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1. 发明申请

US20080151470A1 LAMINATED ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：层压电子元件及其制造方法
公开(公告)号：US20080151470A1
公开(公告)日：2008-06-26
申请号：US12043225
申请日：2008-03-06
申请人： Akihiro MOTOKI , Makoto OGAWA , Tatsuo KUNISHI , Jun NISHIKAWA , Yoshihiko TAKANO , Shigeyuki KURODA
发明人： Akihiro MOTOKI , Makoto OGAWA , Tatsuo KUNISHI , Jun NISHIKAWA , Yoshihiko TAKANO , Shigeyuki KURODA
IPC分类号： H01G4/005
CPC分类号： H01G4/30 , H01G4/0085 , H01G4/012 , H01G4/232 , Y10T29/435
摘要： A method for manufacturing a laminated electronic component is performed such that a water-repellent agent is applied to end surfaces at which ends of internal electrodes are exposed so as to be filled in spaces along interfaces between insulating layers and the internal electrodes. Subsequently, an abrading step is performed such that the internal electrodes are sufficiently exposed at the end surfaces and an excess water-repellent agent is removed therefrom to enable plating films to be directly formed on the end surfaces.
摘要翻译：进行层叠电子部件的制造方法，使得将防水剂施加到内部电极的端部露出的端面，以在绝缘层和内部电极之间的界面填充空间。接着，进行研磨工序，使内部电极在端面充分露出，从其中除去多余的防水剂，使得能够在端面上直接形成镀膜。

2. 发明申请

US20080225462A1 MULTILAYER ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：多层电子器件及其制造方法
公开(公告)号：US20080225462A1
公开(公告)日：2008-09-18
申请号：US12109371
申请日：2008-04-25
申请人： Akihiro MOTOKI , Kenichi KAWASAKI , Makoto OGAWA , Shigeyuki KURODA , Tatsuo KUNISHI
发明人： Akihiro MOTOKI , Kenichi KAWASAKI , Makoto OGAWA , Shigeyuki KURODA , Tatsuo KUNISHI
IPC分类号： H01G4/232 , H01G7/00
CPC分类号： H01G4/2325 , H01G4/30 , Y10T29/435
摘要： A multilayer electronic device includes a laminate and an external electrode that is formed on an end surface of the laminate after a plurality of conductive particles having a particle diameter of about 1 μm or more is adhered to the end surface of the laminate, for example, by a sandblast method or a brush polishing method. The external electrode is defined by a plating film that is formed by electroplating or electroless plating.
摘要翻译：例如，多层电子器件包括层压体和形成在层叠体的端面上的外部电极，该多个电子器件在层叠体的端面附着有多个粒径为1μm以上的导电粒子之后，通过喷砂法或刷子抛光法。外部电极由通过电镀或无电镀形成的镀膜限定。

3. 发明申请

US20080145551A1 METHOD OF MANUFACTURING MULTILAYER ELECTRONIC COMPONENT 审中-公开
标题翻译：制造多层电子元件的方法
公开(公告)号：US20080145551A1
公开(公告)日：2008-06-19
申请号：US12041889
申请日：2008-03-04
申请人： Tatsuo KUNISHI , Makoto OGAWA , Akihiro MOTOKI
发明人： Tatsuo KUNISHI , Makoto OGAWA , Akihiro MOTOKI
IPC分类号： B05D1/18 , B05D5/12
CPC分类号： H01G4/2325 , H01G4/12 , H01G4/30 , H01G13/006
摘要： An electroless plating step for forming external electrodes includes preparing a plating solution including a reducing agent and metal ions having a more electochemically positive deposition potential than the oxidation-reduction potential of the reducing agent, placing a laminate for a multilayer electronic component together with a conductive medium having catalytic activity for an oxidation reaction of the reducing agent in a vessel, and stirring the laminate and the conductive medium in the plating solution by rotation, shaking, inclination, or vibration. Electroless plating proceeds to connect each other plating deposits deposited on the ends of a plurality of internal electrodes.
摘要翻译：用于形成外部电极的化学镀步骤包括制备包含还原剂的电镀溶液和具有比还原剂的氧化还原电位更具有电化学正的沉积电位的金属离子，将多层电子部件的层压体与导电具有对容器中还原剂的氧化反应的催化活性的介质，通过旋转，摇动，倾斜或振动来搅拌电镀液中的层压体和导电介质。化学镀继续连接沉积在多个内部电极的端部上的彼此沉积的镀敷沉积物。

4. 发明申请

US20110287176A1 METHOD FOR PRODUCING CERAMIC ELECTRONIC COMPONENT 有权
标题翻译：陶瓷电子元件生产方法
公开(公告)号：US20110287176A1
公开(公告)日：2011-11-24
申请号：US13105926
申请日：2011-05-12
申请人： Junichi SAITO , Toshihiko KOBAYASHI , Makoto OGAWA , Akihiro MOTOKI , Kenichi KAWASAKI , Tatsuo KUNISHI
发明人： Junichi SAITO , Toshihiko KOBAYASHI , Makoto OGAWA , Akihiro MOTOKI , Kenichi KAWASAKI , Tatsuo KUNISHI
IPC分类号： B05D5/12 , B05D1/38 , B05D3/00 , B05D1/36
CPC分类号： H01G2/103 , B05D1/38 , B05D5/12 , B05D7/14 , H01G4/224
摘要： In order to prevent the ingress of moisture into a void section of a component main body of a ceramic electronic component, at least the component main body of the ceramic electronic component is provided with water repellency using a water repellent agent. The water repellent agent is dissolved in a supercritical fluid such as, a supercritical CO2 fluid, as a solvent to provide at least the component main body with water repellency. After providing the water repellency, the water repellent agent on the outer surface of the component main body is removed. As the water repellent agent, a silane coupling agent may be used.
摘要翻译：为了防止水分进入陶瓷电子部件的部件主体的空隙部，至少陶瓷电子部件的部件主体使用防水剂赋予防水性。将防水剂溶解在超临界流体如超临界CO 2流体中作为溶剂，以至少提供组分主体的防水性。在提供拒水性之后，除去组分主体外表面上的防水剂。作为防水剂，可以使用硅烷偶联剂。

5. 发明申请

US20100149724A1 METHOD AND APPARATUS FOR PRODUCING A CERAMIC ELECTRONIC COMPONENT 有权
标题翻译：制造陶瓷电子元件的方法和装置
公开(公告)号：US20100149724A1
公开(公告)日：2010-06-17
申请号：US12631924
申请日：2009-12-07
申请人： Makoto OGAWA , Seiichi MATSUMOTO , Akihiro MOTOKI , Toshiyuki IWANAGA , Tatsuo KUNISHI
发明人： Makoto OGAWA , Seiichi MATSUMOTO , Akihiro MOTOKI , Toshiyuki IWANAGA , Tatsuo KUNISHI
IPC分类号： H01G4/06 , B32B37/04 , C25D5/02 , C25D17/00
CPC分类号： H01G4/00 , C23C18/1632 , C23C18/1657 , C23C18/31 , C25D1/00 , C25D1/10 , H01G4/232 , H01G4/30 , H01G13/006 , Y10T29/43
摘要： A method for producing a laminated ceramic capacitor allows a surface of at least a portion of a ceramic element body chip to be brought into contact with a plated layer formed in advance in a mold member, and performs heat processing on the ceramic element body chip in that contact state, thereby to form an external conductor layer made of the plated layer on the surface of at least the portion of the ceramic element body chip. Thus, a method and an apparatus for producing a ceramic electronic component accurately and precisely controls the thickness of the external conductor layer to be small, and easily controls the length of the external conductor layer.
摘要翻译：陶瓷电容器的制造方法使陶瓷元件体芯片的至少一部分的表面与预先形成在模具部件中的镀层接触，并对陶瓷元件体芯片进行热处理从而在陶瓷元件主体芯片的至少一部分的表面上形成由镀层形成的外部导体层。因此，陶瓷电子部件的制造方法和装置精确而精确地控制外部导体层的厚度小，并且容易控制外部导体层的长度。

6. 发明申请

US20090303656A1 MONOLITHIC CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING MONOLITHIC CERAMIC ELECTRONIC COMPONENT 有权
标题翻译：单晶陶瓷电子元件及制造单晶陶瓷电子元件的方法
公开(公告)号：US20090303656A1
公开(公告)日：2009-12-10
申请号：US12405405
申请日：2009-03-17
申请人： Makoto OGAWA , Akihiro MOTOKI , Tatsuo KUNISHI , Shunsuke TAKEUCHI , Kenichi KAWASAKI
发明人： Makoto OGAWA , Akihiro MOTOKI , Tatsuo KUNISHI , Shunsuke TAKEUCHI , Kenichi KAWASAKI
IPC分类号： H01G4/30
CPC分类号： H01G4/005 , H01G4/12 , H01G4/232 , H01G4/30 , Y10T29/435
摘要： A monolithic ceramic electronic component includes a laminate including a plurality of stacked ceramic layers and a plurality of internal electrodes extending between the ceramic layers and also includes external electrodes disposed on the laminate. The internal electrodes are partly exposed at surfaces of the laminate and are electrically connected to each other with the external electrodes. The external electrodes include first plating layers and second plating layers. The first plating layers are in direct contact with the internal electrodes. The second plating layers are located outside the first plating layers and contain glass particles dispersed therein.
摘要翻译：单片陶瓷电子部件包括层压体，其包括多个层叠的陶瓷层和在陶瓷层之间延伸的多个内部电极，并且还包括设置在层叠体上的外部电极。内部电极部分地暴露在层压体的表面处并且与外部电极彼此电连接。外部电极包括第一镀层和第二镀层。第一镀层与内部电极直接接触。第二镀层位于第一镀层的外侧，并含有分散在其中的玻璃粒子。

7. 发明申请

US20080239617A1 MULTILAYER ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING MULTILAYER ELECTRONIC COMPONENT 有权
标题翻译：多层电子元件及制造多层电子元件的方法
公开(公告)号：US20080239617A1
公开(公告)日：2008-10-02
申请号：US12055372
申请日：2008-03-26
申请人： Akihiro MOTOKI , Kenichi KAWASAKI , Makoto OGAWA , Shigeyuki KURODA , Shunsuke TAKEUCHI , Hideyuki KASHIO
发明人： Akihiro MOTOKI , Kenichi KAWASAKI , Makoto OGAWA , Shigeyuki KURODA , Shunsuke TAKEUCHI , Hideyuki KASHIO
IPC分类号： H01G4/232 , H01G4/30
CPC分类号： H01G4/30 , H01G4/232
摘要： A method for manufacturing a laminated ceramic capacitor includes a step of preparing a laminate which has a first principal surface, a second principal surface, a first end surface, a second end surface, a first side surface, and a second side surface and which includes insulating layers and internal electrodes having end portions exposed at the first or second end surface; a step of forming external electrodes on the first and second end surfaces such that plating deposits are formed on the exposed end portions of the internal electrodes so as to be connected to each other; and a step of forming thick end electrodes electrically connected to the external electrodes such that a conductive paste is applied onto edge portions of the first and second principal surfaces and first and second side surfaces of the laminate and then baked.
摘要翻译：层压陶瓷电容器的制造方法包括：制备具有第一主表面，第二主表面，第一端面，第二端面，第一侧表面和第二侧表面的层压体的步骤，绝缘层和具有在第一或第二端面露出的端部的内部电极; 在所述第一和第二端面上形成外部电极的步骤，使得在所述内部电极的所述暴露端部上形成电镀沉积物以彼此连接; 以及形成与外部电极电连接的厚端电极的步骤，使得将导电浆料施加到层压体的第一和第二主表面和第一和第二侧表面的边缘部分上，然后烘烤。

8. 发明申请

US20130095233A1 MULTILAYER ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：多层电子元件及其制造方法
公开(公告)号：US20130095233A1
公开(公告)日：2013-04-18
申请号：US13439916
申请日：2012-04-05
申请人： Akihiro MOTOKI , Makoto OGAWA , Kenichi KAWASAKI , Shunsuke TAKEUCHI , Shigeyuki KURODA
发明人： Akihiro MOTOKI , Makoto OGAWA , Kenichi KAWASAKI , Shunsuke TAKEUCHI , Shigeyuki KURODA
IPC分类号： B05D5/12
CPC分类号： H01C7/008 , B05D5/12 , H01F27/2804 , H01G4/005 , H01G4/012 , H01G4/228 , H01G4/2325 , H01G4/30 , H01G4/308 , H01L41/083
摘要： A method for manufacturing a multilayer electronic component includes the steps of preparing a laminate including a plurality of laminated insulating layers and a plurality of internal electrodes disposed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate, and forming an external electrode on the predetermined surface to electrically connect exposed the edges of the internal electrodes. The step of forming an external electrode includes a plating step of forming a continuous plating film by depositing plating deposits on the edges of the internal electrodes exposed at the predetermined surface and by performing plating growth to be connected to each other, and a heat treatment step of performing a heat treatment at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 600° C. or more.
摘要翻译：一种多层电子部件的制造方法，其特征在于，具有：制造层叠绝缘层的多个层叠体和沿着绝缘层的界面配置的多个内部电极的层叠体的工序，在所述层叠体的规定表面露出内部电极的边缘并且在所述预定表面上形成外部电极以电连接所述内部电极的边缘。形成外部电极的步骤包括：电镀步骤，通过在暴露于预定表面的内部电极的边缘上沉积电镀沉积物并且通过进行电镀生长彼此连接来形成连续的镀膜;以及热处理步骤在约5ppm或更低的氧分压和约600℃或更高的温度下进行热处理。

9. 发明申请

US20110162180A1 MULTILAYER ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING MULTILAYER ELECTRONIC COMPONENT 有权
标题翻译：多层电子元件及制造多层电子元件的方法
公开(公告)号：US20110162180A1
公开(公告)日：2011-07-07
申请号：US13051013
申请日：2011-03-18
申请人： Akihiro MOTOKI , Kenichi KAWASAKI , Makoto OGAWA , Shigeyuki KURODA , Shunsuke TAKEUCHI , Hideyuki KASHIO
发明人： Akihiro MOTOKI , Kenichi KAWASAKI , Makoto OGAWA , Shigeyuki KURODA , Shunsuke TAKEUCHI , Hideyuki KASHIO
IPC分类号： H01G9/00 , B82Y99/00
CPC分类号： H01G4/30 , H01G4/232
摘要： A method for manufacturing a laminated ceramic capacitor includes a step of preparing a laminate which has a first principal surface, a second principal surface, a first end surface, a second end surface, a first side surface, and a second side surface and which includes insulating layers and internal electrodes having end portions exposed at the first or second end surface; a step of forming external electrodes on the first and second end surfaces such that plating deposits are formed on the exposed end portions of the internal electrodes so as to be connected to each other; and a step of forming thick end electrodes electrically connected to the external electrodes such that a conductive paste is applied onto edge portions of the first and second principal surfaces and first and second side surfaces of the laminate and then baked.
摘要翻译：层压陶瓷电容器的制造方法包括：制备具有第一主表面，第二主表面，第一端面，第二端面，第一侧表面和第二侧表面的层压体的步骤，绝缘层和具有在第一或第二端面露出的端部的内部电极; 在所述第一和第二端面上形成外部电极的步骤，使得在所述内部电极的所述暴露端部上形成电镀沉积物以彼此连接; 以及形成与外部电极电连接的厚端电极的步骤，使得将导电浆料施加到层压体的第一和第二主表面和第一和第二侧表面的边缘部分上，然后烘烤。

10. 发明申请

US20080210564A1 MULTILAYER ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：多层电子元件及其制造方法
公开(公告)号：US20080210564A1
公开(公告)日：2008-09-04
申请号：US12110484
申请日：2008-04-28
申请人： Akihiro MOTOKI , Makoto OGAWA , Kenichi KAWASAKI , Shunsuke TAKEUCHI , Shigeyuki KURODA
发明人： Akihiro MOTOKI , Makoto OGAWA , Kenichi KAWASAKI , Shunsuke TAKEUCHI , Shigeyuki KURODA
IPC分类号： C25D5/02 , H01G4/008
CPC分类号： H01C7/008 , B05D5/12 , H01F27/2804 , H01G4/005 , H01G4/012 , H01G4/228 , H01G4/2325 , H01G4/30 , H01G4/308 , H01L41/083
摘要： A method for manufacturing a multilayer electronic component, includes the steps of preparing a laminate including a plurality of insulating layers laminated to each other and a plurality of internal electrodes formed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate, and forming an external electrode on the predetermined surface so as to electrically connect the edges of the internal electrodes, which are exposed at the predetermined surface of the laminate. The step of forming an external electrode includes a plating step of forming a continuous plating film by depositing plating deposits on the edges of the internal electrodes exposed at the predetermined surface of the laminate which is prepared in the step of preparing a laminate and by performing plating growth of the plating deposits so as to be connected to each other, and a heat treatment step of performing a heat treatment on the laminate provided with the plating film formed thereon at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 600° C. or more.
摘要翻译：一种多层电子部件的制造方法，其特征在于，包括以下步骤：层叠多个绝缘层的层叠体，以及沿着所述绝缘层的界面形成的多个内部电极，以预定的方式露出所述内部电极的边缘表面，并且在预定表面上形成外部电极，以便电连接在层压体的预定表面处暴露的内部电极的边缘。形成外部电极的步骤包括：电镀步骤，通过在制备层压体的步骤中制备的层压体的预定表面处暴露在内部电极的边缘上沉积电镀沉积物形成连续的镀膜，并进行电镀电镀沉积物的生长以彼此连接;以及热处理步骤，对形成在其上的镀膜的层压体在氧分压为约5ppm以下，温度为约600℃以上。

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