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1. 发明申请

WO2018026771A1 GLASS-BASED ELECTRONICS PACKAGES AND METHODS OF FORMING THEREOF 审中-公开
标题翻译：基于玻璃的电子封装及其形成方法
公开(公告)号：WO2018026771A1
公开(公告)日：2018-02-08
申请号：PCT/US2017/044829
申请日：2017-08-01
申请人： CORNING INCORPORATED
发明人： POLLARD, Scott Christopher , SHOREY, Aric Bruce
IPC分类号： H01L23/15 , H01L23/498 , H01L21/48 , H01L21/683
摘要： Electronics packages that incorporate components such as glass-based interposer assemblies are disclosed, as well as methods of forming thereof. A method includes bonding a glass-based substrate to a carrier, applying a metallization layer and/or a dielectric layer over the glass-based substrate to obtain a layered structure bonded to the carrier, removing sections of the layered structure such that portions of the layered structure remain on the carrier with a space between each thereof, attaching one or more dies to the portions, dispensing an underfill material between the glass-based substrate and the dies to obtain assemblies bonded to the carrier, encapsulating the assemblies with a polymeric material to obtain encapsulated assemblies, removing the carrier from the encapsulated assemblies to expose a back side of the encapsulated assemblies, and applying second metallization layers and second dielectric layers over the back side of the encapsulated assemblies to form the glass-based structures.
摘要翻译：公开了包含诸如基于玻璃的中介层组件的组件的电子封装以及其形成方法。一种方法包括将基于玻璃的基板结合到载体，在玻璃基基板上施加金属化层和/或电介质层以获得结合到载体的分层结构，去除分层结构的部分，使得部分多层结构保留在载体上，其中每一个之间具有空间，将一个或多个管芯附接到所述部分，在玻璃基基板和管芯之间分配底部填充材料以获得结合到载体的组件，用聚合物材料以获得封装组件，从封装组件移除载体以暴露封装组件的背面，以及在封装组件的背面上施加第二金属化层和第二介电层以形成基于玻璃的结构。

2. 发明申请

WO2015116749A1 METHODS AND APPARATUS FOR PROVIDING AN INTERPOSER FOR INTERCONNECTING SEMICONDUCTOR CHIPS 审中-公开
标题翻译：提供用于互连半导体芯片的间隔器的方法和装置
公开(公告)号：WO2015116749A1
公开(公告)日：2015-08-06
申请号：PCT/US2015/013405
申请日：2015-01-29
申请人： CORNING INCORPORATED
发明人： CHAPARALA, Satish Chandra , POLLARD, Scott Christopher
IPC分类号： H01L23/15 , H01L23/498
CPC分类号： H01L23/49833 , H01L21/4857 , H01L23/15 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L23/49894 , H01L24/17 , H01L24/81 , H01L25/0655 , H01L25/0657 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/17181 , H01L2225/06513 , H01L2225/06517 , H01L2225/0652 , H01L2225/06548 , H01L2225/06572 , H01L2924/12042 , H01L2924/15311 , H01L2924/15788 , H05K1/0201 , H05K1/181 , H05K2201/068 , H01L2924/00
摘要： Methods and apparatus are provide for an interposer for interconnecting one or more semiconductor chips with an organic substrate in a semiconductor package, the interposer including: a first glass substrate having first and second opposing major surfaces, the first glass substrate having a first coefficient of thermal expansion (CTE1); a second glass substrate having first and second opposing major surfaces, the second glass substrate having a second coefficient of thermal expansion (CTE2); and an interface disposed between the first and second glass substrates and joining the second major surface of the first glass substrate to the first major surface of the second glass substrate, where CTE1 is less than CTE2, the first major surface of the first glass substrate operates to engage the one or more semiconductor chips, and the second major surface of the second glass substrate operates to engage the organic substrate.
摘要翻译：提供了用于将一个或多个半导体芯片与半导体封装中的有机衬底互连的插入件的方法和装置，所述插入器包括：具有第一和第二相对主表面的第一玻璃衬底，所述第一玻璃衬底具有第一热导率扩展（CTE1）; 具有第一和第二相对主表面的第二玻璃基板，所述第二玻璃基板具有第二热膨胀系数（CTE2）; 以及设置在第一和第二玻璃基板之间并且将第一玻璃基板的第二主表面接合到第二玻璃基板的第一主表面的接口，其中CTE1小于CTE2，第一玻璃基板的第一主表面操作以接合一个或多个半导体芯片，并且第二玻璃基板的第二主表面操作以接合有机基板。

3. 发明申请

WO2020163078A1 HERMETIC FULLY-FILLED METALLIZED THROUGH-HOLE VIAS 审中-公开
公开(公告)号：WO2020163078A1
公开(公告)日：2020-08-13
申请号：PCT/US2020/014501
申请日：2020-01-22
申请人： CORNING INCORPORATED
发明人： MAZUMDER, Prantik , OKORO, Chukwudi Azubuike , PARK, Ah-Young , POLLARD, Scott Christopher , SUBBAIYAN, Navaneetha Krishnan
IPC分类号： H01L21/48 , H01L23/15 , H01L23/498
摘要： According to various embodiments, an article comprises a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and a via extending through the substrate from the first major surface to the second major surface over an axial length, L, in an axial direction, the via defining an interior surface and a first axial portion, a third axial portion, and a second axial portion disposed between the first axial portion and the third axial portion along the axial direction. The article further comprises a helium hermetic adhesion layer disposed on the interior surface in at least the first axial portion and/or the third axial portion and a metal connector disposed within the via, wherein the metal connector is adhered to the helium hermetic adhesion layer. The metal connector fully fills the via over the axial length, L, of the via, the via has a maximum diameter, Φ max , of less than or equal to 30 pm, and the axial length, L, and the maximum diameter, Φ max , satisfy an equation:

4. 发明申请

WO2020101517A1 BACKLIGHT INCLUDING PATTERNED REFLECTORS AND METHOD FOR FABRICATING THE BACKLIGHT 审中-公开
公开(公告)号：WO2020101517A1
公开(公告)日：2020-05-22
申请号：PCT/RU2018/000738
申请日：2018-11-12
申请人： CORNING INCORPORATED , KISELEV, Fedor Dmitrievich
发明人： KISELEV, Fedor Dmitrievich , ALLEN, Kirk Richard , KUKSENKOV, Dmitri Vladislavovich , LYNN, Christopher Michael , MI, Xiang-Dong , POLLARD, Scott Christopher , TIMOFEEV, Nikolay Timofeyevich
IPC分类号： F21V8/00 , G02F1/1335
摘要： A backlight includes a substrate, a plurality of light sources, a reflective layer, a light guide plate, and a plurality of first patterned reflectors. The plurality of light sources are proximate the substrate. The reflective layer is on the substrate. The light guide plate is proximate the plurality of light sources. The light guide plate includes a pattern of light extractors. The plurality of first patterned reflectors are on the light guide plate. Each first patterned reflector is aligned with a corresponding light source.

5. 发明申请

WO2019199677A3 HERMETIC METALLIZED VIA WITH IMPROVED RELIABILITY 审中-公开
公开(公告)号：WO2019199677A3
公开(公告)日：2019-10-17
申请号：PCT/US2019/026342
申请日：2019-04-08
申请人： CORNING INCORPORATED
发明人： HUANG, Tian , KANUNGO, Mandakini , KUKSENKOVA, Ekaterina Aleksandrovna , MAZUMDER, Prantik , MOORE, Chad Byron , OKORO, Chukwudi Azubuike , PARK, Ah-Young , POLLARD, Scott Christopher , VADDI, Rajesh
IPC分类号： C03C17/06 , H01L23/15 , H01L23/498 , H01L21/768
摘要： An article includes a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and at least one via extending through the substrate from the first major surface to the second major surface over an axial length in an axial dimension. The article also includes a metal connector disposed within the via that hermetically seals the via. The article has a helium hermeticity of less than or equal to 1.0 x 10 8 atm-cc/s after 1000 thermal shock cycles, each of the thermal shock cycle comprises cooling the article to a temperature of -40 °C and heating the article to a temperature of 125 °C, and the article has a helium hermeticity of less than or equal to 1.0 x 10-8 atm-cc/s after 100 hours of HAST at a temperature of 130 °C and a relative humidity of 85%.

6. 发明申请

WO2020101946A1 BACKLIGHT INCLUDING PATTERNED REFLECTORS, DIFFUSER PLATE, AND METHOD FOR FABRICATING THE BACKLIGHT 审中-公开
公开(公告)号：WO2020101946A1
公开(公告)日：2020-05-22
申请号：PCT/US2019/059820
申请日：2019-11-05
申请人： CORNING INCORPORATED
发明人： ALLEN, Kirk Richard , KISELEV, Fedor Dmitrievich , KUKSENKOV, Dmitri Vladislavovich , LYNN, Christopher Michael , MAUREY, Pamela Arlene , MI, Xiang-Dong , POLLARD, Scott Christopher , TIMOFEEV, Nikolay Timofeyevich , VARANYTSIA, Andrii
IPC分类号： G02F1/1335 , G02B5/02 , G02B6/00 , G02F1/1334
摘要： A backlight includes a substrate, a plurality of light sources, a reflective layer, a light guide plate, a pattern of light extractors, a plurality of patterned reflectors, and a diffusive layer. The plurality of light sources are proximate the substrate. The reflective layer is on the substrate. The light guide plate is proximate the plurality of light sources. The pattern of light extractors is on the light guide plate. The plurality of patterned reflectors are on the light guide plate. Each patterned reflector is aligned with a corresponding light source. The diffusive layer is on the light guide plate.

7. 发明申请

WO2019195378A1 ELECTRONIC PACKAGES INCLUDING STRUCTURED GLASS ARTICLES AND METHODS FOR MAKING THE SAME 审中-公开
公开(公告)号：WO2019195378A1
公开(公告)日：2019-10-10
申请号：PCT/US2019/025518
申请日：2019-04-03
申请人： CORNING INCORPORATED
发明人： KIM, Jin Su , POLLARD, Scott Christopher
IPC分类号： C03C15/00 , H01L23/08 , C03C3/093 , C03C3/097 , C03C17/02 , B32B17/06
摘要： An electronic package assembly includes a glass substrate including an upper glass cladding layer, a lower glass cladding layer, a glass core layer coupled to the upper glass cladding layer and the lower glass cladding layer, where the upper glass cladding layer and the lower glass cladding layer have a higher etch rate in an etchant than the glass core layer, a first cavity positioned within one of the upper glass cladding layer or the lower glass cladding layer, and a second cavity positioned within one of the upper glass cladding layer or the lower glass cladding layer, a microprocessor positioned within the first cavity, and a micro-electronic component positioned within the second cavity.

8. 发明申请

WO2016073658A1 BOTTOM-UP ELECTROLYTIC VIA PLATING METHOD 审中-公开
标题翻译：底镀电镀方法
公开(公告)号：WO2016073658A1
公开(公告)日：2016-05-12
申请号：PCT/US2015/059126
申请日：2015-11-05
申请人： CORNING INCORPORATED
发明人： BELLMAN, Robert Alan , KEECH, John Tyler , KUKSENKOVA, Ekaterina Aleksandrovna , POLLARD, Scott Christopher
IPC分类号： H01L21/768 , H01L21/48 , H01L23/15
CPC分类号： H05K3/0094 , C25D1/04 , C25D5/022 , C25D7/123 , H01L21/486 , H01L21/76898 , H01L23/15 , H01L23/49827 , H01L2924/0002 , H05K3/423 , H01L2924/00
摘要： Disclosed herein is a bottom-up electrolytic via plating method wherein a first carrier substrate (100) and a second substrate (110) having at least one through-via (120) are temporarily bonded together. The method includes applying a seed layer (108) on a surface of the first substrate, forming a surface modification layer (114) on the seed layer or the second substrate, bonding the second substrate to the first substrate with the surface modification layer to create an assembly wherein the seed layer and the surface modification layer are disposed between the first and second substrates, applying conductive material (122) to the through-via, removing the second substrate having the through-via containing conductive material from the assembly.
摘要翻译：本文公开了一种自下而上的电解通孔电镀方法，其中具有至少一个贯通孔（120）的第一载体基板（100）和第二基板（110）暂时接合在一起。该方法包括在第一衬底的表面上施加种子层（108），在种子层或第二衬底上形成表面改性层（114），将第二衬底与表面改性层接合以形成第一衬底一种组件，其中种子层和表面改性层设置在第一和第二基底之间，将导电材料（122）施加到通孔，从组件移除具有包含导电材料的通孔的第二基底。

9. 发明申请

WO2021061481A1 VIAS INCLUDING CIRCUMFERENTIAL TRENCHES, INTERPOSER INCLUDING THE VIAS, AND METHOD FOR FABRICATING THE VIAS 审中-公开
公开(公告)号：WO2021061481A1
公开(公告)日：2021-04-01
申请号：PCT/US2020/051198
申请日：2020-09-17
申请人： CORNING INCORPORATED
发明人： FURNAS, William John , OKORO, Chukwudi Azubuike , PARK, Ah-Young , POLLARD, Scott Christopher
IPC分类号： H01L23/48 , H01L23/498 , H01L23/13 , H01L23/00
摘要： A via includes a substrate including a first surface and a second surface opposite to the first surface, an electrically conductive material, and a first circumferential trench. The substrate includes a through-hole extending from the first surface to the second surface. The electrically conductive material extends through the through-hole. The first circumferential trench extends partially into the substrate from the first surface and extends around and is spaced apart from the through-hole.

10. 发明申请

WO2020214047A1 BACKLIGHT INCLUDING PATTERNED REFLECTORS AND METHOD FOR FABRICATING THE BACKLIGHT 审中-公开
公开(公告)号：WO2020214047A1
公开(公告)日：2020-10-22
申请号：PCT/RU2019/000250
申请日：2019-04-15
申请人： CORNING INCORPORATED
发明人： ALLEN, Kirk Richard , KUKSENKOV, Dmitri Vladislavovich , LYNN, Christopher Michael , MI, Xiang-Dong , POLLARD, Scott Christopher , TIMOFEEV, Nikolay Timofeyevich , KISELEV, Fedor Dmitrievich
IPC分类号： G02F1/1335
摘要： A backlight (100) includes a substrate (102), a plurality of light sources (106), a reflective layer (104), a light guide plate (108), and a plurality of first patterned reflectors (112). The plurality of light sources (106) are proximate the substrate (102). The reflective layer (104) is on the substrate (102). The light guide plate (108) is proximate the plurality of light sources (106). The light guide plate (108) includes a pattern of light extractors (110). The plurality of first patterned reflectors (112) are on the light guide plate (108). Each first patterned reflector (112) is aligned with a corresponding light source (106).

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