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1. 发明授权

US08816451B2 MEMS structure and manufacturing method thereof 有权
标题翻译： MEMS结构及其制造方法
公开(公告)号：US08816451B2
公开(公告)日：2014-08-26
申请号：US13035186
申请日：2011-02-25
申请人： Hirofumi Funabashi , Yutaka Nonomura , Yoshiyuki Hata , Motohiro Fujiyoshi , Teruhisa Akashi , Yoshiteru Omura
发明人： Hirofumi Funabashi , Yutaka Nonomura , Yoshiyuki Hata , Motohiro Fujiyoshi , Teruhisa Akashi , Yoshiteru Omura
IPC分类号： H01L29/84 , H01L21/02
CPC分类号： H01L21/02 , H01L29/84
摘要： In a MEMS structure, a first trench which penetrates the first layer, the second layer and the third layer is formed, and a second trench which penetrates the fifth layer, the forth layer and the third layer is formed. The first trench forms a first part of an outline of the movable portion in a view along the stacked direction. The second trench forms a second part of the outline of the movable portion in the view along the stacked direction. At least a part of the first trench overlaps with the first extending portion in the view along the stacked direction.
摘要翻译：在MEMS结构中，形成贯穿第一层，第二层和第三层的第一沟槽，形成贯穿第五层，第四层和第三层的第二沟槽。第一沟槽沿着堆叠的方向形成可动部分的轮廓的第一部分。第二沟槽沿着堆叠方向在视图中形成可动部分的轮廓的第二部分。第一沟槽的至少一部分沿着堆叠方向在视图中与第一延伸部分重叠。

2. 发明授权

US08613231B2 Sheet-like tactile sensor system 有权
标题翻译：片状触觉传感器系统
公开(公告)号：US08613231B2
公开(公告)日：2013-12-24
申请号：US13502082
申请日：2009-10-14
申请人： Masanori Muroyama , Masayoshi Esashi , Shuji Tanaka , Sakae Matsuzaki , Mitsutoshi Makihata , Yutaka Nonomura , Motohiro Fujiyoshi , Takahiro Nakayama , Hitoshi Yamada , Ui Yamaguchi
发明人： Masanori Muroyama , Masayoshi Esashi , Shuji Tanaka , Sakae Matsuzaki , Mitsutoshi Makihata , Yutaka Nonomura , Motohiro Fujiyoshi , Takahiro Nakayama , Hitoshi Yamada , Ui Yamaguchi
IPC分类号： G01D7/00 , G01L3/00 , G01L3/22
CPC分类号： G01L5/228 , G01L1/142 , G01L1/144 , G01L1/146 , G06F3/0414
摘要： Provided are multiple normal stress detection sensor units capable of detecting a normal stress, and a sheet layer portion. The sheet layer portion includes an exterior sheet layer portion, a force detection sheet layer portion incorporating normal stress detection units, and an intermediary layer sandwiched between the exterior sheet layer portion and the force detection sheet layer portion. The exterior sheet layer portion and the force detection sheet layer portion include multiple protrusions protruding in directions opposed to each other, and are disposed such that the protrusions engage each other with the intermediary layer interposed therebetween. Each normal stress detection sensor unit includes a central portion detection sensor device disposed immediately below a central portion of the protrusion provided on the force detection sheet portion, and at least two edge detection sensor devices disposed immediately below edge portions of the protrusion provided on the force detection sheet portion.
摘要翻译：提供能够检测法向应力的多个法向应力检测传感器单元和片层部。片层部分包括外部片层部分，包含法向应力检测单元的力检测片层部分和夹在外片层部分和力检测片层部分之间的中间层。外层片部分和力检测片层部分包括在彼此相对的方向上突出的多个突起，并且被布置成使得突起彼此接合，并且介于其间的中间层。每个法向应力检测传感器单元包括设置在力检测片部分上的突起的中心部分正下方的中心部分检测传感器装置，以及至少两个边缘检测传感器装置，检测片部分。

3. 发明申请

US20130049212A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20130049212A1
公开(公告)日：2013-02-28
申请号：US13596859
申请日：2012-08-28
申请人： Yoshiyuki HATA , Yutaka NONOMURA , Teruhisa AKASHI , Hirofumi FUNABASHI , Motohiro FUJIYOSHI , Yoshiteru OMURA
发明人： Yoshiyuki HATA , Yutaka NONOMURA , Teruhisa AKASHI , Hirofumi FUNABASHI , Motohiro FUJIYOSHI , Yoshiteru OMURA
IPC分类号： H01L23/498
CPC分类号： B81C1/00825 , B81B2201/0235 , B81B2203/033 , B81B2203/0392 , G01C19/5762 , G01C19/5769 , G01P15/0802 , G01P15/125 , G01P15/18 , G01P2015/0814 , G01P2015/084
摘要： Technology is provided in which, when forming a trench of a narrow width in a thick semiconductor layer, a trench can be formed without the occurrence of semiconductor residue. In this Specification, a semiconductor device in which a trench is formed in a semiconductor layer is disclosed. In the semiconductor layer of the semiconductor device, a compensation pattern which compensates for sudden changes in the width of the trench is formed at a place at which the width of the trench changes suddenly. In the semiconductor layer of the above-described semiconductor device, since a compensation pattern is formed at a place at which the trench width changes suddenly, in the case where forming the trench using a deep RIE method, the occurrence of steep inclined portions arising from semiconductor residue can be prevented. Consequently, when forming, a trench of a narrow width in a thick semiconductor layer, the occurrence of semiconductor residue can be prevented.
摘要翻译：提供了在厚半导体层中形成窄宽度的沟槽时可以形成沟槽而不会发生半导体残渣的技术。在本说明书中，公开了在半导体层中形成沟槽的半导体器件。在半导体器件的半导体层中，在沟槽宽度急剧变化的地方形成补偿沟槽宽度突然变化的补偿图案。在上述半导体器件的半导体层中，由于在沟槽宽度突然变化的地方形成补偿图案，所以在使用深RIE法形成沟槽的情况下，由于可以防止半导体残渣。因此，当在厚半导体层中形成窄宽度的沟槽时，可以防止发生半导体残渣。

4. 发明授权

US08365597B2 Apparatus having a movable body 有权
标题翻译：装置具有可动体
公开(公告)号：US08365597B2
公开(公告)日：2013-02-05
申请号：US12723971
申请日：2010-03-15
申请人： Teruhisa Akashi , Yutaka Nonomura , Motohiro Fujiyoshi , Hirofumi Funabashi
发明人： Teruhisa Akashi , Yutaka Nonomura , Motohiro Fujiyoshi , Hirofumi Funabashi
IPC分类号： G01P15/00
CPC分类号： G01C19/5719 , G01P2015/082
摘要： An apparatus with a second movable portion that moves along an x-axis direction and a z-axis direction and a first movable portion that only moves along the z-axis direction is disclosed. The apparatus is provided with a fixed portion fixed to a support portion, a plurality of first spring portions connected to the fixed portion, a first movable portion connected to the plurality of first spring portions, a second spring portion connected to the first movable portion, and a second movable portion connected to the second spring portion. A spring constant of each of the plurality of first spring portions in the z-axis direction is lower than spring constants of each of the plurality of first spring portions in the x-axis and a y-axis directions respectively, and a spring constant of the second spring portion in the x-axis direction is lower than spring constants of the second spring portion in the y-axis and the z-axis directions respectively. The first movable portion is configured to move along the z-axis but not to move along the x-axis and the y-axis nor to rotate around the z-axis, and the second movable portion is configured to move along the x-axis and the z-axis with respect to the support portion.
摘要翻译：公开了一种具有沿x轴方向和z轴方向移动的第二可移动部分和仅沿着z轴方向移动的第一可动部分的装置。该装置设置有固定到支撑部分的固定部分，连接到固定部分的多个第一弹簧部分，连接到多个第一弹簧部分的第一可动部分，连接到第一可动部分的第二弹簧部分，以及与第二弹簧部连接的第二可动部。多个第一弹簧部分中的每一个在z轴方向上的弹簧常数分别低于多个第一弹簧部分在x轴和y轴方向上的弹簧常数，弹簧常数 x轴方向上的第二弹簧部分分别低于第二弹簧部分在y轴和z轴方向上的弹簧常数。第一可移动部分被配置为沿着z轴移动但不沿着x轴和y轴移动，也不围绕z轴旋转，并且第二可移动部分构造成沿x轴移动和z轴相对于支撑部分。

5. 发明授权

US08336399B2 Sensor system 有权
标题翻译：传感器系统
公开(公告)号：US08336399B2
公开(公告)日：2012-12-25
申请号：US12903673
申请日：2010-10-13
申请人： Masanori Muroyama , Masayoshi Esashi , Shuji Tanaka , Sakae Matsuzaki , Mitsutoshi Makihata , Yutaka Nonomura , Motohiro Fujiyoshi , Takahiro Nakayama , Ui Yamaguchi , Hitoshi Yamada
发明人： Masanori Muroyama , Masayoshi Esashi , Shuji Tanaka , Sakae Matsuzaki , Mitsutoshi Makihata , Yutaka Nonomura , Motohiro Fujiyoshi , Takahiro Nakayama , Ui Yamaguchi , Hitoshi Yamada
IPC分类号： G01D7/00
CPC分类号： B25J13/084 , G01L1/146 , G01L5/228 , H01L24/32 , H01L2224/32221 , H01L2924/14 , H01L2924/1461 , H01L2924/00
摘要： A sensor system includes a first sensing device that includes a sensor, and first and second surrounding portions that surround the sensor at least partially, a second sensing device that comprises a sensor, and first and second surrounding portions that surround the sensor at least partially, wherein at least one of a combination of shapes of the first and second surrounding portions of the respective first and second sensing devices and a combination of physical properties of the first and second surrounding portions of the respective first and second sensing devices is configured such that a detection characteristic of the first sensing device is different from a detection characteristic of the second sensing device.
摘要翻译：传感器系统包括第一感测装置，其包括传感器，以及至少部分围绕传感器的第一和第二环绕部分，包括传感器的第二感测装置，以及至少部分围绕传感器的第一和第二环绕部分，其中相应的第一和第二感测装置的第一和第二围绕部分的形状的组合中的至少一个以及相应的第一和第二感测装置的第一和第二包围部分的物理特性的组合被构造成使得第一感测装置的检测特性与第二感测装置的检测特性不同。

6. 发明申请

US20120254490A1 TOUCH SENSOR SYSTEM 有权
标题翻译：触摸传感器系统
公开(公告)号：US20120254490A1
公开(公告)日：2012-10-04
申请号：US13502078
申请日：2009-10-14
申请人： Masanori Muroyama , Masayoshi Esashi , Shuji Tanaka , Sakae Matsuzaki , Mitsutoshi Makihata , Yutaka Nonomura , Motohiro Fujiyoshi , Takahiro Nakayama , Ui Yamaguchi , Hitoshi Yamada
发明人： Masanori Muroyama , Masayoshi Esashi , Shuji Tanaka , Sakae Matsuzaki , Mitsutoshi Makihata , Yutaka Nonomura , Motohiro Fujiyoshi , Takahiro Nakayama , Ui Yamaguchi , Hitoshi Yamada
IPC分类号： G06F13/00
CPC分类号： H04L12/40032 , G01L1/142 , G01L1/146 , G01L5/228 , G06F13/376 , H04L12/40013
摘要： A touch sensor system includes buses, a plurality of touch sensor devices disposed on the buses, and an information integrating device that is connected to all the buses and integrates information from the touch sensor device. The touch sensor device includes a sensor unit and a signal processing unit that transmits a sensor data signal generated by processing an analog sensor signal to the information integrating device through the bus. The signal processing unit includes a digital converting unit, a threshold evaluating unit that gives a start permission of the signal process when a sensor value exceeds a preset threshold, an ID adding unit that adds a transmitter identification number to the sensor signal, and a data transmitting unit that outputs the sensor data signal to a signal line of the bus. Fast responses are made possible without increasing the amount of data and host processing load while including many touch sensor elements.
摘要翻译：触摸传感器系统包括总线，布置在总线上的多个触摸传感器装置，以及连接到所有总线并且集成来自触摸传感器装置的信息的信息集成装置。触摸传感器装置包括传感器单元和信号处理单元，该单元通过总线将通过处理模拟传感器信号而产生的传感器数据信号发送到信息集成装置。信号处理单元包括：数字转换单元，当传感器值超过预设阈值时给出信号处理开始许可的阈值评估单元;将传感器信号加上发射机标识号的ID添加单元，以及数据发送单元，其将传感器数据信号输出到总线的信号线。快速响应是可能的，而不增加数据量和主机处理负载，同时包括许多触摸传感器元件。

7. 发明申请

US20120247226A1 SHEET-LIKE TACTILE SENSOR SYSTEM 有权
标题翻译：类似战术传感器系统
公开(公告)号：US20120247226A1
公开(公告)日：2012-10-04
申请号：US13502082
申请日：2009-10-14
申请人： Masanori Muroyama , Masayoshi Esashi , Shuji Tanaka , Sakae Matsuzaki , Mitsutoshi Makihata , Yutaka Nonomura , Motohiro Fujiyoshi , Takahiro Nakayama , Hitoshi Yamada , Ui Yamaguchi
发明人： Masanori Muroyama , Masayoshi Esashi , Shuji Tanaka , Sakae Matsuzaki , Mitsutoshi Makihata , Yutaka Nonomura , Motohiro Fujiyoshi , Takahiro Nakayama , Hitoshi Yamada , Ui Yamaguchi
IPC分类号： G01L1/00
CPC分类号： G01L5/228 , G01L1/142 , G01L1/144 , G01L1/146 , G06F3/0414
摘要： Provided are multiple normal stress detection sensor units capable of detecting a normal stress, and a sheet layer portion. The sheet layer portion includes an exterior sheet layer portion, a force detection sheet layer portion incorporating normal stress detection units, and an intermediary layer sandwiched between the exterior sheet layer portion and the force detection sheet layer portion. The exterior sheet layer portion and the force detection sheet layer portion include multiple protrusions protruding in directions opposed to each other, and are disposed such that the protrusions engage each other with the intermediary layer interposed therebetween. Each normal stress detection sensor unit includes a central portion detection sensor device disposed immediately below a central portion of the protrusion provided on the force detection sheet portion, and at least two edge detection sensor devices disposed immediately below edge portions of the protrusion provided on the force detection sheet portion.
摘要翻译：提供能够检测法向应力的多个法向应力检测传感器单元和片层部。片层部分包括外部片层部分，包含法向应力检测单元的力检测片层部分和夹在外片层部分和力检测片层部分之间的中间层。外层片部分和力检测片层部分包括在彼此相对的方向上突出的多个突起，并且被布置成使得突起彼此接合，并且介于其间的中间层。每个法向应力检测传感器单元包括设置在力检测片部分上的突起的中心部分正下方的中心部分检测传感器装置，以及至少两个边缘检测传感器装置，检测片部分。

8. 发明申请

US20120199921A1 SENSOR DEVICE AND METHOD FOR PRODUCING SENSOR DEVICE 有权
标题翻译：传感器装置及其制造方法
公开(公告)号：US20120199921A1
公开(公告)日：2012-08-09
申请号：US13502083
申请日：2010-10-13
申请人： Shuji Tanaka , Masayoshi Esashi , Masanori Muroyama , Sakae Matsuzaki , Mitsutoshi Makihata , Yutaka Nonomura , Motohiro Fujiyoshi , Takahiro Nakayama , Ui Yamaguchi , Hitoshi Yamada
发明人： Shuji Tanaka , Masayoshi Esashi , Masanori Muroyama , Sakae Matsuzaki , Mitsutoshi Makihata , Yutaka Nonomura , Motohiro Fujiyoshi , Takahiro Nakayama , Ui Yamaguchi , Hitoshi Yamada
IPC分类号： H01L29/84 , H01L21/50
CPC分类号： B81C1/00238 , B81B2201/0264 , B81B2207/012 , B81C2201/019 , B81C2203/032 , B81C2203/0792 , G01L1/146 , G01L1/148 , G01L5/228 , H01L23/10 , H01L24/04 , H01L24/29 , H01L24/32 , H01L24/82 , H01L24/94 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/1461 , H01L2924/15787 , H01L2924/15788 , H01L2924/19041 , H01L2924/30105 , H01L2924/3011 , H01L2924/3025 , H01L2924/3512 , H01L2924/00
摘要： Provided is a technique for packaging a sensor structure having a contact sensing surface and a signal processing LSI that processes a sensor signal. The sensor structure has the contact sensing surface and sensor electrodes. The signal processing integrated circuit is embedded in a semiconductor substrate. The sensor structure and the semiconductor substrate are bonded by a bonding layer, forming a sensor device as a single chip. The sensor electrodes and the integrated circuit are sealed inside the sensor device, and the sensor electrodes and external terminals of the integrated circuit are led out to the back surface of the semiconductor substrate through a side surface of the semiconductor substrate.
摘要翻译：提供了一种用于封装具有接触感测表面的传感器结构和处理传感器信号的信号处理LSI的技术。传感器结构具有接触感应表面和传感器电极。信号处理集成电路嵌入在半导体衬底中。传感器结构和半导体衬底通过接合层粘接，形成传感器装置作为单个芯片。传感器电极和集成电路密封在传感器装置的内部，并且集成电路的传感器电极和外部端子通过半导体衬底的侧表面被引出到半导体衬底的背面。

9. 发明申请

US20110083517A1 SENSOR SYSTEM 有权
标题翻译：传感器系统
公开(公告)号：US20110083517A1
公开(公告)日：2011-04-14
申请号：US12903673
申请日：2010-10-13
申请人： Masanori MUROYAMA , Masayoshi ESASHI , Shuji TANAKA , Sakae MATSUZAKI , Mitsutoshi MAKIHATA , Yutaka NONOMURA , Motohiro FUJIYOSHI , Takahiro NAKAYAMA , Ui YAMAGUCHI , Hitoshi YAMADA
发明人： Masanori MUROYAMA , Masayoshi ESASHI , Shuji TANAKA , Sakae MATSUZAKI , Mitsutoshi MAKIHATA , Yutaka NONOMURA , Motohiro FUJIYOSHI , Takahiro NAKAYAMA , Ui YAMAGUCHI , Hitoshi YAMADA
IPC分类号： G01L1/00
CPC分类号： B25J13/084 , G01L1/146 , G01L5/228 , H01L24/32 , H01L2224/32221 , H01L2924/14 , H01L2924/1461 , H01L2924/00
摘要： A sensor system includes a first sensing device that includes a sensor, and first and second surrounding portions that surround the sensor at least partially, a second sensing device that comprises a sensor, and first and second surrounding portions that surround the sensor at least partially, wherein at least one of a combination of shapes of the first and second surrounding portions of the respective first and second sensing devices and a combination of physical properties of the first and second surrounding portions of the respective first and second sensing devices is configured such that a detection characteristic of the first sensing device is different from a detection characteristic of the second sensing device.
摘要翻译：传感器系统包括第一感测装置，其包括传感器，以及至少部分围绕传感器的第一和第二环绕部分，包括传感器的第二感测装置，以及至少部分围绕传感器的第一和第二环绕部分，其中相应的第一和第二感测装置的第一和第二围绕部分的形状的组合中的至少一个以及相应的第一和第二感测装置的第一和第二包围部分的物理特性的组合被构造成使得第一感测装置的检测特性与第二感测装置的检测特性不同。

10. 发明申请

US20100236328A1 APPARATUS HAVING A MOVABLE BODY 有权
标题翻译：具有可移动身体的装置
公开(公告)号：US20100236328A1
公开(公告)日：2010-09-23
申请号：US12723971
申请日：2010-03-15
申请人： Teruhisa AKASHI , Yutaka NONOMURA , Motohiro FUJIYOSHI , Hirofumi FUNABASHI
发明人： Teruhisa AKASHI , Yutaka NONOMURA , Motohiro FUJIYOSHI , Hirofumi FUNABASHI
IPC分类号： G01C19/56
CPC分类号： G01C19/5719 , G01P2015/082
摘要： An apparatus with a second movable portion that moves along an x-axis direction and a z-axis direction and a first movable portion that only moves along the z-axis direction is disclosed. The apparatus is provided with a fixed portion fixed to a support portion, a plurality of first spring portions connected to the fixed portion, a first movable portion connected to the plurality of first spring portions, a second spring portion connected to the first movable portion, and a second movable portion connected to the second spring portion. A spring constant of each of the plurality of first spring portions in the z-axis direction is lower than spring constants of each of the plurality of first spring portions in the x-axis and a y-axis directions respectively, and a spring constant of the second spring portion in the x-axis direction is lower than spring constants of the second spring portion in the y-axis and the z-axis directions respectively. The first movable portion is configured to move along the z-axis but not to move along the x-axis and the y-axis nor to rotate around the z-axis, and the second movable portion is configured to move along the x-axis and the z-axis with respect to the support portion.
摘要翻译：公开了一种具有沿x轴方向和z轴方向移动的第二可移动部分和仅沿着z轴方向移动的第一可动部分的装置。该装置设置有固定到支撑部分的固定部分，连接到固定部分的多个第一弹簧部分，连接到多个第一弹簧部分的第一可动部分，连接到第一可动部分的第二弹簧部分，以及与第二弹簧部连接的第二可动部。多个第一弹簧部分中的每一个在z轴方向上的弹簧常数分别低于多个第一弹簧部分在x轴和y轴方向上的弹簧常数，弹簧常数 x轴方向上的第二弹簧部分分别低于第二弹簧部分在y轴和z轴方向上的弹簧常数。第一可移动部分被配置为沿着z轴移动但不沿着x轴和y轴移动，也不围绕z轴旋转，并且第二可移动部分构造成沿x轴移动和z轴相对于支撑部分。

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