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    • 1. 发明专利
    • System and method for sensing the spatial image
    • JP2005526269A
    • 2005-09-02
    • JP2003558595
    • 2003-01-08
    • イエ ジュンYE Junピース アール. ファビアン ダヴリュ.PEASE R. Fabian W.
    • ジュン イエアール. ファビアン ダヴリュ. ピース
    • G03F1/00G03F7/20H01L21/027G03F1/08
    • G03F7/7085G03F1/84G03F7/70591G03F7/7065G03F7/70666G03F9/7069
    • 【課題】 従来の画像感知装置、システム及び技術に比べて高い解像度で空間画像を感知する方法及び機器である。
      【解決手段】 本発明は例えば、半導体製造に使用される光学リソグラフィック装置により作り出される空間画像を感知する技術、及びシステム及びセンサである。 機器は陰電子親和性の光電子放射装置を含み、それはそこに空間画像を投影する。 それに応答して、光電子放射装置は非常に密なエネルギー拡散を伴う電子を、空間画像により作り出される光度分布に対応するパターンに放射する。 電子光学部品は電子を案内し及び投影して、電子が放射されるパターンの拡大パターンを形成するために提供される。 感知装置は拡大パターンを感知し、それを拡大パターンを捕捉する及びデジタル化してそこからデジタル化された空間画像を得る装置に供給する。 解像度の増大は、電子光学部品によるパターンの拡大を通じて達成される。
      別の実施形態では、機器は空間画像を投影する光導電層を用いる。 光導電層は空間画像の光度分布に対応して、局部的に導電させる適切な半導体材料で作られ、光導電層上への空間画像の投影に応答して、光度分布に対応する光導電層の局部的な充電消耗を作り出す。 機器はまた、電子を提供する電子ソース及び電子を光導電層に送り、局部的な充電消耗に比例して局部的な再充電電流を作り出す装置も含む。 機器は再充電電流からの空間画像に対応するパターンを取り出す。
    • 2. 发明公开
    • METHOD AND APPARATUS FOR MONITORING INTEGRATED CIRCUIT FABRICATION
    • 方法和仪器监测集成电路的制造
    • EP1546656A4
    • 2006-11-29
    • EP03777938
    • 2003-10-28
    • YE JUNCHEN XUN
    • YE JUNCHEN XUN
    • G01D1/00G01D9/00G06F15/00G06M11/04H01L21/00H01L23/544
    • H01L21/67276G01D9/005H01L21/67253H01L22/34H01L2224/48463H01L2224/49107H01L2924/13091H01L2924/3011H01L2924/00
    • In one aspect, the present invention is a sensor unit for sensing process parameters of a process to manufacture an integrated circuit using integrated circuit processing equipment. In one embodiment, the sensor unit includes a substrate having a wafer-shaped profile and a first sensor, disposed on or in the substrate, to sample a first process parameter. The sensor unit of this embodiment also includes a second sensor, disposed on or in the substrate, to sample a second process parameter wherein the second process parameter is different from the first process parameter. In one embodiment, the sensor unit includes a first source, disposed on or in the substrate, wherein first source generates an interrogation signal and wherein the first sensor uses the interrogation signal from the first source to sample the first process parameter. The sensor unit may also include a second source, disposed on or in the substrate, wherein second source generates an interrogation signal and wherein the second sensor uses the interrogation signal from the second source to sample the second process parameter. The first sensor and the first source may operate in an end-point mode or in a real-time mode. In this regard, the first sensor samples the first parameter periodically or continuously while the sensor unit is disposed in the integrated circuit processing equipment and undergoing processing. In one embodiment, the first sensor is a temperature sensor and the second sensor is a pressure sensor, a chemical sensor, a surface tension sensor or a surface stress sensor.
    • 3. 发明公开
    • METHOD AND APPARATUS FOR MONITORING INTEGRATED CIRCUIT FABRICATION
    • 方法和仪器监测集成电路的制造
    • EP1546656A2
    • 2005-06-29
    • EP03777938.6
    • 2003-10-28
    • Ye, JunChen, Xun
    • Ye, JunChen, Xun
    • G01D1/00G06M11/04G06F15/00
    • H01L21/67276G01D9/005H01L21/67253H01L22/34H01L2224/48463H01L2224/49107H01L2924/13091H01L2924/3011H01L2924/00
    • In one aspect, the present invention is a sensor unit for sensing process parameters of a process to manufacture an integrated circuit using integrated circuit processing equipment. In one embodiment, the sensor unit includes a substrate having a wafer-shaped profile and a first sensor, disposed on or in the substrate, to sample a first process parameter. The sensor unit of this embodiment also includes a second sensor, disposed on or in the substrate, to sample a second process parameter wherein the second process parameter is different from the first process parameter. In one embodiment, the sensor unit includes a first source, disposed on or in the substrate, wherein first source generates an interrogation signal and wherein the first sensor uses the interrogation signal from the first source to sample the first process parameter. The sensor unit may also include a second source, disposed on or in the substrate, wherein second source generates an interrogation signal and wherein the second sensor uses the interrogation signal from the second source to sample the second process parameter. The first sensor and the first source may operate in an end-point mode or in a real-time mode. In this regard, the first sensor samples the first parameter periodically or continuously while the sensor unit is disposed in the integrated circuit processing equipment and undergoing processing. In one embodiment, the first sensor is a temperature sensor and the second sensor is a pressure sensor, a chemical sensor, a surface tension sensor or a surface stress sensor.
    • 4. 发明专利
    • METHOD AND APPARATUS FOR MONITORING INTEGRATED CIRCUIT FABRICATION
    • AU2003286727A1
    • 2004-06-07
    • AU2003286727
    • 2003-10-28
    • YE JUNCHEN XUN
    • YE JUNCHEN XUN
    • G01D9/00H01L21/00H01L23/544
    • In one aspect, the present invention is a sensor unit for sensing process parameters of a process to manufacture an integrated circuit using integrated circuit processing equipment. In one embodiment, the sensor unit includes a substrate having a wafer-shaped profile and a first sensor, disposed on or in the substrate, to sample a first process parameter. The sensor unit of this embodiment also includes a second sensor, disposed on or in the substrate, to sample a second process parameter wherein the second process parameter is different from the first process parameter. In one embodiment, the sensor unit includes a first source, disposed on or in the substrate, wherein first source generates an interrogation signal and wherein the first sensor uses the interrogation signal from the first source to sample the first process parameter. The sensor unit may also include a second source, disposed on or in the substrate, wherein second source generates an interrogation signal and wherein the second sensor uses the interrogation signal from the second source to sample the second process parameter. The first sensor and the first source may operate in an end-point mode or in a real-time mode. In this regard, the first sensor samples the first parameter periodically or continuously while the sensor unit is disposed in the integrated circuit processing equipment and undergoing processing. In one embodiment, the first sensor is a temperature sensor and the second sensor is a pressure sensor, a chemical sensor, a surface tension sensor or a surface stress sensor.
    • 6. 发明专利
    • Method and apparatus for monitoring integrated circuit fabrication
    • AU2003286727A8
    • 2004-06-07
    • AU2003286727
    • 2003-10-28
    • CHEN XUNYE JUN
    • CHEN XUNYE JUN
    • G01D9/00H01L21/00H01L23/544G01D1/00G06F15/00G06M11/04
    • In one aspect, the present invention is a sensor unit for sensing process parameters of a process to manufacture an integrated circuit using integrated circuit processing equipment. In one embodiment, the sensor unit includes a substrate having a wafer-shaped profile and a first sensor, disposed on or in the substrate, to sample a first process parameter. The sensor unit of this embodiment also includes a second sensor, disposed on or in the substrate, to sample a second process parameter wherein the second process parameter is different from the first process parameter. In one embodiment, the sensor unit includes a first source, disposed on or in the substrate, wherein first source generates an interrogation signal and wherein the first sensor uses the interrogation signal from the first source to sample the first process parameter. The sensor unit may also include a second source, disposed on or in the substrate, wherein second source generates an interrogation signal and wherein the second sensor uses the interrogation signal from the second source to sample the second process parameter. The first sensor and the first source may operate in an end-point mode or in a real-time mode. In this regard, the first sensor samples the first parameter periodically or continuously while the sensor unit is disposed in the integrated circuit processing equipment and undergoing processing. In one embodiment, the first sensor is a temperature sensor and the second sensor is a pressure sensor, a chemical sensor, a surface tension sensor or a surface stress sensor.
    • 8. 发明专利
    • Elektrischer Reiniger
    • DE202019005697U1
    • 2021-07-05
    • DE202019005697
    • 2019-05-10
    • YE JUN
    • A47L13/10
    • Elektrischer Reiniger, umfassend einen Körper (3), einen Schalter (5) und eine Ladestation (6), die außerhalb des Körpers angeordnet sind, sowie einen Elektromotor (13), einen Batteriepack (20), eine LED-Leuchtenplatine (21) und eine Leiterplatte, die innerhalb des Körpers (3) angeordnet sind, wobei der Schalter (5), die Ladestation (6), der Elektromotor (13), der Batteriepack (20) und die LED-Leuchtenplatine (21) jeweils mit der Leiterplatte elektrisch leitfähig verbunden sind, wobei an einer Motorwelle des Elektromotors (13) ein Untersetzungsgetriebe (14) angebracht ist, das eine Ausgangswelle aufweist, die aus der Unterseite des Körpers (3) herausragt und somit freiliegt, dadurch gekennzeichnet, dass die Unterseite des Körpers (3) mit einer beweglichen Platte (7) und einer abnehmbar an der Unterseite der beweglichen Platte angebrachten Reinigungsplatte (4) versehen ist, wobei die Oberseite der beweglichen Platte (7) mit einer Quernut (73) versehen ist, wobei die Ausgangswelle als eine exzentrische Welle (16) ausgebildet ist, deren Unterseite mit einem Exzenterblock (161) versehen ist, der in der Quernut (73) eingebaut ist, wobei durch eine Drehung der exzentrischen Welle (16) der Exzenterblock (161) zur Hin- und Herbewegung in Querrichtung innerhalb der Quernut (73) angetrieben wird, wodurch die bewegliche Platte (7) zur Hin- und Herbewegung in Längsrichtung angetrieben wird.
    • 9. 发明公开
    • 미세먼지 측정방법
    • 颗粒物质的测量方法
    • KR20180030961A
    • 2018-03-27
    • KR20160157856
    • 2016-11-25
    • CHEON YE JUNKIM YE CHAN
    • CHEON YE JUNKIM YE CHAN
    • G01N21/94G01N1/22G01N15/02
    • 본발명은미세먼지측정이가능한사용자단말기를기준으로일정거리이내에존재하는또 다른타인단말기의미세먼지측정정보를취합함으로써, 사용자단말기의위치에대한보다정확한미세먼지의정보를파악할수 있는미세먼지측정방법을제공에관한것이다. 이를위하여본 발명은미세먼지측정개시신호에따라사용자단말기가미세먼지를측정하는단계; 상기사용자단말기에서기 설정한일정거리이내에존재하는타인단말기로미세먼지정보요청신호를전송하는단계; 상기타인단말기에서측정한미세먼지측정값을상기사용자단말기가수신하는단계; 및상기사용자단말기가측정한미세먼지측정값및 상기타인단말기에서수신한미세먼지측정값을종합하여미세먼지상태를분석하는단계;를포함하는것을특징으로하는미세먼지측정방법을제공한다.
    • 本发明涉及一种用于基于能够测量细尘的用户终端来收集存在于特定距离内的另一触觉终端的细微灰尘测量信息的方法和设备, 提供一种方法。 根据本发明的一个方面,提供了一种测量细尘的方法,包括以下步骤:根据细尘测量开始信号由用户终端测量细尘; 向位于离用户终端预定距离内的另一终端发送细尘信息请求信号; 接收用户终端中的另一个终端测得的细尘测量值; 通过总结用户终端测量的细微灰尘测量值和从另一个终端接收到的细微灰尘测量值来分析细微灰尘状态。