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1. 发明专利

SG187800A1 PHOTOSENSITIVE SILICONE RESIN COMPOSITION 未知
公开(公告)号：SG187800A1
公开(公告)日：2013-04-30
申请号：SG2013010046
申请日：2011-06-15
申请人： ASAHI KASEI E MATERIALS CORP
发明人： TSUGANE NATSUMI , SAITO HIDEO , KUSAKABE TORU , NAKAMICHI MOTONORI
摘要： PHOTOSENSITIVE SILICONE RESIN COMPOSITIONProvided is a resin composition which gives a cured product of a photocurable resin having excellent crackresistance even when formed into a thick film, and capable of maintaining a low coefficient of linear thermal expansion, low thermal weight loss, and a low cure shrinkage. This photosensitive silicone resin composition comprises (A) a silica particle-containing10 condensation reaction product and (B) a photopolymerization initiator, and is characterized inthat the silica particle- containing condensation reaction product (A) is a condensation reaction product of a polysiloxane compound (a) comprising a hydrolytic15 condensation product of one or more silane compoundsrepresented by the following general formula (1): RI,IISiX141 (wherein Rl, n1 and X1 are defined in the claims) and/or the silane compound, and silica particles (b), and has a terminal structure Si-O-Y (wherein Y is20 defined in the claims) which satisfies the followingformula (2): 0

2. 发明公开

EP2604644A4 PHOTOSENSITIVE SILICONE RESIN COMPOSITION 审中-公开
标题翻译：光敏组合物中硅氧烷树脂
公开(公告)号：EP2604644A4
公开(公告)日：2015-10-28
申请号：EP11816265
申请日：2011-06-15
申请人： ASAHI KASEI E MATERIALS CORP
发明人： TSUGANE NATSUMI , SAITO HIDEO , KUSAKABE TORU , NAKAMICHI MOTONORI
IPC分类号： C08G77/20 , C08F299/08 , C08G77/14 , C08L83/06 , C08L83/07 , G03F7/075
CPC分类号： C08L83/00 , C08F299/08 , C08G77/14 , C08G77/20 , C08K5/0025 , C08K9/06 , G03F7/0047 , G03F7/0757 , C08L83/04 , C08L83/06

3. 发明专利

JP2013163789A Photosensitive silicone resin composition 审中-公开
标题翻译：感光硅树脂组合物
公开(公告)号：JP2013163789A
公开(公告)日：2013-08-22
申请号：JP2012028762
申请日：2012-02-13
申请人： Asahi Kasei E-Materials Corp , 旭化成イーマテリアルズ株式会社
发明人： TSUGANE NATSUMI , SAITO HIDEO , KUSAKABE TORU
IPC分类号： C08F299/08 , C08F290/06 , C08G77/44 , C08K5/00 , C08L83/04 , C08L83/10 , G02B1/04
摘要： PROBLEM TO BE SOLVED: To provide a resin composition providing a resin cured material having good crack resistance when molded in a thick film, and having a high hardness.SOLUTION: A photosensitive silicone resin composition contains a silica particle-containing silicone resin (A), a silicone resin (B), and a photopolymerization initiator (C), wherein one or both of the silica particle-containing silicone resin (A) and the silicone resin (B) have a photopolymerizable functional group. In a specific embodiment, the silica particle-containing silicone resin (A) is a condensation reaction product of a specific silane compound and a polysiloxane compound (a) which is a hydrolysis condensation product of the silane compound with a silica particle (b), or a condensation reaction product of the polysiloxane compound (a) with the silica particle (b), or a combination thereof, and the silicone resin (B) is the polysiloxane compound (a).
摘要翻译：要解决的问题：提供一种树脂组合物，其提供在厚膜中成型时具有良好的抗裂性的树脂固化物，并且具有高硬度。溶解性：光敏性有机硅树脂组合物含有含二氧化硅颗粒的硅氧烷树脂（A），硅树脂（B）和光聚合引发剂（C），其中二氧化硅颗粒的有机硅树脂（A）和硅氧烷树脂（B）中的一种或两种具有可光聚合的官能团。在具体实施方案中，含二氧化硅颗粒的有机硅树脂（A）是特定的硅烷化合物与硅烷化合物与二氧化硅颗粒（b）的水解缩合产物的聚硅氧烷化合物（a）的缩合反应产物，或聚硅氧烷化合物（a）与二氧化硅粒子（b）的缩合反应产物或其组合，硅氧烷树脂（B）为聚硅氧烷化合物（a）。

4. 发明专利

JP2013163354A Resin stamper 有权
标题翻译：树脂印章
公开(公告)号：JP2013163354A
公开(公告)日：2013-08-22
申请号：JP2012028769
申请日：2012-02-13
申请人： Asahi Kasei E-Materials Corp , 旭化成イーマテリアルズ株式会社
发明人： TSUGANE NATSUMI , SAITO HIDEO , KUSAKABE TORU
IPC分类号： B29C33/40 , B29K83/00 , G11B7/26 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To provide a single layer resin stamper having both durability and light resistance.SOLUTION: A single layer resin stamper is molded by irradiating UV ray to a photosensitive resin single layer including a silicone-containing compound and curing the photosensitive resin. A pencil hardness of the single resin stamper is H or larger.
摘要翻译：要解决的问题：提供具有耐久性和耐光性的单层树脂压模。解决方案：通过将UV射线照射到包含含硅酮化合物的感光树脂单层并固化感光树脂来模制单层树脂压模。单个树脂压模的铅笔硬度为H以上。

5. 发明专利

JP2013163786A Photosensitive silicone resin composition 审中-公开
标题翻译：感光硅树脂组合物
公开(公告)号：JP2013163786A
公开(公告)日：2013-08-22
申请号：JP2012028739
申请日：2012-02-13
申请人： Asahi Kasei E-Materials Corp , 旭化成イーマテリアルズ株式会社
发明人： KUSAKABE TORU , TSUGANE NATSUMI , SAITO HIDEO
IPC分类号： C08F2/48 , C08F290/06 , C08F299/08 , C08G59/20 , C08G77/04 , C08L83/08 , C09D4/00 , C09D7/12 , C09D183/04 , G02B1/04
摘要： PROBLEM TO BE SOLVED: To provide a resin composition which can be formed into a thick film, is excellent in light stability, has small weight reduction and small dimensional change even when exposed under a high temperature after photocured, and which is excellent in crack resistance.SOLUTION: There is provided a photosensitive silicone resin which contains: 100 pts.mass silica particle mixture (A) containing a silica particle (b) and one or both of a specific silicone compound (a1) and a polysiloxane compound (a2) that is a hydrolysis condensate of the silane compound (a1); and 0.01-50 pts.mass photopolymerization initiator (B), wherein the silica particle mixture (A) has a photopolymerizable functional group and the ratio of silanol obtained from a peak surface area in the measurement of the photosensitive silicone resin composition bySiNMR method is ≤0.2.
摘要翻译：要解决的问题：为了提供可以形成为厚膜的树脂组合物，光稳定性优异，即使在光固化后在高温下暴露时，重量减轻，尺寸变化小，耐龟裂性优异解决方案：提供一种感光性硅树脂，其含有：含有二氧化硅颗粒（b）的100质量份二氧化硅颗粒混合物（A）和特定硅氧烷化合物（a1）和聚硅氧烷化合物（a2）中的一种或两种，是硅烷化合物（a1）的水解缩合物; 和0.01-50重量份光聚合引发剂（B），其中二氧化硅颗粒混合物（A）具有可光聚合官能团，并且通过SiNMR法测定感光性有机硅树脂组合物中的峰表面积得到的硅烷醇的比例≤ 0.2。

6. 发明专利

JP2013163785A Photosensitive silicone resin composition 审中-公开
标题翻译：感光硅树脂组合物
公开(公告)号：JP2013163785A
公开(公告)日：2013-08-22
申请号：JP2012028720
申请日：2012-02-13
申请人： Asahi Kasei E-Materials Corp , 旭化成イーマテリアルズ株式会社
发明人： KUSAKABE TORU , TSUGANE NATSUMI , SAITO HIDEO
IPC分类号： C08L83/04 , C08F290/06 , C08F290/14 , C08F299/08 , C08G59/20 , C08G75/04 , C08G77/20
摘要： PROBLEM TO BE SOLVED: To provide a resin composition providing a photosensitive resin composition having good crack resistance when molded in a thick film, being excellent in light resistance, and having good transparency even after a reflow step.SOLUTION: A photosensitive silicone resin composition contains 100 parts by mass of a silica particle-containing condensation reaction product (A) which is a condensation reaction product of one or both of a specific silane compound (a1) and a polysiloxane compound (a2) which is a hydrolysis condensation product of the silane compound (a1), with a silica particle (b), and 0.01 to 50 pts.mass of a photopolymerization initiator (B), wherein the content of a nitrogen atom is ≤300 mass-ppm, and the silica particle-containing condensation reaction product (A) has a photopolymerizable functional group.
摘要翻译：要解决的问题：提供一种提供在厚膜中成型时具有良好的抗裂性的感光性树脂组合物的树脂组合物，耐光性优异，即使在回流工序后也具有良好的透明性。溶解性：光敏性有机硅树脂组合物含有 100质量份作为硅烷化合物（a1）和聚硅氧烷化合物（a2）之一或两者的缩合反应产物的二氧化硅颗粒缩合反应产物（A），其是硅烷化合物（a1），二氧化硅粒子（b）和0.01〜50重量份的光聚合引发剂（B），其中氮原子的含量≤300质量ppm，含二氧化硅粒子的缩合反应产品（A）具有可光聚合官能团。

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