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1. 发明申请

US20120187762A1 MULTI-CHANNEL PULSE WIDTH MODULATION SIGNAL GENERATING APPARATUS AND METHOD, AND LIGHT-EMITTING DIODE SYSTEM INCLUDING THE SAME 审中-公开
标题翻译：多通道脉冲宽度调制信号发生装置和方法以及包括其的发光二极管系统
公开(公告)号：US20120187762A1
公开(公告)日：2012-07-26
申请号：US13311643
申请日：2011-12-06
申请人： Wan-jung KIM
发明人： Wan-jung KIM
IPC分类号： H02J1/14
CPC分类号： H03K7/08 , H05B33/0803 , H05B33/0827 , Y10T307/414
摘要： A multi-channel PWM signal generating method includes receiving information having a pulse width and outputting a plurality of PWM signals based on the pulse width. The outputting includes outputting at least one pair of PWM signals that have a phase difference corresponding to a difference between an output period and the pulse width.
摘要翻译：多通道PWM信号产生方法包括接收具有脉冲宽度的信息并基于脉冲宽度输出多个PWM信号。输出包括输出至少一对具有对应于输出周期与脉冲宽度之差的相位差的PWM信号。

2. 发明申请

US20110109243A1 CIRCUIT AND METHOD OF DRIVING LIGHT EMITTING DIODES, AND LIGHT EMITTING DIODE SYSTEM HAVING THE SAME 有权
标题翻译：驱动发光二极管的电路和方法以及具有该发光二极管的发光二极管系统
公开(公告)号：US20110109243A1
公开(公告)日：2011-05-12
申请号：US12840539
申请日：2010-07-21
申请人： Yong-Hun KIM , Wan-Jung Kim , Hee-Seok Han
发明人： Yong-Hun KIM , Wan-Jung Kim , Hee-Seok Han
IPC分类号： H05B37/02
CPC分类号： H05B33/0812 , H05B33/0827 , Y02B20/345
摘要： A light-emitting-diode driving circuit includes a current driving circuit configured to control current signals flowing through light-emitting-diode strings in response to a first signal that includes information of a light-emitting-diode current, a dynamic headroom controller configured to generate a third control signal that changes according to a change of the current signals flowing through the light-emitting-diode strings based on voltage signals of first terminals of each of the light-emitting-diode strings and a second control signal that includes the information of the light-emitting-diode current, and a power supply circuit configured to generate a light-emitting-diode driving voltage that changes in response to the third control signal, and provide the light-emitting-diode driving voltage to second terminals of each of the light-emitting-diode strings.
摘要翻译：发光二极管驱动电路包括电流驱动电路，其被配置为响应于包括发光二极管电流的信息的第一信号来控制流过发光二极管串的电流信号，动态余量控制器被配置为基于每个发光二极管串的第一端子的电压信号和包括该信息的第二控制信号，产生根据流过发光二极管串的电流信号的变化而变化的第三控制信号以及电源电路，其被配置为产生响应于所述第三控制信号而变化的发光二极管驱动电压，并将所述发光二极管驱动电压提供给每个所述第二控制信号的第二端子的发光二极管串。

3. 发明申请

US20110036525A1 Method of Manufacturing an opaque paper using Genus Typha L. 审中-公开
标题翻译：使用印楝树制造不透明纸的方法
公开(公告)号：US20110036525A1
公开(公告)日：2011-02-17
申请号：US12989973
申请日：2008-04-30
申请人： Wan-Jung Kim , Sung-Eun Lee
发明人： Wan-Jung Kim , Sung-Eun Lee
IPC分类号： D21H21/32
CPC分类号： D21H11/12
摘要： The present invention relates to a method of manufacturing an opaque paper by using Genus Typha L. The method includes preparing Genus Typha L. bleached pulp from Genus Typha L. and fabricating a paper from the Genus Typha L. bleached pulp. According to the present invention, the method can provide paper with a low basis weight, even if it includes very little or no mineral charging agent but having high opacity, smoothness, and printability. Since it includes very little or no mineral charging agent, it may not have much deteriorated mechanical strength.
摘要翻译：本发明涉及通过使用印楝类L制造不透明纸的方法。该方法包括制备来自印度麻黄属（Typha L.）的Typha L.漂白纸浆，并制造了来自Typha L.漂白纸浆的纸。根据本发明，该方法即使包含很少或不含矿物充填剂但具有高不透明性，平滑性和可印刷性，也可以提供具有低基重的纸。由于它包括很少或不含矿物充填剂，它的机械强度可能不会降低。

4. 发明申请

US20100177106A1 ARBITRATION CIRCUIT TO ARBITRATE CONFLICT BETWEEN READ/WRITE COMMAND AND SCAN COMMAND AND DISPLAY DRIVER INTEGRATED CIRCUIT HAVING THE SAME 有权
标题翻译：仲裁电路对读/写命令和扫描命令之间的冲突进行仲裁，并显示具有该命令的驱动器集成电路
公开(公告)号：US20100177106A1
公开(公告)日：2010-07-15
申请号：US12686508
申请日：2010-01-13
申请人： Wan-jung Kim , Chan-ho Lee , Tae-hyoung Kim
发明人： Wan-jung Kim , Chan-ho Lee , Tae-hyoung Kim
IPC分类号： G09G5/39 , G09G5/00
CPC分类号： G09G5/001 , G09G3/20 , G09G5/39
摘要： An arbitration circuit to arbitrate an issue between a read/write command and a scan command and a display driver integrated circuit including the arbitration circuit. The arbitration circuit includes a latch unit having a first latch circuit that latches and outputs a first signal related to a scan command and a second latch circuit that latches and outputs a second signal related to a read/write command, wherein the latch unit resets outputs of the first latch circuit and/or the second latch circuit in response to a ready signal related to a memory operation, and a maintaining unit to receive outputs of the first latch circuit and the second latch circuit, to generate a first internal signal to activate a scanning operation and a second internal signal to activate a reading/writing operation, maintain the first internal signal and the second internal signal, and to selectively activate the first internal signal or the second internal signal by changing the state of at least one of the first internal signal and second internal signal in response to the reset operation.
摘要翻译：仲裁电路，用于仲裁读/写命令和扫描命令之间的问题以及包括仲裁电路的显示驱动器集成电路。仲裁电路包括一个锁存单元，该锁存单元具有锁存和输出与扫描命令有关的第一信号的第一锁存电路和锁存并输出与读/写命令相关的第二信号的第二锁存电路，其中锁存单元复位输出的第一锁存电路和/或第二锁存电路响应于与存储器操作相关的就绪信号，以及维持单元，用于接收第一锁存电路和第二锁存电路的输出，以产生第一内部信号以激活扫描操作和第二内部信号以激活读/写操作，保持第一内部信号和第二内部信号，并且通过改变第一内部信号或第二内部信号中的至少一个的状态来选择性地启动第一内部信号或第二内部信号第一内部信号和第二内部信号响应复位操作。

5. 发明申请

US20130203617A1 Glycoprotein Analysis Kit and Use Thereof 审中-公开
标题翻译：糖蛋白分析试剂盒及其用途
公开(公告)号：US20130203617A1
公开(公告)日：2013-08-08
申请号：US13695197
申请日：2011-04-29
申请人： Hak Sung Kim , Sun Young Park , Sang Chul Lee , Eun Kyoung Kim , Sung Ho Kim , Wan Jung Kim , Yong Tae Kim , Young Dok Son , Jung Hoe Kim
发明人： Hak Sung Kim , Sun Young Park , Sang Chul Lee , Eun Kyoung Kim , Sung Ho Kim , Wan Jung Kim , Yong Tae Kim , Young Dok Son , Jung Hoe Kim
IPC分类号： G01N33/74 , C12N15/85 , G01N33/68
CPC分类号： G01N33/746 , C12N15/85 , G01N33/6803 , G01N33/6842 , G01N2400/02
摘要： Disclosed are a glycoprotein analysis kit and use thereof. The glycoprotein analysis kit comprises a fluorescently labeled antibody, a fluorescently labeled biomaterial, and a support, and is used in a dual probing method for analyzing the content of a glycoprotein and profiling the oligosaccharide chain, simultaneously, and a method for selecting a single cell producing the glycoprotein having a desired glycosylation pattern. Also, a single cell producing the glycoprotein having a desired glycosylation pattern is provided.
摘要翻译：公开了糖蛋白分析试剂盒及其用途。糖蛋白分析试剂盒包含荧光标记的抗体，荧光标记的生物材料和载体，并用于同时用于分析糖蛋白含量和分析寡糖链的双重探测方法，以及选择单细胞的方法产生具有所需糖基化模式的糖蛋白。此外，提供了产生具有所需糖基化模式的糖蛋白的单细胞。

6. 发明申请

US20090162650A1 Adhesive film composition for semiconductor assembly, adhesive film, dicing die bonding film, device package, and associated methods 审中-公开
标题翻译：用于半导体组装的粘合膜组合物，粘合剂膜，切割芯片接合膜，器件封装以及相关方法
公开(公告)号：US20090162650A1
公开(公告)日：2009-06-25
申请号：US12314973
申请日：2008-12-19
申请人： Yong Woo Hong , Wan Jung Kim , Su Mi Im , Ah Ram Pyun , Chul Jeong , Sang Jin Kim , Chang Beom Chung
发明人： Yong Woo Hong , Wan Jung Kim , Su Mi Im , Ah Ram Pyun , Chul Jeong , Sang Jin Kim , Chang Beom Chung
IPC分类号： B32B7/12 , B32B7/10 , B32B27/18 , B32B15/092 , C08L71/10 , C08K11/00 , C08K5/50
CPC分类号： H01L21/6836 , C08K5/50 , C08K5/5419 , C09D163/00 , C09J7/38 , C09J2203/326 , C09J2205/102 , C09J2421/00 , C09J2463/00 , H01L21/6835 , H01L24/28 , H01L24/45 , H01L2221/68327 , H01L2224/45124 , H01L2224/45144 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/1461 , Y10T428/2848 , Y10T428/31515 , Y10T428/31522 , C08L2666/28 , H01L2924/3512 , H01L2924/00 , H01L2224/48
摘要： An adhesive film composition for semiconductor assembly includes an elastomer resin, an epoxy resin, a phenolic curing resin, and a silsesquioxane oligomer. The silsesquioxane oligomer may be present in an amount of about 0.01 to about 3 wt. %, based on the total solids content of the composition.
摘要翻译：用于半导体组件的粘合膜组合物包括弹性体树脂，环氧树脂，酚类固化树脂和倍半硅氧烷低聚物。倍半硅氧烷低聚物可以以约0.01至约3重量％的量存在。％，基于组合物的总固体含量。

7. 发明申请

US20080145668A1 Adhesive film composition, associated dicing die bonding film, and die package 有权
标题翻译：粘合膜组成，相关切割模片接合薄膜和模具包装
公开(公告)号：US20080145668A1
公开(公告)日：2008-06-19
申请号：US12000070
申请日：2007-12-07
申请人： Ki Sung Jung , Wan Jung Kim , Yong Woo Hong , Chang Bum Chung , Chul Jeong , Ah Ram Pyun , Su Mi Im , Kyoung Jin Ha
发明人： Ki Sung Jung , Wan Jung Kim , Yong Woo Hong , Chang Bum Chung , Chul Jeong , Ah Ram Pyun , Su Mi Im , Kyoung Jin Ha
IPC分类号： B32B27/38 , C08K7/00
CPC分类号： H01L21/6836 , C08K3/013 , C08K5/34922 , C08K5/50 , C08K5/5435 , C08K5/548 , C08K5/55 , C08L61/04 , C08L63/00 , C09D167/02 , H01L23/293 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/83191 , H01L2224/8388 , H01L2224/83885 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/01051 , H01L2924/01058 , H01L2924/01067 , H01L2924/01072 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/1461 , Y10T428/287 , Y10T428/31511 , Y10T428/31515 , Y10T428/31786 , C08L2666/14 , H01L2924/00 , H01L2924/01083
摘要： An adhesive film composition includes a polyester-based thermoplastic resin, an elastomer resin containing at least one of a hydroxyl group, a carboxyl group, or an epoxy group, an epoxy resin, a phenol curing agent, one or more of a latent catalytic curing agent or a curing catalyst, a silane coupling agent, and a filler.
摘要翻译：粘合膜组合物包括聚酯类热塑性树脂，包含羟基，羧基或环氧基中的至少一种的弹性体树脂，环氧树脂，酚固化剂，潜在催化固化中的一种或多种试剂或固化催化剂，硅烷偶联剂和填料。

8. 发明授权

US08394493B2 Bonding film composition for semiconductor assembly, bonding film therefrom, and dicing die bond film comprising the same 有权
标题翻译：用于半导体组装的粘合膜组合物，与其结合的膜以及包含该膜的组合物
公开(公告)号：US08394493B2
公开(公告)日：2013-03-12
申请号：US11826908
申请日：2007-07-19
申请人： Yong Woo Hong , Su Mi Im , Wan Jung Kim , Ki Sung Jung , Chang Beom Chung
发明人： Yong Woo Hong , Su Mi Im , Wan Jung Kim , Ki Sung Jung , Chang Beom Chung
IPC分类号： B32B5/16 , B32B7/12 , C08L63/00
CPC分类号： B32B7/12 , B32B27/38 , C08G59/621 , C08G59/68 , C09J163/00 , Y10T428/25 , Y10T428/28 , Y10T428/2848 , Y10T428/31511
摘要： A die bonding film composition for semiconductor assembly may include an elastomer resin containing a hydroxyl group, a carboxyl group, or an epoxy group. The die bonding film composition may also include a film forming resin having a glass transition temperature (Tg) in the range of about 0 to 200° C., an epoxy resin, a phenol resin, a hardener, a silane coupling agent, and a filler.
摘要翻译：用于半导体组装的芯片接合膜组合物可以包括含有羟基，羧基或环氧基的弹性体树脂。芯片接合膜组合物还可以包括玻璃化转变温度（Tg）在约0至200℃范围内的成膜树脂，环氧树脂，酚醛树脂，固化剂，硅烷偶联剂和填料。

9. 发明授权

US08368312B2 Circuit and method of driving light emitting diodes, and light emitting diode system having the same 有权
标题翻译：驱动发光二极管的电路和方法，以及具有该发光二极管的发光二极管系统
公开(公告)号：US08368312B2
公开(公告)日：2013-02-05
申请号：US12840539
申请日：2010-07-21
申请人： Yong-Hun Kim , Wan-Jung Kim , Hee-Seok Han
发明人： Yong-Hun Kim , Wan-Jung Kim , Hee-Seok Han
IPC分类号： G09G5/10 , H05B37/00
CPC分类号： H05B33/0812 , H05B33/0827 , Y02B20/345
摘要： A light-emitting-diode driving circuit includes a current driving circuit configured to control current signals flowing through light-emitting-diode strings in response to a first signal that includes information of a light-emitting-diode current, a dynamic headroom controller configured to generate a third control signal that changes according to a change of the current signals flowing through the light-emitting-diode strings based on voltage signals of first terminals of each of the light-emitting-diode strings and a second control signal that includes the information of the light-emitting-diode current, and a power supply circuit configured to generate a light-emitting-diode driving voltage that changes in response to the third control signal, and provide the light-emitting-diode driving voltage to second terminals of each of the light-emitting-diode strings.
摘要翻译：发光二极管驱动电路包括电流驱动电路，其被配置为响应于包括发光二极管电流的信息的第一信号来控制流过发光二极管串的电流信号，动态余量控制器被配置为基于每个发光二极管串的第一端子的电压信号和包括该信息的第二控制信号，产生根据流过发光二极管串的电流信号的变化而变化的第三控制信号以及电源电路，其被配置为产生响应于所述第三控制信号而变化的发光二极管驱动电压，并将所述发光二极管驱动电压提供给每个所述第二控制信号的第二端子的发光二极管串。

10. 发明授权

US08211540B2 Adhesive film composition, associated dicing die bonding film, die package, and associated methods 有权
标题翻译：粘合膜组合物，相关切割芯片接合薄膜，模具包装及相关方法
公开(公告)号：US08211540B2
公开(公告)日：2012-07-03
申请号：US12285568
申请日：2008-10-08
申请人： Yong Woo Hong , Ki Seong Jung , Wan Jung Kim , Su Mi Im , Sang Jin Kim , Chang Beom Chung
发明人： Yong Woo Hong , Ki Seong Jung , Wan Jung Kim , Su Mi Im , Sang Jin Kim , Chang Beom Chung
IPC分类号： B32B27/38 , B32B27/26 , C08L13/00 , C08L15/00 , C08L63/00 , H01L23/02 , H01L21/00
CPC分类号： H01L24/29 , C08L21/00 , C08L61/06 , C08L63/00 , C08L2666/02 , C08L2666/06 , C08L2666/22 , C09J7/38 , C09J161/06 , C09J2203/326 , C09J2461/00 , C09J2463/00 , H01L21/6836 , H01L24/27 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/45124 , H01L2224/45144 , H01L2224/83191 , H01L2224/8385 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01051 , H01L2924/01072 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/1461 , H01L2924/181 , Y10T156/10 , Y10T428/2848 , Y10T428/287 , Y10T428/31511 , Y10T428/31515 , Y10T428/31663 , H01L2924/066 , H01L2924/00 , H01L2924/3512 , H01L2224/48
摘要： An adhesive film composition includes an elastomer resin having one or more of a hydroxy group, a carboxyl group, or an epoxy group, a film-forming resin, a silylated phenolic curing resin, an epoxy resin, a curing accelerator, and a filler.
摘要翻译：粘合膜组合物包括具有羟基，羧基或环氧基中的一个或多个的弹性体树脂，成膜树脂，甲硅烷基化的酚固化树脂，环氧树脂，固化促进剂和填料。

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