to migrate towards the photosensitive region.
摘要翻译：背面照明（BSI）互补金属氧化物半导体（CMOS）图像传感器包括设置在半导体层和应力调整层内的感光区域。感光区域对入射到BSI CMOS图像传感器背面的光敏感，以收集图像电荷。应力调整层设置在半导体层的背面，以建立一种应力特性，该应力特性促使光生电荷载流子迁移到光敏区域。

5. 发明授权

US08330195B2 Multilayer image sensor pixel structure for reducing crosstalk 有权
标题翻译：用于减少串扰的多层图像传感器像素结构
公开(公告)号：US08330195B2
公开(公告)日：2012-12-11
申请号：US12967759
申请日：2010-12-14
申请人： Vincent Venezia , Ashish Shah , Rongsheng Yang , Duli Mao , Yin Qian , Hsin-Chih Tai , Howard E. Rhodes
发明人： Vincent Venezia , Ashish Shah , Rongsheng Yang , Duli Mao , Yin Qian , Hsin-Chih Tai , Howard E. Rhodes
IPC分类号： H01L31/062
CPC分类号： H01L27/1463 , H01L27/14601
摘要： An image sensor pixel includes a substrate, a first epitaxial layer, a collector layer, a second epitaxial layer and a light collection region. The substrate is doped to have a first conductivity type. The first epitaxial layer is disposed over the substrate and doped to have the first conductivity type as well. The collector layer is selectively disposed over at least a portion of the first epitaxial layer and doped to have a second conductivity type. The second epitaxial layer is disposed over the collector layer and doped to have the first conductivity type. The light collection region collects photo-generated charge carriers and is disposed within the second epitaxial layer. The light collection region is also doped to have the second conductivity type.
摘要翻译：图像传感器像素包括基板，第一外延层，集电极层，第二外延层和光收集区域。衬底被掺杂以具有第一导电类型。第一外延层设置在衬底上并掺杂以具有第一导电类型。集电极层选择性地设置在第一外延层的至少一部分上并被掺杂以具有第二导电类型。第二外延层设置在集电极层上并掺杂以具有第一导电类型。光收集区域收集光生电荷载流子并且设置在第二外延层内。光收集区域也被掺杂以具有第二导电类型。

6. 发明申请

US20120302000A1 LASER ANNEAL FOR IMAGE SENSORS 有权
标题翻译：激光雷达用于图像传感器
公开(公告)号：US20120302000A1
公开(公告)日：2012-11-29
申请号：US13566638
申请日：2012-08-03
申请人： Duli Mao , Hsin-Chih Tai , Vincent Venezia , Yin Qian , Howard E. Rhodes
发明人： Duli Mao , Hsin-Chih Tai , Vincent Venezia , Yin Qian , Howard E. Rhodes
IPC分类号： H01L31/0232
CPC分类号： H01L27/14698 , H01L27/14623 , H01L27/14627 , H01L27/1464 , H01L27/14643 , H01L27/14689
摘要： A technique for fabricating an image sensor including a pixel circuitry region and a peripheral circuitry region includes fabricating front side components on a front side of the image sensor. A dopant layer is implanted on a backside of the image sensor. A anti-reflection layer is formed on the backside and covers a first portion of the dopant layer under the pixel circuitry region while exposing a second portion of the dopant layer under the peripheral circuitry region. The first portion of the dopant layer is laser annealed from the backside of the image sensor through the anti-reflection layer. The anti-reflection layer increases a temperature of the first portion of the dopant layer during the laser annealing.
摘要翻译：一种用于制造包括像素电路区域和外围电路区域的图像传感器的技术包括在图像传感器的正面上制造前侧部件。掺杂剂层植入图像传感器的背面。在背面形成防反射层，并且在像素电路区域下方覆盖掺杂剂层的第一部分，同时在外围电路区域下方暴露掺杂剂层的第二部分。掺杂剂层的第一部分通过抗反射层从图像传感器的背面激光退火。抗反射层在激光退火期间增加掺杂剂层的第一部分的温度。

7. 发明申请

US20120282728A1 BACKSIDE ILLUMINATED IMAGING SENSOR WITH REINFORCED PAD STRUCTURE 有权
标题翻译：具有加强垫片结构的背面照明成像传感器
公开(公告)号：US20120282728A1
公开(公告)日：2012-11-08
申请号：US13554490
申请日：2012-07-20
申请人： Hsin-Chih Tai , Howard E. Rhodes , Duli Mao , Vincent Venezia , Yin Qian
发明人： Hsin-Chih Tai , Howard E. Rhodes , Duli Mao , Vincent Venezia , Yin Qian
IPC分类号： H01L31/02
CPC分类号： H01L24/05 , H01L27/14636 , H01L27/1464 , H01L27/14683 , H01L2224/02165 , H01L2224/04042 , H01L2224/05093 , H01L2224/05096 , H01L2224/05556 , H01L2224/05624 , H01L2224/05647 , H01L2224/05684 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327
摘要： A method of fabricating a backside illuminated imaging sensor that includes a device layer, a metal stack, and an opening is disclosed. The device layer has an imaging array formed in a front side of the device layer, where the imaging array is adapted to receive light from a back side of the device layer. The metal stack is coupled to the front side of the device layer and includes at least one metal interconnect layer having a metal pad. The opening extends from the back side of the device layer to the metal pad to expose the metal pad for wire bonding. The method includes depositing a film on the back side of the device layer and within the opening, then etching the film to form a frame within the opening to structurally reinforce the metal pad.
摘要翻译：公开了一种制造背面照明成像传感器的方法，其包括器件层，金属叠层和开口。器件层具有形成在器件层的前侧的成像阵列，其中成像阵列适于从器件层的背面接收光。金属叠层耦合到器件层的前侧，并且包括具有金属焊盘的至少一个金属互连层。开口从器件层的背面延伸到金属焊盘，露出用于引线接合的金属焊盘。该方法包括在器件层的背侧和开口内沉积薄膜，然后蚀刻薄膜以在开口内形成框架以在金属垫上结构地加固。

8. 发明申请

US20090302409A1 IMAGE SENSOR WITH MULTIPLE THICKNESS ANTI-RELFECTIVE COATING LAYERS 审中-公开
标题翻译：具有多个厚度抗反射涂层的图像传感器
公开(公告)号：US20090302409A1
公开(公告)日：2009-12-10
申请号：US12133299
申请日：2008-06-04
申请人： Yin Qian , Hsin-Chih Tai , Duli Mao , Vincent Venezia , Hidetoshi Nozaki , Howard E. Rhodes
发明人： Yin Qian , Hsin-Chih Tai , Duli Mao , Vincent Venezia , Hidetoshi Nozaki , Howard E. Rhodes
IPC分类号： H01L31/00 , H01L21/00
CPC分类号： H01L27/1463 , H01L27/1462 , H01L27/14621 , H01L27/14629 , H01L27/14645
摘要： An image sensor includes a substrate having a surface at which incident light is received. A pixel array is formed over and within the substrate. The pixel array includes a first and a second pixel arranged to receive light of different colors. The first pixel includes a photosensitive region formed in the substrate and has a first anti-reflective coating (ARC) layer formed over the photosensitive region. The first ARC layer has a first thickness that produces destructive interference above the first ARC layer in response to the incident light. The second pixel includes a photosensitive region formed in the substrate, and a second ARC layer formed over the photosensitive region that produces destructive interference above the second ARC layer in response to the incident light.
摘要翻译：图像传感器包括具有接收入射光的表面的基板。在衬底之上和之内形成像素阵列。像素阵列包括布置成接收不同颜色的光的第一和第二像素。第一像素包括形成在基板中并且在光敏区域上形成的第一抗反射涂层（ARC）层的感光区域。第一ARC层具有响应于入射光而在第一ARC层上方产生破坏性干扰的第一厚度。第二像素包括形成在基板中的感光区域和形成在光敏区域上的响应于入射光而在第二ARC层上方产生相消干涉的第二ARC层。

9. 发明申请

US20090200631A1 BACKSIDE ILLUMINATED IMAGING SENSOR WITH LIGHT ATTENUATING LAYER 审中-公开
标题翻译：背光照明成像传感器与光衰减层
公开(公告)号：US20090200631A1
公开(公告)日：2009-08-13
申请号：US12028733
申请日：2008-02-08
申请人： Hsin-Chih Tai , Howard E. Rhodes , Duli Mao , Vincent Venezia , Yin Qian
发明人： Hsin-Chih Tai , Howard E. Rhodes , Duli Mao , Vincent Venezia , Yin Qian
IPC分类号： H01L31/0216
CPC分类号： H01L27/1462 , H01L27/14603 , H01L27/14609 , H01L27/14621 , H01L27/14625 , H01L27/14627 , H01L27/1464
摘要： A backside illuminated imaging sensor includes a semiconductor substrate, a metal interconnect layer and a light attenuating layer. The semiconductor substrate has a front surface, a back surface, and includes at least one imaging pixel formed on the front surface of the semiconductor substrate. The metal interconnect layer is electrically coupled to the imaging pixel and the light attenuating layer is coupled between the metal interconnect layer and the front surface of the semiconductor substrate. In operation, the imaging pixel receives light from the back surface of the semiconductor substrate, where a portion of the received light propagates through the imaging pixel to the light attenuating layer. The light attenuating layer is configured to substantially attenuate the portion of light received from the imaging pixel.
摘要翻译：背面照明成像传感器包括半导体衬底，金属互连层和光衰减层。半导体衬底具有前表面，后表面，并且包括形成在半导体衬底的前表面上的至少一个成像像素。金属互连层电耦合到成像像素，并且光衰减层耦合在金属互连层和半导体衬底的前表面之间。在操作中，成像像素从半导体衬底的背表面接收光，其中一部分接收的光通过成像像素传播到光衰减层。光衰减层被配置为基本上衰减从成像像素接收的光的部分。

10. 发明申请

US20090200589A1 BACKSIDE ILLUMINATED IMAGING SENSOR WITH IMPROVED INFRARED SENSITIVITY 有权
标题翻译：具有改进的红外灵敏度的背面照明成像传感器
公开(公告)号：US20090200589A1
公开(公告)日：2009-08-13
申请号：US12203858
申请日：2008-09-03
申请人： Yin Qian , Howard E. Rhodes , Hsin-Chih Tai , Vincent Venezia , Duli Mao
发明人： Yin Qian , Howard E. Rhodes , Hsin-Chih Tai , Vincent Venezia , Duli Mao
IPC分类号： H01L31/112
CPC分类号： H01L27/14603 , H01L27/14621 , H01L27/14627 , H01L27/14632 , H01L27/14636 , H01L27/1464 , H01L27/14641 , H01L27/14647 , H01L27/14652
摘要： A backside illuminated imaging sensor includes a semiconductor layer and an infrared detecting layer. The semiconductor layer has a front surface and a back surface. An imaging pixel includes a photodiode region formed within the semiconductor layer. The infrared detecting layer is disposed above the front surface of the semiconductor layer to receive infrared light that propagates through the imaging sensor from the back surface of the semiconductor layer.
摘要翻译：背面照明成像传感器包括半导体层和红外检测层。半导体层具有前表面和后表面。成像像素包括形成在半导体层内的光电二极管区域。红外线检测层设置在半导体层的前表面上方，以从半导体层的背面接收从成像传感器传播的红外光。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式