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1. 发明公开

EP0709885A2 Circuit pack with integrated closed-loop cooling system 失效
标题翻译： Baugruppe mit integriertem，geschlossenemKühlkreislaufsystem
公开(公告)号：EP0709885A2
公开(公告)日：1996-05-01
申请号：EP95307538.9
申请日：1995-10-24
申请人： AT&T Corp.
发明人： Azar, Kaveh
IPC分类号： H01L23/473 , H01L23/467
CPC分类号： H01L23/467 , H01L23/473 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： A circuit pack with an integrated closed loop cooling system, the circuit pack comprising: a substrate; at least one heat-producing component mounted on the substrate; cooling units provided for predetermined ones of at least one heat-producing component in heat conductive relationship therewith; a delivery system for delivery of a cooling fluid to and from the cooling units; and a cooling fluid mover coupled to the substrate for circulating the cooling fluid through the delivery system and the cooling units. In an illustrative example of the invention, a heat exchanger and cooling fluid reservoir are coupled to the delivery system to enhance the performance of the integrated closed-loop cooling system in certain applications of the invention.
摘要翻译：一种具有集成闭环冷却系统的电路板，所述电路板包括：基板; 安装在所述基板上的至少一个发热部件; 为与传热关系的至少一个发热部件中的预定的冷却单元提供的冷却单元; 用于向冷却单元输送冷却流体的输送系统; 以及联接到所述基板的冷却流体驱动器，用于使所述冷却流体循环通过所述输送系统和所述冷却单元。在本发明的说明性示例中，在本发明的某些应用中，热交换器和冷却流体储存器联接到输送系统以增强集成闭环冷却系统的性能。

2. 发明公开

EP0705044A2 An interactive scanning device or system 失效
标题翻译： Interaktive Abtastvorrichtung oder系统
公开(公告)号：EP0705044A2
公开(公告)日：1996-04-03
申请号：EP95306616.4
申请日：1995-09-20
申请人： AT&T Corp.
发明人： Azar, Kaveh
IPC分类号： H04N13/00
CPC分类号： G06T19/00 , G06T2219/024 , H04N7/002 , H04N7/142 , Y10S128/916
摘要： An interactive scanning device or system (10) has one or more single or multi-dimensional scanners (12), an input device (11a,b,c), an image processor (13a,b), and a communication interface (15), for scanning an object or surface and interactively displaying and manipulating a three-dimensional image of the object or surface from the geometrical dimensions of the object or topology of the surface captured during scanning. The communication interface (15) enables the geometrical dimensions of the object, the topology of the surface, or the image of the object, to be transmitted over a wire or wireless communication medium to an end user station having an interactive scanning device or a computer station, or both, for initial or further display and manipulation. A further embodiment of the present invention incorporates a photosensitive or photographic recording device to capture an optical image of the object or surface to superimpose with the scanned image.
摘要翻译：交互式扫描设备或系统（10）具有一个或多个单维或多维扫描仪（12），输入设备（11a，b，c），图像处理器（13a，b）和通信接口（15）用于扫描对象或表面，并且从扫描期间捕获的表面的对象或拓扑的几何尺寸交互地显示和操纵对象或表面的三维图像。通信接口（15）使物体的几何尺寸，表面的拓扑或物体的图像通过有线或无线通信介质传送到具有交互式扫描设备或计算机的终端用户站站或两者，用于初始或进一步的显示和操纵。本发明的另一个实施例包括一个感光或照相记录装置，以捕获物体或表面的光学图像以与扫描图像叠加。

3. 发明公开

EP0683624A2 Narrow channel finned heat sinking for cooling high power electronic components 失效
标题翻译： WärmeabfuhrdurchengkanäligeKühlrippenzurKühlungvon elektronischen Hochleistungskomponenten。
公开(公告)号：EP0683624A2
公开(公告)日：1995-11-22
申请号：EP95112492.4
申请日：1992-11-20
申请人： AT&T Corp.
发明人： Azar, Kaveh , Caron, Richard Edward
IPC分类号： H05K7/20
CPC分类号： F28F3/02 , H01L23/367 , H01L23/3731 , H01L23/3736 , H01L23/3738 , H01L23/467 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： Dissipation of the heat produced by the operation of electronic circuitry may be improved by a heat sink which comprises a flat base from which a number of vertical fins extend. The fins are parallel to one another and define a number of parallel channels into which coolant flow is directed. The thermal resistance of the heat sink is optimized by setting fin thickness and channel width parameters to appropriate values. The heat sink may be attached in a heat conductive manner to a heat producing electronic component. One or more of these heat sinked components may be laid out in an in-line or staggered arrangement on a support in the form of a circuit pack. Cooling fluid is delivered to the circuit pack in a variety of ways to cool the heat sinked components. A method of determining the optimum fin thickness and channel width parameters involves determining a relationship between total thermal resistance of the heat sink and combinations of fin thickness and channel width parameters. A contour plot is produced in accordance with the relationship referred to above. The contour plot shows regions of optimum heat dissipation for heat sinks in accordance with the geometry identified here.
摘要翻译：通过电子电路的操作产生的热量的消散可以通过散热器来改善，所述散热器包括多个垂直散热片从该底板延伸的平坦基座。散热片彼此平行并且限定冷却剂流引导到的多个平行通道。通过将翅片厚度和通道宽度参数设置为适当的值来优化散热器的热阻。散热器可以以导热的方式附接到发热电子部件。这些散热部件中的一个或多个可以以线性或交错布置布置在电路板形式的支撑件上。冷却液以各种方式输送到电路板，以冷却散热部件。确定最佳翅片厚度和通道宽度参数的方法包括确定散热器的总热阻与翅片厚度和通道宽度参数的组合之间的关系。根据上述关系产生等高线图。轮廓图根据这里识别的几何图形显示散热器的最佳散热区域。

4. 发明授权

EP0551726B1 Circuit pack layout with improved dissipation of heat produced by high power electronic components 失效
标题翻译：布局组件与由高功率电子元件产生的热耗散的改进
公开(公告)号：EP0551726B1
公开(公告)日：1996-02-28
申请号：EP92310589.4
申请日：1992-11-20
申请人： AT&T Corp.
发明人： Azar, Kaveh , Caron, Richard Edward
IPC分类号： H05K7/20
CPC分类号： F28F3/02 , H01L23/367 , H01L2924/0002 , H01L2924/3011 , H01L2924/00

5. 发明公开

EP0463782A2 Circuit pack cooling using perforations 失效
标题翻译： Kühleinrichtungmit Perforationenfüreine gedruckte Schaltkreisanordnung。
公开(公告)号：EP0463782A2
公开(公告)日：1992-01-02
申请号：EP91305472.2
申请日：1991-06-17
申请人： AT&T Corp.
发明人： Azar, Kaveh
IPC分类号： H05K7/20
CPC分类号： H05K1/144 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： Disclosed is a means for providing forced air cooling of components (22 and 23) mounted on circuit boards (20 and 21) in a stacked configuration. A plurality of perforations (26-29) is provided in the circuit boards so that air flow in the channel between boards causes air to be sucked through the perforations to eliminate stagnant areas between components and provide local jet impingement cooling.
摘要翻译：公开了一种用于以叠置的形式对安装在电路板（20和21）上的部件（22和23）进行强制风冷的装置。多个穿孔（26-29）设置在电路板中，使得板之间的通道中的空气流动使空气通过穿孔吸入，以消除部件之间的停滞区域并提供局部喷射冲击冷却。

6. 发明公开

EP0458500A1 Circuit pack cooling using turbulators 失效
标题翻译： KühlungfürBaugruppe，die eine Turbulenzeinrichtung verwendet。
公开(公告)号：EP0458500A1
公开(公告)日：1991-11-27
申请号：EP91304267.7
申请日：1991-05-13
申请人： AT&T Corp.
发明人： Azar, Kaveh
IPC分类号： H05K7/00 , H01L23/00 , H05K7/20
CPC分类号： H05K7/20563
摘要： Disclosed is a fluid-cooled circuit pack which includes heat generating components (11) on a front surface of a circuit board (13) and another surface (17) opposite to the front surface to create a channel (15) for the flow of cooling fluid over the components. An array of rods (21), or turbulators, is provided on the surface opposite the printed circuit board front surface to create disturbances in the fluid flow and enhance heat transfer.
摘要翻译：公开了一种流体冷却电路板，其包括在电路板（13）的前表面上的发热部件（11）和与前表面相对的另一表面（17），以形成用于冷却流动的通道（15）流体在组件上。在与印刷电路板前表面相对的表面上设置有杆（21）或湍流器阵列，以在流体流动中产生干扰并增强热传递。

7. 发明公开

EP0709885A3 Circuit pack with integrated closed-loop cooling system 失效
标题翻译：组件具有集成，关闭制冷循环系统
公开(公告)号：EP0709885A3
公开(公告)日：1997-08-27
申请号：EP95307538.9
申请日：1995-10-24
申请人： AT&T Corp.
发明人： Azar, Kaveh
IPC分类号： H01L23/473 , H01L23/467
CPC分类号： H01L23/467 , H01L23/473 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： A circuit pack with an integrated closed loop cooling system, the circuit pack comprising: a substrate; at least one heat-producing component mounted on the substrate; cooling units provided for predetermined ones of at least one heat-producing component in heat conductive relationship therewith; a delivery system for delivery of a cooling fluid to and from the cooling units; and a cooling fluid mover coupled to the substrate for circulating the cooling fluid through the delivery system and the cooling units. In an illustrative example of the invention, a heat exchanger and cooling fluid reservoir are coupled to the delivery system to enhance the performance of the integrated closed-loop cooling system in certain applications of the invention.

8. 发明公开

EP0705044A3 An interactive scanning device or system 失效
标题翻译：交互式扫描装置或系统
公开(公告)号：EP0705044A3
公开(公告)日：1996-07-17
申请号：EP95306616.4
申请日：1995-09-20
申请人： AT&T Corp.
发明人： Azar, Kaveh
IPC分类号： H04N13/00
CPC分类号： G06T19/00 , G06T2219/024 , H04N7/002 , H04N7/142 , Y10S128/916
摘要： An interactive scanning device or system (10) has one or more single or multi-dimensional scanners (12), an input device (11a,b,c), an image processor (13a,b), and a communication interface (15), for scanning an object or surface and interactively displaying and manipulating a three-dimensional image of the object or surface from the geometrical dimensions of the object or topology of the surface captured during scanning. The communication interface (15) enables the geometrical dimensions of the object, the topology of the surface, or the image of the object, to be transmitted over a wire or wireless communication medium to an end user station having an interactive scanning device or a computer station, or both, for initial or further display and manipulation. A further embodiment of the present invention incorporates a photosensitive or photographic recording device to capture an optical image of the object or surface to superimpose with the scanned image.

9. 发明授权

EP0542478B1 Pin fin heat sink including flow enhancement 失效
标题翻译：具有销和流动性改善散热器
公开(公告)号：EP0542478B1
公开(公告)日：1996-03-06
申请号：EP92310149.7
申请日：1992-11-05
申请人： AT&T Corp.
发明人： Azar, Kaveh
IPC分类号： F28F3/02 , H05K7/20 , H01L23/467
CPC分类号： F28F1/124 , F28F3/022 , H01L23/3677 , H01L2924/0002 , H01L2924/3011 , H01L2924/00

10. 发明公开

EP0542478A1 Pin fin heat sink including flow enhancement 失效
标题翻译： Wärmesenkemit Stiften undStrömungsverbesserung。
公开(公告)号：EP0542478A1
公开(公告)日：1993-05-19
申请号：EP92310149.7
申请日：1992-11-05
申请人： AT&T Corp.
发明人： Azar, Kaveh
IPC分类号： F28F3/02 , H05K7/20 , H01L23/467
CPC分类号： F28F1/124 , F28F3/022 , H01L23/3677 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： Heat dissipation performance of a pin fin heat sink (300) is improved by utilizing a flow guide arrangement. Flow guide members (301,302) are positioned relative to the outer rows of the pin fins and longitudinal to fluid flow through the pin fin field of the heat sink. A gap between a lower edge of each flow guide member (301,302) and a base surface (101) of the heat sink forms apertures allowing potentially stagnant fluid in an interior region of the pin fin field of the heat sink (300) to communicate with fluid flowing around the exterior of the heat sink. This causes a so-called "pump" action in which the potentially stagnant fluid is drawn along with the fluid flowing around the exterior of the heat sink (300).
摘要翻译：通过利用导流装置改善了针鳍散热器（300）的散热性能。流动引导构件（301,302）相对于销翅片的外排定位并且纵向地流过流经散热器的销翅片场的流体流。每个流动引导构件（301,302）的下边缘和散热器的基座表面（101）之间的间隙形成孔，其允许散热器（300）的销鳍区域的内部区域中潜在的滞留流体与流体在散热器外部流动。这导致所谓的“泵”动作，其中潜在的停滞流体与流过散热器（300）的外部的流体一起被拉伸。

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