会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 8. 发明授权
    • Semiconductor device with integral heat sink
    • 具有集成散热器的半导体器件
    • US08901722B2
    • 2014-12-02
    • US14077205
    • 2013-11-11
    • You GeMeng Kong LyePenglin Mei
    • You GeMeng Kong LyePenglin Mei
    • H01L23/34H01L21/48
    • H01L23/34H01L21/4842H01L21/4878H01L23/3677H01L23/49568H01L2224/45144H01L2224/48091H01L2224/48247H01L2924/00014H01L2924/00
    • A packaged semiconductor device has opposing first and second main surfaces and a sidewall connecting the first and second main surfaces. A semiconductor die is embedded in the package and has a first main surface facing the first main surface of the package and an opposing second main surface facing the second main surface of the package. Conductive leads are electrically coupled to the semiconductor die, each of which is partially embedded within the package and extends outside of the package from the package sidewall. At least one tie bar is partially embedded within the package and has an exposed segment extending outside of the package from the sidewall. A portion of the exposed segment is in contact with the first main surface of the package. The tie bar forms a heat sink to dissipate heat generated by the semiconductor die.
    • 封装的半导体器件具有相对的第一和第二主表面以及连接第一和第二主表面的侧壁。 半导体管芯被嵌入在封装中并且具有面向封装的第一主表面的第一主表面和面向封装的第二主表面的相对的第二主表面。 导电引线电耦合到半导体管芯,每个管芯部分地嵌入在封装内并且从封装侧壁延伸到封装的外部。 至少一个连杆部分地嵌入在包装内,并且具有从侧壁延伸到包装外部的暴露部分。 暴露段的一部分与包装的第一主表面接触。 连接杆形成散热器以散发由半导体管芯产生的热量。