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    • 2. 发明申请
    • CHIP-TYPE COIL COMPONENT
    • 芯片型线圈组件
    • US20120306607A1
    • 2012-12-06
    • US13466811
    • 2012-05-08
    • Dong Jin JEONGJin Ho KU
    • Dong Jin JEONGJin Ho KU
    • H01F27/29
    • H01F17/0013H01F2017/002H01F2017/0066
    • There is provided a chip-type coil component, including: a body formed by laminating a plurality of magnetic layers; external terminals formed on a surface of the body provided as a mounting surface among external surfaces of the body; a coil part including conductor patterns having a spiral structure in a lamination direction of the magnetic layers, the conductor patterns respectively formed on the magnetic layers; and lead-out parts formed in the lamination direction of the magnetic layers, and electrically connecting ends of the coil part and the external terminals, wherein the lead-out parts each include via conductors formed by penetrating the magnetic layers and via pads covering the via conductors while central lines of via conductors formed in adjacent magnetic layers are offset from each other.
    • 提供了一种芯片型线圈部件,包括:通过层叠多个磁性层而形成的主体; 形成在所述主体的表面上的外部端子,其设置在所述主体的外表面中作为安装表面; 线圈部分,其包括在磁性层的层叠方向上具有螺旋结构的导体图案,分别形成在磁性层上的导体图案; 以及在所述磁性层的层叠方向上形成的引出部分,以及所述线圈部分和所述外部端子的电连接端部,其中所述引出部分各自包括穿过所述磁性层形成的通孔导体和覆盖所述通孔的通孔焊盘 导体,而形成在相邻磁性层中的通孔导体的中心线彼此偏移。
    • 4. 发明申请
    • CHIP-TYPE COIL COMPONENT
    • 芯片型线圈组件
    • US20120274435A1
    • 2012-11-01
    • US13458842
    • 2012-04-27
    • Dong Jin JEONGJae Wook Lee
    • Dong Jin JEONGJae Wook Lee
    • H01F5/00
    • H01F27/292H01F17/0033
    • There is provided a chip-type coil component, including: a body formed by laminating a plurality of magnetic layers, and having a lower surface provided as a mounting area, an upper surface corresponding thereto, two end surfaces, and two lateral surfaces; conductor patterns formed on the magnetic layers, respectively, and connected to each other to have a coil structure; and external electrodes formed on at least one external surface of the body, and electrically connected to the conductor patterns, the external electrodes each being formed on the lower surface and spaced apart from edges thereof. Short circuits between electronic components may be prevented and sticking strength between the chip-type coil component and a substrate may be increased.
    • 提供了一种芯片型线圈部件,包括:通过层叠多个磁性层而形成的主体,并且具有设置为安装区域的下表面,与其对应的上表面,两个端表面和两个侧表面; 分别形成在磁性层上并且彼此连接以具有线圈结构的导体图案; 以及外部电极,其形成在所述主体的至少一个外表面上,并且电连接到所述导体图案,所述外部电极各自形成在所述下表面上并与其边缘间隔开。 可以防止电子部件之间的短路,并且可以增加芯片型线圈部件和基板之间的粘附强度。