会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明专利
    • Solar cell
    • JP5361995B2
    • 2013-12-04
    • JP2011511239
    • 2009-04-30
    • 三菱電機株式会社
    • 慎介 宮本真之 中村輝人 三浦大介 越前谷
    • H01L31/04
    • H01L31/0504H01L31/022433Y02E10/50
    • A solar battery cell (101) includes a plurality of grid electrodes (2) that are formed in parallel and bus bar electrodes (3) that are formed while extending on straight lines that are substantially orthogonal to the grid electrodes (2) and are connected to tab wires (5), on a light receiving surface of a silicon substrate (1), and also includes silver electrodes (7) that are connected to tab wires (8), on a back surface of the silicon substrate (1). The silver electrodes (7) are formed in a dot shape at a predetermined distance therebetween on straight lines that are opposite to the bus bar electrodes (3) while sandwiching the silicon substrate (1) together with the bus bar electrodes (3). The bus bar electrodes (3) are intermittently formed such that positions where the bus bar electrodes (3) are opposite to the silver electrodes (7) while sandwiching the silicon substrate (1) are missing. Because the bus bar electrodes (3) and the silver electrodes (7) are not overlapped with each other while sandwiching the silicon substrate (1), concentration of stress can be relaxed.
    • 4. 发明专利
    • Solar cell
    • JP5274405B2
    • 2013-08-28
    • JP2009176898
    • 2009-07-29
    • 三菱電機株式会社
    • 輝人 三浦大介 越前谷真之 中村慎介 宮本
    • H01L31/04H01L31/042
    • Y02E10/50
    • PROBLEM TO BE SOLVED: To provide a solar cell which prevents a light reception area from being reduced even when the positions of output lead wires are deviated with respect to light reception surface lead connecting electrodes when the output lead wires are connected with the light reception surface lead connecting electrodes, while securing a connection area between the output lead wires and the light reception surface lead connecting electrodes. SOLUTION: The solar cell includes on the light reception surface of a semiconductor substrate (a silicon substrate 1), a plurality of grid electrodes 2 formed in parallel, and the light reception surface lead connecting electrodes (bus bar electrodes 13) which are extended by substantially orthogonally crossed with the grid electrodes 2 and on which the output lead wires (light reception surface tab wires 5) are connected by superimposition. The light reception surface lead connecting electrodes are superimposed on the output lead wires in an area equal to or more than a prescribed connection area, have a width smaller than that of the output lead wires concerning the substantially whole length, and have waveforms in the side part shapes waving with respect to the side parts of the output lead wires. COPYRIGHT: (C)2011,JPO&INPIT
    • 9. 发明专利
    • The power semiconductor device
    • 空值
    • JP5204744B2
    • 2013-06-05
    • JP2009268773
    • 2009-11-26
    • 三菱電機株式会社
    • 紀彦 葉名康己 上貝大介 越前谷洋平 大本
    • H01L21/60H01L23/48H01L25/07H01L25/18
    • H01L2224/45014H01L2224/45124H01L2224/48H01L2224/4809H01L2224/48092H01L2224/73265H01L2924/01005H01L2924/01006H01L2924/01013H01L2924/01014H01L2924/01029H01L2924/01033H01L2924/01051H01L2924/01074H01L2924/01082H01L2924/014H01L2924/351H01L2924/00H01L2924/00012
    • PROBLEM TO BE SOLVED: To provide a high-reliability power semiconductor device in which a peeling force generated at a ribbon bonding section is reduced for displacement, in a direction parallel to the connecting plane and in a direction vertical with respect to the connecting direction. SOLUTION: The power semiconductor device includes a semiconductor element 3 having a formed electrode plane 3s; a terminal 8 arranged at the area separated from the semiconductor element 3; and a ribbon bonding material 1, having a cross-section formed of a flat ribbon material for electrically connecting the semiconductor element 3 with the terminal 8 with the wider planes at both end portions 1 jA , 1 jB , in a longitudinal direction which is respectively joined to the electrode plane 3s and the terminal 8 of the semiconductor element 3; and the ribbon bonding material 1 further includes a deforming section 1 D , having bending rigidity that is lower than that wit respect to the flattening direction of the relevant ribbon material for bending stress in the direction (=y direction) vertical to the straight line P A -P B that connects the electrode plane 3s of the semiconductor element 3 with the bonding section of the terminal 8 and parallel to the electrode plane 3s. COPYRIGHT: (C)2011,JPO&INPIT
    • 解决的问题:提供一种高可靠性功率半导体器件,其中在带状接合部分处产生的剥离力在平行于连接平面的方向上以及相对于连接面的垂直方向减小, 连接方向。 解决方案:功率半导体器件包括具有形成的电极平面3s的半导体元件3; 布置在与半导体元件3分离的区域的端子8; 以及带状接合材料1,其具有由扁平材料形成的横截面,用于将半导体元件3与端子8电连接,并在两端部1A,SBB, 在分别连接到半导体元件3的电极平面3s和端子8的纵向方向上,jB 带状接合材料1还包括变形部分1,具有低于相关带状材料的平坦化方向的弯曲刚度,用于在(= y方向)方向上弯曲应力 )垂直于将半导体元件3的电极平面3s与端子8的接合部分连接并平行于电极平面的直线P A -P B 3s。 版权所有(C)2011,JPO&INPIT