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1. 发明专利

JP2014057074A Condensation reaction product for filling polysiloxane-based trench and method for manufacturing trench filling film 有权
标题翻译：用于填充基于聚硅氧烷的凝胶的凝结反应产物和用于制造TRENCH填充膜的方法
公开(公告)号：JP2014057074A
公开(公告)日：2014-03-27
申请号：JP2013207722
申请日：2013-10-02
申请人： Asahi Kasei E-Materials Corp , 旭化成イーマテリアルズ株式会社
发明人： MISHIMA REIKO , SAITO HIDEO , TAKADA SHOZO
IPC分类号： H01L21/316 , B82Y30/00 , C08G77/44 , H01L21/76
摘要： PROBLEM TO BE SOLVED: To provide: a condensation reaction product for filling a trench, a solution of which having good storage stability, the solution being suitable for using for filling the trench formed in a substrate with silicon oxide, having high filling performance, permitting formation of a thick film, and having good crack resistance; and a method for manufacturing a trench filling film.SOLUTION: A condensation reaction product for filling a trench contains a condensation reaction product of a polysiloxane compound and silica particles, and a mixed solvent or an organic solvent (C), the mixed solvent comprising an organic solvent (A) having a vapor pressure of 530 Pa or above at 20°C and a boiling point of 80°C or above and below 130°C and an organic solvent (B) having a vapor pressure of below 530 Pa at 20°C and a boiling point of 130°C or above and 200°C or below, and the organic solvent (C) having a vapor pressure of 530 Pa or above at 20°C and a boiling point of 130°C or above and 200°C or below.
摘要翻译：要解决的问题：提供：用于填充沟槽的缩合反应产物，其溶液具有良好的储存稳定性，该溶液适合于用氧化硅填充形成在衬底中的沟槽，具有高填充性能，允许形成厚膜，具有良好的抗裂性; 和沟槽填充膜的制造方法。解决方案：用于填充沟槽的缩合反应产物包含聚硅氧烷化合物和二氧化硅颗粒以及混合溶剂或有机溶剂（C）的缩合反应产物，所述混合溶剂包含在20℃，沸点为80℃以上且低于130℃下蒸气压为530Pa以上的有机溶剂（A）和在20℃下蒸气压低于530Pa的有机溶剂（B）和沸点为130℃以上且200℃以下的蒸发压为530Pa以上，沸点为130℃以上的有机溶剂（C）和 200℃以下。

2. 发明专利

JP2013163789A Photosensitive silicone resin composition 审中-公开
标题翻译：感光硅树脂组合物
公开(公告)号：JP2013163789A
公开(公告)日：2013-08-22
申请号：JP2012028762
申请日：2012-02-13
申请人： Asahi Kasei E-Materials Corp , 旭化成イーマテリアルズ株式会社
发明人： TSUGANE NATSUMI , SAITO HIDEO , KUSAKABE TORU
IPC分类号： C08F299/08 , C08F290/06 , C08G77/44 , C08K5/00 , C08L83/04 , C08L83/10 , G02B1/04
摘要： PROBLEM TO BE SOLVED: To provide a resin composition providing a resin cured material having good crack resistance when molded in a thick film, and having a high hardness.SOLUTION: A photosensitive silicone resin composition contains a silica particle-containing silicone resin (A), a silicone resin (B), and a photopolymerization initiator (C), wherein one or both of the silica particle-containing silicone resin (A) and the silicone resin (B) have a photopolymerizable functional group. In a specific embodiment, the silica particle-containing silicone resin (A) is a condensation reaction product of a specific silane compound and a polysiloxane compound (a) which is a hydrolysis condensation product of the silane compound with a silica particle (b), or a condensation reaction product of the polysiloxane compound (a) with the silica particle (b), or a combination thereof, and the silicone resin (B) is the polysiloxane compound (a).
摘要翻译：要解决的问题：提供一种树脂组合物，其提供在厚膜中成型时具有良好的抗裂性的树脂固化物，并且具有高硬度。溶解性：光敏性有机硅树脂组合物含有含二氧化硅颗粒的硅氧烷树脂（A），硅树脂（B）和光聚合引发剂（C），其中二氧化硅颗粒的有机硅树脂（A）和硅氧烷树脂（B）中的一种或两种具有可光聚合的官能团。在具体实施方案中，含二氧化硅颗粒的有机硅树脂（A）是特定的硅烷化合物与硅烷化合物与二氧化硅颗粒（b）的水解缩合产物的聚硅氧烷化合物（a）的缩合反应产物，或聚硅氧烷化合物（a）与二氧化硅粒子（b）的缩合反应产物或其组合，硅氧烷树脂（B）为聚硅氧烷化合物（a）。

3. 发明专利

JP2013163354A Resin stamper 有权
标题翻译：树脂印章
公开(公告)号：JP2013163354A
公开(公告)日：2013-08-22
申请号：JP2012028769
申请日：2012-02-13
申请人： Asahi Kasei E-Materials Corp , 旭化成イーマテリアルズ株式会社
发明人： TSUGANE NATSUMI , SAITO HIDEO , KUSAKABE TORU
IPC分类号： B29C33/40 , B29K83/00 , G11B7/26 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To provide a single layer resin stamper having both durability and light resistance.SOLUTION: A single layer resin stamper is molded by irradiating UV ray to a photosensitive resin single layer including a silicone-containing compound and curing the photosensitive resin. A pencil hardness of the single resin stamper is H or larger.
摘要翻译：要解决的问题：提供具有耐久性和耐光性的单层树脂压模。解决方案：通过将UV射线照射到包含含硅酮化合物的感光树脂单层并固化感光树脂来模制单层树脂压模。单个树脂压模的铅笔硬度为H以上。

4. 发明专利

JP2013016823A Resin composition for filling trench 有权
标题翻译：用于填充TRENCH的树脂组合物
公开(公告)号：JP2013016823A
公开(公告)日：2013-01-24
申请号：JP2012183054
申请日：2012-08-22
申请人： Asahi Kasei E-Materials Corp , 旭化成イーマテリアルズ株式会社
发明人： MORIYAMA REIKO , TAKEMASA HIROSHI , SAITO HIDEO , DOI ICHIRO
IPC分类号： H01L21/316 , C08G77/18 , H01L21/76
摘要： PROBLEM TO BE SOLVED: To provide a resin composition for trench filling which is suitable to use to fill silicon oxide into a trench formed in a base.SOLUTION: The resin composition for trench filling comprises silicon oxide particles of 0.35 wt.% or more and 2.20 wt.% or less to the total of the resin composition for trench filling, and to the sum total of compounds represented by the general formulas (1)-(3), a tetraalkoxysilane compound of 45 mol% or more and 87 mol% or less which is represented by the general formula (1):Si(OR), a trialkoxysilane compound of 10 mol% or more and 50 mol% or less which is represented by the general formula (2):RSi(OR), and a dialkoxysilane compound of 1.5 mol% or more and 3.6 mol% or less which is represented by the general formula (3):RSi(OR).
摘要翻译：要解决的问题：提供适合于将氧化硅填充到形成在基底中的沟槽中的沟槽填充用树脂组合物。解决方案：用于沟槽填充的树脂组合物包含相对于用于沟槽填充的树脂组合物的总量为0.35重量％以上至2.20重量％以下的氧化硅粒子，以及由通式（1） - （3），由通式（1）表示的45摩尔％以上且87摩尔％以下的四烷氧基硅烷化合物：Si（OR 1 < SP> = > 4 ，由通式（2）表示的10摩尔％以上且50摩尔％以下的三烷氧基硅烷化合物：R 2 Si（OR 1 ） 3 ，和1.5摩尔％以上的二烷氧基硅烷化合物和3.6 摩尔％以下，由通式（3）表示：R 2 Si（OR 1 ） 2 。版权所有（C）2013，JPO＆INPIT

5. 发明专利

JP2011071292A Air gap structure and method of forming air gap 有权
标题翻译：空气隙结构和形成空气隙的方法
公开(公告)号：JP2011071292A
公开(公告)日：2011-04-07
申请号：JP2009220739
申请日：2009-09-25
申请人： Asahi Kasei E-Materials Corp , 旭化成イーマテリアルズ株式会社
发明人： TSUCHIYA AYAKO , MORIYAMA REIKO , SAITO HIDEO , DOI ICHIRO
IPC分类号： H01L21/764 , H01L21/316 , H01L21/76
摘要： PROBLEM TO BE SOLVED: To provide an air gap structure for electrically isolating between an element and a wire of a semiconductor device with which an element isolation region can be formed by a simple method, and to provide a method of forming the structure.
SOLUTION: The method of forming an air gap 8 in a trench 2 includes an application step of applying an application liquid containing silica particles 5 with an average particle size ranging from ≥1.0 time to ≤200 nm of an opening width of the trench 2 and a binder component 6 on a first surface 4 of a substrate 1 having the trench 2 with the opening formed on the first surface and a heating step of heating the substrate 1 at a temperature of a thermal decomposition temperature of the binder or higher after the application step.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于通过简单的方法在可以形成元件隔离区域的半导体器件的元件和线之间进行电绝缘的气隙结构，并且提供形成该结构的方法。解决方案：在沟槽2中形成气隙8的方法包括施加步骤，将包含二氧化硅颗粒5的涂布液施加在平均粒度为≥1.0时间至≤200nm的平均粒度范围内沟槽2和粘合剂组分6，在具有形成在第一表面上的开口的沟槽2的衬底1的第一表面4上，以及在粘合剂的热分解温度或更高温度下加热衬底1的加热步骤申请步骤后。版权所有（C）2011，JPO＆INPIT

6. 发明专利

JP2010177648A Polysilane-based composition for being filled in trench 有权
标题翻译：用于在TRENCH中填充的基于多晶硅的组合物
公开(公告)号：JP2010177648A
公开(公告)日：2010-08-12
申请号：JP2009021890
申请日：2009-02-02
申请人： Asahi Kasei E-Materials Corp , 旭化成イーマテリアルズ株式会社
发明人： SAITO HIDEO
IPC分类号： H01L21/76 , C01B33/04 , C08G77/60 , C08L83/16 , H01L21/312
摘要： PROBLEM TO BE SOLVED: To provide a composition for being filled in a trench preferred for being used for filling a silicon oxide in a trench formed in a substrate having high filling property in a trench and a small curing shrinkage rate and providing a silicon oxide coating film having advantageous crack resistance.
SOLUTION: The composition for being filled in the trench is characterized by containing a hydrogenated polysilane compound and a reactant having a structure derived from silica particles.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种填充在沟槽中的组合物，优选用于在沟槽中具有高填充性质的基底中形成的沟槽中填充氧化硅，并具有小的固化收缩率，并提供氧化硅涂层具有优异的抗裂性。解决方案：填充在沟槽中的组合物的特征在于含有氢化聚硅烷化合物和具有衍生自二氧化硅颗粒的结构的反应物。版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2011100858A Method for forming insulating film 有权
标题翻译：形成绝缘膜的方法
公开(公告)号：JP2011100858A
公开(公告)日：2011-05-19
申请号：JP2009254731
申请日：2009-11-06
申请人： Asahi Kasei E-Materials Corp , 旭化成イーマテリアルズ株式会社
发明人： DOI ICHIRO , TAKADA SHOZO , SAITO HIDEO
IPC分类号： H01L21/316 , H01L21/283 , H01L21/312
摘要： PROBLEM TO BE SOLVED: To provide a simple method for forming an insulating film available as an insulating film under metal or an insulating film for element separation by using spin-on glass without degrading the performance as the insulating film.
SOLUTION: The method for forming the insulating film includes the following processes in sequence: a process for obtaining a coated substrate by applying a coating liquid including a hydrolysis condensate of organoalkoxysilane to a substrate as a first process, and a burning process for burning the coating film by heating the coated substrate in gas including hydrogen at a temperature of 700-900°C inclusive and forming the insulating film as a second process.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于在金属下形成绝缘膜的绝缘膜的简单方法或通过使用旋涂玻璃进行元件分离的绝缘膜而不降低作为绝缘膜的性能的简单方法。解决方案：用于形成绝缘膜的方法包括以下顺序：通过将包含有机烷氧基硅烷的水解缩合物的涂布液作为第一工序涂布在涂布基板上的方法，通过在700-900℃的温度下加热包括氢气在内的气体的涂覆的基板来烧制涂膜，并且形成绝缘膜作为第二工序。版权所有（C）2011，JPO＆INPIT

8. 发明专利

JP2013163786A Photosensitive silicone resin composition 审中-公开
标题翻译：感光硅树脂组合物
公开(公告)号：JP2013163786A
公开(公告)日：2013-08-22
申请号：JP2012028739
申请日：2012-02-13
申请人： Asahi Kasei E-Materials Corp , 旭化成イーマテリアルズ株式会社
发明人： KUSAKABE TORU , TSUGANE NATSUMI , SAITO HIDEO
IPC分类号： C08F2/48 , C08F290/06 , C08F299/08 , C08G59/20 , C08G77/04 , C08L83/08 , C09D4/00 , C09D7/12 , C09D183/04 , G02B1/04
摘要： PROBLEM TO BE SOLVED: To provide a resin composition which can be formed into a thick film, is excellent in light stability, has small weight reduction and small dimensional change even when exposed under a high temperature after photocured, and which is excellent in crack resistance.SOLUTION: There is provided a photosensitive silicone resin which contains: 100 pts.mass silica particle mixture (A) containing a silica particle (b) and one or both of a specific silicone compound (a1) and a polysiloxane compound (a2) that is a hydrolysis condensate of the silane compound (a1); and 0.01-50 pts.mass photopolymerization initiator (B), wherein the silica particle mixture (A) has a photopolymerizable functional group and the ratio of silanol obtained from a peak surface area in the measurement of the photosensitive silicone resin composition bySiNMR method is ≤0.2.
摘要翻译：要解决的问题：为了提供可以形成为厚膜的树脂组合物，光稳定性优异，即使在光固化后在高温下暴露时，重量减轻，尺寸变化小，耐龟裂性优异解决方案：提供一种感光性硅树脂，其含有：含有二氧化硅颗粒（b）的100质量份二氧化硅颗粒混合物（A）和特定硅氧烷化合物（a1）和聚硅氧烷化合物（a2）中的一种或两种，是硅烷化合物（a1）的水解缩合物; 和0.01-50重量份光聚合引发剂（B），其中二氧化硅颗粒混合物（A）具有可光聚合官能团，并且通过SiNMR法测定感光性有机硅树脂组合物中的峰表面积得到的硅烷醇的比例≤ 0.2。

9. 发明专利

JP2013163785A Photosensitive silicone resin composition 审中-公开
标题翻译：感光硅树脂组合物
公开(公告)号：JP2013163785A
公开(公告)日：2013-08-22
申请号：JP2012028720
申请日：2012-02-13
申请人： Asahi Kasei E-Materials Corp , 旭化成イーマテリアルズ株式会社
发明人： KUSAKABE TORU , TSUGANE NATSUMI , SAITO HIDEO
IPC分类号： C08L83/04 , C08F290/06 , C08F290/14 , C08F299/08 , C08G59/20 , C08G75/04 , C08G77/20
摘要： PROBLEM TO BE SOLVED: To provide a resin composition providing a photosensitive resin composition having good crack resistance when molded in a thick film, being excellent in light resistance, and having good transparency even after a reflow step.SOLUTION: A photosensitive silicone resin composition contains 100 parts by mass of a silica particle-containing condensation reaction product (A) which is a condensation reaction product of one or both of a specific silane compound (a1) and a polysiloxane compound (a2) which is a hydrolysis condensation product of the silane compound (a1), with a silica particle (b), and 0.01 to 50 pts.mass of a photopolymerization initiator (B), wherein the content of a nitrogen atom is ≤300 mass-ppm, and the silica particle-containing condensation reaction product (A) has a photopolymerizable functional group.
摘要翻译：要解决的问题：提供一种提供在厚膜中成型时具有良好的抗裂性的感光性树脂组合物的树脂组合物，耐光性优异，即使在回流工序后也具有良好的透明性。溶解性：光敏性有机硅树脂组合物含有 100质量份作为硅烷化合物（a1）和聚硅氧烷化合物（a2）之一或两者的缩合反应产物的二氧化硅颗粒缩合反应产物（A），其是硅烷化合物（a1），二氧化硅粒子（b）和0.01〜50重量份的光聚合引发剂（B），其中氮原子的含量≤300质量ppm，含二氧化硅粒子的缩合反应产品（A）具有可光聚合官能团。

10. 发明专利

JP2013155258A Photosensitive resin composition 有权
标题翻译：感光树脂组合物
公开(公告)号：JP2013155258A
公开(公告)日：2013-08-15
申请号：JP2012015937
申请日：2012-01-27
申请人： Asahi Kasei E-Materials Corp , 旭化成イーマテリアルズ株式会社
发明人： OGASAWARA TOSHINOBU , SAITO HIDEO
IPC分类号： C08G77/20 , C08G77/22 , C08K3/20 , C08L83/07 , C08L83/08 , G02B1/04 , H01L23/28
摘要： PROBLEM TO BE SOLVED: To provide a photoradically curable resin composition which has a high refractive index, excellent heat resistance and light resistance, is excellent in curability even in the form of a thick film, and can form a cured product capable of retaining a low linear expansion coefficient and a low rate of shrinkage, and to provide a cured product of the composition.SOLUTION: A photosensitive resin composition includes 100 pts.mass of a photosensitive silicon resin (A) including metal oxide fine particles having a refractive index of ≥1.6 and a photoradically reactive group and 0.01-50 pts.mass of a photoradical polymerization initiator (B), wherein the equivalent weight of the photoradically reactive group included in the photosensitive resin composition is 0.2-10 mmol/g.
摘要翻译：要解决的问题：为了提供具有高折射率，优异的耐热性和耐光性的光固化树脂组合物，即使是厚膜形式也具有优异的固化性，并且可以形成能够保持低的固化产物线性膨胀系数和低收缩率，并提供组合物的固化产物。溶液：感光性树脂组合物包含100质量份的光敏硅树脂（A），其包含折射率为≥的金属氧化物细颗粒 1.6和光伏反应性基团和0.01-50质量份的光自由基聚合引发剂（B），其中感光性树脂组合物中包含的光自由基反应性基团的当量为0.2-10mmol / g。

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