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    • 10. 发明授权
    • 자기정합(Self-aligend) 구조를 이용한 전반사형 광스위치의 제조방법
    • 制造光电开关的方法
    • KR1019970006608B1
    • 1997-04-29
    • KR1019930027342
    • 1993-12-11
    • 한국전자통신연구원주식회사 케이티
    • 박종대박기성오광룡오대곤김홍만
    • H01L31/10H01L33/00
    • A method for fabricating an optical switch is described that performs an etching process using a self-aligned mask prior to a selective re-growing process. The method includes the steps of forming an n+-InP buffer region 3, n-InGaAsP light pass path layer 4, undoped InP layer 10 and a semi-insulated InP layer 11, depositing SiNx layer 12, forming a pattern for the part where current is applied, performing an etching until the boundary between the undoped InP layer 10 and light pass path layer 4 is exposed, forming a p+-InP layer 13 and p+-InGaAs ohmic contact layer 14 and thus forming n-ohmic layer 1, etching the SiNx layer 12 and then performing a selective etching until the boundary between the light pass path layer 4 and semi-insulated InP layer 11 is exposed, and forming an n-ohmic metal layer 1. Thereby, it is possible to make a total reflection surface, and improve a switching efficiency and ohmic characteristic.
    • 描述了一种用于制造光开关的方法,其在选择性再生长处理之前使用自对准掩模进行蚀刻处理。 该方法包括以下步骤:形成n + -InP缓冲区3,n-InGaAsP光通路层4,未掺杂InP层10和半绝缘InP层11,沉积SiNx层12,形成电流 进行蚀刻,直到未掺杂的InP层10和光通过层4之间的边界露出,形成p + -InP层13和p + -InGaAs欧姆接触层14,从而形成n欧姆层1,蚀刻 然后进行选择性蚀刻,直到曝光光通路层4和半绝缘InP层11之间的边界,并形成n欧姆金属层1.由此,可以形成全反射面 ,提高开关效率和欧姆特性。