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    • 7. 发明授权
    • Process for making BiCMOS device having an SOI substrate
    • 制造具有SOI衬底的BiCMOS器件的工艺
    • US5279978A
    • 1994-01-18
    • US993282
    • 1992-12-18
    • Yee-Chaung SeeThomas C. MeleJohn R. Alvis
    • Yee-Chaung SeeThomas C. MeleJohn R. Alvis
    • H01L27/06H01L27/12H01L21/265
    • H01L27/1203H01L27/0623Y10S148/009
    • A BiCMOS device and process are disclosed wherein the transistors components are fabricated on an SOI substrate. A SIMOX process is used to form a buried oxide layer in a single crystal silicon substrate followed by an epitaxial deposition to form a silicon body of varying thickness overlying the buried oxide layer. MOS transistors are then formed in a thin portion of the epitaxial layer and a vertical bipolar transistor is formed in the thick portion of the epitaxial layer.In accordance with one embodiment of the invention, a single crystal semiconductor substrate is provided having a principal surface and a buried oxide layer underlying the first surface. A lightly doped epitaxial layer of a first conductivity type having a thin MOS region and a thick bipolar region overlies the principal surface. A first and second isolation regions extending from the first surface to the buried oxide layer separate and electrically insulate the bipolar region from the MOS region. An NMOS and a PMOS transistor are formed in the thin MOS region and are separated by a third isolation region extending from the first surface to the buried oxide layer. A vertical bipolar is formed in the electrically insulated bipolar region of the epitaxial layer.
    • 公开了一种BiCMOS器件和工艺,其中晶体管元件制造在SOI衬底上。 使用SIMOX工艺在单晶硅衬底中形成掩埋氧化层,接着进行外延沉积,以形成覆盖掩埋氧化物层的不同厚度的硅体。 然后在外延层的薄部分中形成MOS晶体管,并且在外延层的厚部分中形成垂直双极晶体管。 根据本发明的一个实施例,提供单晶半导体衬底,其具有在第一表面下面的主表面和掩埋氧化物层。 具有薄MOS区和厚双极区的第一导电类型的轻掺杂外延层覆盖在主表面上。 从第一表面延伸到掩埋氧化物层的第一和第二隔离区域将双极区域与MOS区域分离并电绝缘。 NMOS和PMOS晶体管形成在薄MOS区中,并由从第一表面延伸到掩埋氧化物层的第三隔离区隔开。 在外延层的电绝缘双极区域中形成垂直双极。
    • 8. 发明授权
    • BiCMOS device having an SOI substrate and process for making the same
    • 具有SOI衬底的BiCMOS器件及其制造方法
    • US5212397A
    • 1993-05-18
    • US566901
    • 1990-08-13
    • Yee-Chaung SeeThomas C. MeleJohn R. Alvis
    • Yee-Chaung SeeThomas C. MeleJohn R. Alvis
    • H01L27/06H01L27/12
    • H01L27/1203H01L27/0623Y10S148/009
    • A BiCMOS device and process are disclosed wherein the transistors components are fabricated on an SOI substrate. A SIMOX process is used to form a buried oxide layer in a single crystal silicon substrate followed by an epitaxial deposition to form a silicon body of varying thickness overlying the buried oxide layer. MOS transistors are then formed in a thin portion of the epitaxial layer and a vertical bipolar transistor is formed in the thick portion of the epitaxial layer. In accordance with one embodiment of the invention, a single crystal semiconductor substrate is provided having a principal surface and a buried oxide layer underlying the first surface. A lightly doped epitaxial layer of a first conductivity type having a thin MOS region and a thick bipolar region overlies the principal surface. A first and second isolation regions extending from the first surface to the buried oxide layer separate and electrically insulate the bipolar region from the MOS region. An NMOS and a PMOS transistor are formed in the thin MOS region and are separated by a third isolation region extending from the first surface to the buried oxide layer. A vertical bipolar is formed in the electrically insulated bipolar region of the epitaxial layer.
    • 公开了一种BiCMOS器件和工艺,其中晶体管元件制造在SOI衬底上。 使用SIMOX工艺在单晶硅衬底中形成掩埋氧化层,接着进行外延沉积,以形成覆盖掩埋氧化物层的不同厚度的硅体。 然后在外延层的薄部分中形成MOS晶体管,并且在外延层的厚部分中形成垂直双极晶体管。 根据本发明的一个实施例,提供单晶半导体衬底,其具有在第一表面下面的主表面和掩埋氧化物层。 具有薄MOS区和厚双极区的第一导电类型的轻掺杂外延层覆盖在主表面上。 从第一表面延伸到掩埋氧化物层的第一和第二隔离区域将双极区域与MOS区域分离并电绝缘。 NMOS和PMOS晶体管形成在薄MOS区中,并由从第一表面延伸到掩埋氧化物层的第三隔离区隔开。 在外延层的电绝缘双极区域中形成垂直双极。
    • 10. 发明授权
    • Process for forming a self-aligned contact structure
    • 用于形成自对准接触结构的方法
    • US4997790A
    • 1991-03-05
    • US566185
    • 1990-08-13
    • Michael P. WooThomas C. MeleWayne J. RayWayne M. Paulson
    • Michael P. WooThomas C. MeleWayne J. RayWayne M. Paulson
    • H01L21/28H01L21/3205H01L21/60H01L21/768
    • H01L21/76897H01L21/76885H01L24/11Y10S148/105Y10S148/161
    • A self-aligned contact is formed in a multi-layer semiconductor device. In one form, conductive members are formed overlying a substrate material and a first insulating layer is deposited overlying the substrate material and the conductive members. A film of material is deposited on the first insulating layer and the film of material is patterned to form a sacrificial plug in an area where a contact is to be made. A second insulating layer is deposited on the device, and the device is made substantially planar. The second insulating layer is etched back to expose the sacrificial plug. The sacrificial plug is removed by selectively etching the device such that the first and second insulating layers are left substantially unaltered. An anisotropic etch of the device is performed to expose an area of the substrate material on which a contact is to be made, and to simultaneously form sidewall spacers along edges of the conductive members. A conductive layer is deposited onto the device and patterned, thereby forming a self-aligned contact.
    • 在多层半导体器件中形成自对准接触。 在一种形式中,形成覆盖衬底材料的导电构件,并且沉积覆盖衬底材料和导电构件的第一绝缘层。 将材料膜沉积在第一绝缘层上,并且将材料膜图案化以在要进行接触的区域中形成牺牲插塞。 第二绝缘层沉积在器件上,并且器件基本上是平面的。 将第二绝缘层回蚀刻以暴露牺牲插头。 通过选择性地蚀刻该器件以使得第一绝缘层和第二绝缘层基本上保持不变而去除牺牲插塞。 执行器件的各向异性蚀刻以暴露要在其上形成触点的衬底材料的区域,并且同时沿着导电构件的边缘形成侧壁间隔物。 导电层沉积在器件上并图案化,从而形成自对准接触。