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1. 发明授权

US08226054B2 Display frame and support unit thereof 有权
标题翻译：显示框架及其支撑单元
公开(公告)号：US08226054B2
公开(公告)日：2012-07-24
申请号：US12906329
申请日：2010-10-18
申请人： Chun-Lung Chen , Chien-Cheng Yeh , Yen-Chou Chen
发明人： Chun-Lung Chen , Chien-Cheng Yeh , Yen-Chou Chen
IPC分类号： F16M11/00
CPC分类号： F16M13/005 , F16M11/10 , F16M2200/041 , Y10S248/917 , Y10T16/5403
摘要： A support unit of photo-frame-type display includes a connecting base unit, at least one pivoting unit fixed to the connecting base unit, a supporting housing and a rebounding module received in the supporting housing. The connecting base unit is mounted to the back of a display frame unit. The pivoting unit includes an axle shaft, a frictional washer-assembly, a spool member fixedly installed on the axle shaft, and a tension-connecting element. A tension-connecting element has one end fixed in the spool member and wound around the spool member, and one bottom end connected to the rebounding module. The frictional washer-assembly provides frictional force between the connecting base unit and the supporting housing. The rebounding module includes at least one elastic element. The present disclosure is capable of steadily sustaining the display frame unit in a steep inclining configuration suitable for touch-screen/handwriting operations.
摘要翻译：照相框型显示器的支撑单元包括连接基座单元，固定到连接基座单元的至少一个枢转单元，支撑壳体和容纳在支撑壳体中的弹回模块。连接基座安装在显示框架单元的背面。枢转单元包括车轴，摩擦垫圈组件，固定地安装在车轴上的卷轴构件和张力连接元件。张力连接元件的一端固定在卷轴构件中并卷绕在卷轴构件上，一个底端连接到回弹模块。摩擦垫圈组件在连接基座单元和支撑壳体之间提供摩擦力。弹回模块包括至少一个弹性元件。本公开能够以适合于触摸屏/手写操作的陡倾斜构造稳定地维持显示框单元。

2. 发明申请

US20120090212A1 DISPLAY FRAME AND SUPPORT UNIT THEREOF 有权
标题翻译：显示框和支持单元
公开(公告)号：US20120090212A1
公开(公告)日：2012-04-19
申请号：US12906329
申请日：2010-10-18
申请人： Chun-Lung Chen , Chien-Cheng Yeh , Yen-Chou Chen
发明人： Chun-Lung Chen , Chien-Cheng Yeh , Yen-Chou Chen
IPC分类号： A47G1/16
CPC分类号： F16M13/005 , F16M11/10 , F16M2200/041 , Y10S248/917 , Y10T16/5403
摘要： A support unit of photo-frame-type display includes a connecting base unit, at least one pivoting unit fixed to the connecting base unit, a supporting housing and a rebounding module received in the supporting housing. The connecting base unit is mounted to the back of a display frame unit. The pivoting unit includes an axle shaft, a frictional washer-assembly, a spool member fixedly installed on the axle shaft, and a tension-connecting element. A tension-connecting element has one end fixed in the spool member and wound around the spool member, and one bottom end connected to the rebounding module. The frictional washer-assembly provides frictional force between the connecting base unit and the supporting housing. The rebounding module includes at least one elastic element. The present disclosure is capable of steadily sustaining the display frame unit in a steep inclining configuration suitable for touch-screen/handwriting operations.
摘要翻译：照相框型显示器的支撑单元包括连接基座单元，固定到连接基座单元的至少一个枢转单元，支撑壳体和容纳在支撑壳体中的弹回模块。连接基座安装在显示框架单元的背面。枢转单元包括车轴，摩擦垫圈组件，固定地安装在车轴上的卷轴构件和张力连接元件。张力连接元件的一端固定在卷轴构件中并卷绕在卷轴构件上，一个底端连接到回弹模块。摩擦垫圈组件在连接基座单元和支撑壳体之间提供摩擦力。弹回模块包括至少一个弹性元件。本公开能够以适合于触摸屏/手写操作的陡倾斜构造稳定地维持显示框单元。

3. 发明授权

US08735301B2 Method for manufacturing semiconductor integrated circuit 有权
标题翻译：半导体集成电路制造方法
公开(公告)号：US08735301B2
公开(公告)日：2014-05-27
申请号：US13114053
申请日：2011-05-24
申请人： Chun-Lung Chen
发明人： Chun-Lung Chen
IPC分类号： H01L21/033 , H01L21/768
CPC分类号： H01L21/31144 , H01L21/31138 , H01L21/76811
摘要： A method for manufacturing a semiconductor integrated circuit includes providing a substrate having at least a metal hard mask formed thereon. Subsequently a patterning step is performed to the metal hard mask to form a patterned metal hard mask and followed by performing a H2O plasma treatment to the patterned metal hard mask.
摘要翻译：一种制造半导体集成电路的方法包括提供至少形成有金属硬掩模的基板。随后，对金属硬掩模进行图案化步骤以形成图案化的金属硬掩模，然后对图案化的金属硬掩模进行H 2 O等离子体处理。

4. 发明授权

US07780125B2 Support frame for a variety kinds of display devices 有权
标题翻译：支持各种显示设备的框架
公开(公告)号：US07780125B2
公开(公告)日：2010-08-24
申请号：US12172695
申请日：2008-07-14
申请人： Ching-Hui Yen , Chun-Lung Chen
发明人： Ching-Hui Yen , Chun-Lung Chen
IPC分类号： A47F5/00
CPC分类号： F16M11/24 , F16M11/10 , F16M11/2021 , F16M2200/041 , Y10S248/917 , Y10S248/92
摘要： A support frame for a variety of display devices includes a base, a frame, a sliding part, and a rotation part. The frame is located on the base and has a receiving portion and at least one friction enhancer located in the receiving portion. The sliding part can slide upwards or downwards is located at the frame. The rotation part, pivoted with the sliding part, rotates between a fixed location and a release location; and furthermore has a leaning portion that extends into the receiving portion of the frame. When the rotation part is located at the fixed location, the leaning portion tightly leans against the friction enhancer so that the display device is positioned at the frame. When the rotation part is located at the release location, there is a distance between the leaning portion and the friction enhancer so that the display device can slide upwards or downwards.
摘要翻译：用于各种显示装置的支撑框架包括基座，框架，滑动部件和旋转部件。框架位于基座上并具有容纳部分和位于接收部分中的至少一个摩擦增强器。滑动部件可以向上或向下滑动位于框架上。旋转部分与滑动部分枢转，在固定位置和释放位置之间旋转; 并且还具有延伸到框架的接收部分中的倾斜部分。当旋转部位于固定位置时，倾斜部紧紧靠在摩擦增强器上，使得显示装置位于框架上。当旋转部位于释放位置时，倾斜部分和摩擦增强器之间存在一定距离，使得显示装置可以向上或向下滑动。

5. 发明授权

US07389862B2 Continuously adjustable rotation device 失效
标题翻译：连续可调的旋转装置
公开(公告)号：US07389862B2
公开(公告)日：2008-06-24
申请号：US11271909
申请日：2005-11-14
申请人： Chun-Lung Chen , Yu-Sheng Chen , Chien-Lin Chen
发明人： Chun-Lung Chen , Yu-Sheng Chen , Chien-Lin Chen
IPC分类号： F16D11/06
CPC分类号： B25B13/461
摘要： A continuously adjustable rotation device includes a base, a first connection element combined with the base, a ring buckle, a transmission disc, a second connection element, and a rotation controller. The transmission disc is formed on the contacting portion of the base, forming an inclination angle and contacting the second connection element for transmission of force. By using the rotation controller, one can select a rotation direction by properly contacting with the transmission disc. When the rotation direction is selected, the second connection element and the transmission disc then drive the first connection element to rotate in the designated direction. One can thus perform a continuously adjustable rotation. Therefore, no alignment is needed when assembling the rotation device, which will enhance the production yield and lower the manufacturing cost.
摘要翻译：连续可调的旋转装置包括基座，与基座结合的第一连接元件，环扣，传动盘，第二连接元件和旋转控制器。传动盘形成在基座的接触部分上，形成倾斜角并与第二连接元件接触以传递力。通过使用旋转控制器，可以通过与传输盘正确接触来选择旋转方向。当选择旋转方向时，第二连接元件和传输盘然后驱动第一连接元件沿指定的方向旋转。因此可以执行连续可调的旋转。因此，在组装旋转装置时不需要对准，这将提高生产成本并降低制造成本。

6. 发明授权

US07364948B2 Method for fabricating semiconductor package 有权
标题翻译：制造半导体封装的方法
公开(公告)号：US07364948B2
公开(公告)日：2008-04-29
申请号：US11649422
申请日：2007-01-03
申请人： Jeng-Yuan Lai , Chun-Lung Chen
发明人： Jeng-Yuan Lai , Chun-Lung Chen
IPC分类号： H01L21/00
CPC分类号： H01L23/3128 , H01L21/561 , H01L21/565 , H01L23/4951 , H01L23/49816 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2224/06136 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/4826 , H01L2224/4911 , H01L2224/73215 , H01L2224/83192 , H01L2224/92147 , H01L2224/97 , H01L2924/00014 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/18165 , H01L2924/19107 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012
摘要： A semiconductor package and a fabrication method thereof are proposed. A lead frame is provided between a chip and a substrate in a window ball grid array semiconductor package, wherein an active surface of the chip is electrically connected to the lead frame via bonding wires formed in an opening of the substrate and is electrically connected to the substrate via the lead frame. The provision of lead frame can improve the heat dissipating efficiency and electrical performances. The bonding wires located in the opening of the substrate eliminate the prior-art drawback of requiring different molds in response to different opening structures of a substrate.
摘要翻译：提出了半导体封装及其制造方法。在窗玻璃阵列半导体封装中的芯片和基板之间设置引线框架，其中芯片的有源表面通过形成在基板的开口中的接合线电连接到引线框架，并且电连接到基板通过引线框架。提供引线框架可以提高散热效率和电气性能。位于基板开口中的接合线消除了现有技术的缺点，即要求不同的模具响应衬底的不同开口结构。

7. 发明申请

US20070108592A1 Method for fabricating semiconductor package 有权
标题翻译：制造半导体封装的方法
公开(公告)号：US20070108592A1
公开(公告)日：2007-05-17
申请号：US11649422
申请日：2007-01-03
申请人： Jeng-Yuan Lai , Chun-Lung Chen
发明人： Jeng-Yuan Lai , Chun-Lung Chen
IPC分类号： H01L23/12 , H01L21/44
CPC分类号： H01L23/3128 , H01L21/561 , H01L21/565 , H01L23/4951 , H01L23/49816 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2224/06136 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/4826 , H01L2224/4911 , H01L2224/73215 , H01L2224/83192 , H01L2224/92147 , H01L2224/97 , H01L2924/00014 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/18165 , H01L2924/19107 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012
摘要： A semiconductor package and a fabrication method thereof are proposed. A lead frame is provided between a chip and a substrate in a window ball grid array semiconductor package, wherein an active surface of the chip is electrically connected to the lead frame via bonding wires formed in an opening of the substrate and is electrically connected to the substrate via the lead frame. The provision of lead frame can improve the heat dissipating efficiency and electrical performances. The bonding wires located in the opening of the substrate eliminate the prior-art drawback of requiring different molds in response to different opening structures of a substrate.
摘要翻译：提出了半导体封装及其制造方法。在窗玻璃阵列半导体封装中的芯片和基板之间设置引线框架，其中芯片的有源表面通过形成在基板的开口中的接合线电连接到引线框架，并且电连接到基板通过引线框架。提供引线框架可以提高散热效率和电气性能。位于基板开口中的接合线消除了现有技术的缺点，即要求不同的模具响应衬底的不同开口结构。

8. 发明授权

US07199453B2 Semiconductor package and fabrication method thereof 有权
标题翻译：半导体封装及其制造方法
公开(公告)号：US07199453B2
公开(公告)日：2007-04-03
申请号：US11041764
申请日：2005-01-24
申请人： Jeng-Yuan Lai , Chun-Lung Chen
发明人： Jeng-Yuan Lai , Chun-Lung Chen
IPC分类号： H01L23/495
CPC分类号： H01L23/3128 , H01L21/561 , H01L21/565 , H01L23/4951 , H01L23/49816 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2224/06136 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/4826 , H01L2224/4911 , H01L2224/73215 , H01L2224/83192 , H01L2224/92147 , H01L2224/97 , H01L2924/00014 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/18165 , H01L2924/19107 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012
摘要： A semiconductor package and a fabrication method thereof are proposed. A lead frame is provided between a chip and a substrate in a window ball grid array semiconductor package, wherein an active surface of the chip is electrically connected to the lead frame via bonding wires formed in an opening of the substrate and is electrically connected to the substrate via the lead frame. The provision of lead frame can improve the heat dissipating efficiency and electrical performances. The bonding wires located in the opening of the substrate eliminate the prior-art drawback of requiring different molds in response to different opening structures of a substrate.
摘要翻译：提出了半导体封装及其制造方法。在窗玻璃阵列半导体封装中的芯片和基板之间设置引线框架，其中芯片的有源表面通过形成在基板的开口中的接合线电连接到引线框架，并且电连接到基板经由引线框架。提供引线框架可以提高散热效率和电气性能。位于基板开口中的接合线消除了现有技术的缺点，即要求不同的模具响应衬底的不同开口结构。

9. 发明申请

US20060118941A1 Semiconductor package and fabrication method thereof 有权
标题翻译：半导体封装及其制造方法
公开(公告)号：US20060118941A1
公开(公告)日：2006-06-08
申请号：US11041764
申请日：2005-01-24
申请人： Jeng-Yuan Lai , Chun-Lung Chen
发明人： Jeng-Yuan Lai , Chun-Lung Chen
IPC分类号： H01L23/04
CPC分类号： H01L23/3128 , H01L21/561 , H01L21/565 , H01L23/4951 , H01L23/49816 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2224/06136 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/4826 , H01L2224/4911 , H01L2224/73215 , H01L2224/83192 , H01L2224/92147 , H01L2224/97 , H01L2924/00014 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/18165 , H01L2924/19107 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012
摘要： A semiconductor package and a fabrication method thereof are proposed. A lead frame is provided between a chip and a substrate in a window ball grid array semiconductor package, wherein an active surface of the chip is electrically connected to the lead frame via bonding wires formed in an opening of the substrate and is electrically connected to the substrate via the lead frame. The provision of lead frame can improve the heat dissipating efficiency and electrical performances. The bonding wires located in the opening of the substrate eliminate the prior-art drawback of requiring different molds in response to different opening structures of a substrate.
摘要翻译：提出了半导体封装及其制造方法。在窗玻璃阵列半导体封装中的芯片和基板之间设置引线框架，其中芯片的有源表面通过形成在基板的开口中的接合线电连接到引线框架，并且电连接到基板通过引线框架。提供引线框架可以提高散热效率和电气性能。位于基板开口中的接合线消除了现有技术的缺点，即要求不同的模具响应衬底的不同开口结构。

10. 发明授权

US06200886B1 Fabricating process for polysilicon gate 失效
标题翻译：多晶硅门的制造工艺
公开(公告)号：US06200886B1
公开(公告)日：2001-03-13
申请号：US09428353
申请日：1999-10-28
申请人： Hong-Chen Yu , Hsi-Mao Hsiao , Hsi-Chin Lin , Chun-Lung Chen
发明人： Hong-Chen Yu , Hsi-Mao Hsiao , Hsi-Chin Lin , Chun-Lung Chen
IPC分类号： H01L214763
CPC分类号： H01L21/28247 , H01L29/66545
摘要： A fabrication process for a polysilicon gate is described in which a silicon dioxide layer of various thicknesses is formed on the substrate and on the polysilicon gate with an overlying anti-reflection layer. The silicon dioxide layer is removed with enough silicon dioxide layer remaining to cover the sidewalls of the polysilicon gate and the silicon substrate before the removal of the anti-reflection layer. The sidewalls of the polysilicon gate and the silicon substrate are thus simultaneously protected during the removal of the anti-reflection layer.
摘要翻译：描述了一种用于多晶硅栅极的制造工艺，其中在衬底上和多晶硅栅极上形成了具有上覆抗反射层的各种厚度的二氧化硅层。在除去抗反射层之前，剩下足够的二氧化硅层以覆盖多晶硅栅极和硅衬底的侧壁，去除二氧化硅层。因此，在去除抗反射层期间同时保护多晶硅栅极和硅衬底的侧壁。

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