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1. 发明申请

US20100140782A1 PRINTED CIRCUIT BOARD HAVING BUILT-IN INTEGRATED CIRCUIT PACKAGE AND FABRICATION METHOD THEREFOR 有权
标题翻译：具有内置集成电路封装的印刷电路板及其制造方法
公开(公告)号：US20100140782A1
公开(公告)日：2010-06-10
申请号：US12633433
申请日：2009-12-08
申请人： Sang-Hyun Kim , Shi-Yun Cho , Young-Min Lee , Kyu-sub Kwak , Youn-Ho Choi
发明人： Sang-Hyun Kim , Shi-Yun Cho , Young-Min Lee , Kyu-sub Kwak , Youn-Ho Choi
IPC分类号： H01L23/48 , H01L21/60
CPC分类号： H05K1/188 , H01L23/5383 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/24227 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/82039 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H05K3/4602 , H05K3/4652 , H05K2201/0355 , H05K2201/10674 , H05K2203/0554
摘要： A Printed Circuit Board (PCB) is provided in which at least one built-in Integrated Circuit (IC) package has a plurality of conductive bumps on an IC. The plurality of conductive bumps are for external electrical connection. The IC package is accommodated within a core layer of a multi-layer PCB by a connection member on the IC. The connection member is formed between the conductive bumps and the core layer with contact holes in contact with the conductive bumps. The conductive bumps are electrically connected through conductor layers formed in the contact holes.
摘要翻译：提供了印刷电路板（PCB），其中至少一个内置集成电路（IC）封装在IC上具有多个导电凸块。多个导电凸块用于外部电连接。 IC封装通过IC上的连接构件容纳在多层PCB的芯层内。连接构件形成在导电凸块和芯层之间，其中接触孔与导电凸块接触。导电凸块通过形成在接触孔中的导体层电连接。

2. 发明申请

US20080191337A1 SEMICONDUCTOR DIE PACKAGE AND EMBEDDED PRINTED CIRCUIT BOARD 有权
标题翻译：半导体封装和嵌入式印刷电路板
公开(公告)号：US20080191337A1
公开(公告)日：2008-08-14
申请号：US12029502
申请日：2008-02-12
申请人： Shi-Yun CHO
发明人： Shi-Yun CHO
IPC分类号： H01L23/498
CPC分类号： H01L23/3677 , H01L23/3675 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor die package having an enhanced degree of heating radiation from the semiconductor, thereby reducing mechanical and electrical failure from excessive temperatures. A semiconductor die has circuit patterns formed thereon; a bump pad deposited on the semiconductor die and supporting at least one of the bumps electrically connected to the circuit patterns; and a radiating pad formed on an upper surface of the bump pad such that the radiating pad surrounds the bumps. An embedded printed circuit substrate includes a radiating pad formed on the bump pad to surround the bumps; and a core substrate has a through-hole formed in the core substrate, that extends from an upper surface of the core substrate to a lower surface thereof. The semiconductor die is deposited on the upper surface of the core substrate such that the bumps extend through the through-hole.
摘要翻译：具有来自半导体的增强的加热辐射度的半导体管芯封装，从而减少过度温度的机械和电气故障。半导体管芯具有形成在其上的电路图案; 沉积在所述半导体管芯上并且支撑电连接到所述电路图案的所述凸块中的至少一个的凸块; 以及辐射焊盘，其形成在所述凸块焊盘的上表面上，使得所述辐射焊盘围绕所述凸块。嵌入式印刷电路基板包括形成在凸块焊盘上以围绕凸块的辐射焊盘; 并且芯基板具有形成在芯基板中的通孔，其从芯基板的上表面延伸到其下表面。半导体管芯沉积在芯基板的上表面上，使得凸块延伸穿过通孔。

3. 发明申请

US20080073797A1 Semiconductor die module and package and fabricating method of semiconductor package 审中-公开
标题翻译：半导体芯片模块及半导体封装的制造方法
公开(公告)号：US20080073797A1
公开(公告)日：2008-03-27
申请号：US11899902
申请日：2007-09-06
申请人： Sang-Hyun Kim , Shi-Yun Cho , Ho-Seong Seo , Youn-Ho Choi
发明人： Sang-Hyun Kim , Shi-Yun Cho , Ho-Seong Seo , Youn-Ho Choi
IPC分类号： H01L23/52 , H01L21/00
CPC分类号： H01L23/5389 , H01L24/24 , H01L24/82 , H01L25/0657 , H01L2224/24227 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2924/01033 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/00
摘要： A semiconductor die module, a semiconductor package, and a fabrication method of the semiconductor package. A method for manufacturing a semiconductor package includes the steps of: preparing a printed circuit board in which a hole is formed to extend through a core, and an insulation layer and a circuit pattern are formed on a surface of the core, the printed circuit board having an open surface; forming conductive bumpers on some of the electric pads of each semiconductor die; forming a semiconductor die module in which the electric pads of each semiconductor die are connected to one another; inserting the semiconductor die module into the hole of the core so as to safely seat the semiconductor die module on the insulation layer and the circuit pattern; and forming the insulation layer and the circuit patterns on an open upper surface of the core.
摘要翻译：半导体管芯模块，半导体封装以及半导体封装的制造方法。一种制造半导体封装的方法包括以下步骤：制备其中形成有孔的印刷电路板延伸穿过芯，并且在芯的表面上形成绝缘层和电路图案，印刷电路板具有开放的表面; 在每个半导体管芯的一些电焊盘上形成导电缓冲器; 形成其中每个半导体管芯的电焊盘彼此连接的半导体管芯模块; 将半导体模具模块插入芯的孔中，以便将半导体管芯模块安全地安置在绝缘层和电路图案上; 以及在所述芯的开放的上表面上形成所述绝缘层和所述电路图案。

4. 发明申请

US20080073771A1 Semiconductor package and semiconductor system in package using the same 有权
标题翻译：半导体封装和半导体系统封装使用相同
公开(公告)号：US20080073771A1
公开(公告)日：2008-03-27
申请号：US11894338
申请日：2007-08-21
申请人： Ho-Seong Seo , Shi-Yun Cho , Young-Min Lee , Sang-Hyun Kim
发明人： Ho-Seong Seo , Shi-Yun Cho , Young-Min Lee , Sang-Hyun Kim
IPC分类号： H01L23/48 , H01L21/02 , H01L23/02
CPC分类号： H01L25/105 , H01L21/56 , H01L23/3128 , H01L24/12 , H01L24/16 , H01L24/48 , H01L24/73 , H01L24/83 , H01L25/0657 , H01L2224/16 , H01L2224/2929 , H01L2224/293 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73207 , H01L2224/73265 , H01L2224/83101 , H01L2224/83851 , H01L2225/0651 , H01L2225/06575 , H01L2225/06582 , H01L2225/1023 , H01L2225/1058 , H01L2924/00011 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/00012 , H01L2224/29075 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Disclosed are a semiconductor package and semiconductor system in package using the same. The semiconductor package includes: a printed circuit board (PCB); a semiconductor die disposed on the PCB and having conductive posts formed on an upper surface of the semiconductor die; and a molding formed on the PCB to cover the semiconductor die, wherein the conductive posts have a surface exposed out of an upper surface of the molding. The semiconductor system in package includes: a first semiconductor package having a semiconductor die on which conductive posts are formed, and a molding formed so that upper surfaces of the conductive posts are exposed; and a second semiconductor package disposed on the first semiconductor package and electrically connected to the conductive posts.
摘要翻译：公开了使用其的半导体封装和封装的半导体系统。半导体封装包括：印刷电路板（PCB）; 半导体管芯，其设置在所述PCB上并具有形成在所述半导体管芯的上表面上的导电柱; 以及形成在PCB上以覆盖半导体管芯的模制件，其中导电柱具有从模制件的上表面露出的表面。封装中的半导体系统包括：第一半导体封装，其具有形成有导电柱的半导体管芯，以及形成为使得导电柱的上表面露出的模制件; 以及第二半导体封装，其设置在所述第一半导体封装上并电连接到所述导电柱。

5. 发明申请

US20080061404A1 Electronic circuit package and fabricating method thereof 审中-公开
标题翻译：电子电路封装及其制造方法
公开(公告)号：US20080061404A1
公开(公告)日：2008-03-13
申请号：US11895430
申请日：2007-08-24
申请人： Shi-Yun Cho , Young-Min Lee , Youn-Ho Choi , Ho-Seong Seo , Sang-Hyun Kim
发明人： Shi-Yun Cho , Young-Min Lee , Youn-Ho Choi , Ho-Seong Seo , Sang-Hyun Kim
IPC分类号： H01L23/552 , H01L21/56
CPC分类号： H01L23/552 , H01L23/3121 , H01L23/66 , H01L24/48 , H01L25/165 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2924/00014 , H01L2924/10253 , H01L2924/14 , H01L2924/3025 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要： An electronic circuit package and fabricating method thereof. The method includes: integrating a radio frequency circuit device and a semiconductor die on a printed circuit board; forming a bumper pad of metal on the printed circuit board around the radio frequency circuit device; forming a molding on the printed circuit board to include the radio frequency circuit device and the semiconductor die therein; and forming one or more grooves on a portion of the molding and inserting a can into the grooves. The electronic circuit package includes: a printed circuit board; a radio frequency circuit device and a semiconductor die integrated on the printed circuit board; a molding formed on the printed circuit board to include the radio frequency circuit device and the semiconductor die therein; one or more grooves formed in the molding to enclose the radio frequency circuit device; and a can inserted into the grooves.
摘要翻译：一种电子电路封装及其制造方法。该方法包括：在印刷电路板上集成射频电路器件和半导体管芯; 在射频电路装置周围的印刷电路板上形成金属缓冲垫; 在所述印刷电路板上形成模具，以将所述射频电路器件和所述半导体管芯包括在其中; 以及在所述模制件的一部分上形成一个或多个凹槽并将罐插入所述槽中。电子电路封装包括：印刷电路板; 集成在印刷电路板上的射频电路器件和半导体管芯; 在印刷电路板上形成的包括射频电路器件和半导体管芯的模制件; 在模制件中形成的一个或多个凹槽以封闭射频电路装置; 并且可以插入槽中的罐。

6. 发明授权

US07301751B2 Embedded capacitor 失效
标题翻译：嵌入式电容器
公开(公告)号：US07301751B2
公开(公告)日：2007-11-27
申请号：US11229756
申请日：2005-09-19
申请人： Jea-Hyuck Lee , Young-Min Lee , Shi-Yun Cho , Shin-Hee Cho , Kyung-Wan Park
发明人： Jea-Hyuck Lee , Young-Min Lee , Shi-Yun Cho , Shin-Hee Cho , Kyung-Wan Park
IPC分类号： H01G4/06 , H01G4/005 , H01G4/228
CPC分类号： H01G4/228 , H01G4/30 , H05K1/162 , H05K3/4641 , H05K2201/0355 , H05K2201/09336 , H05K2201/09763
摘要： An embedded capacitor comprises a first substrate on which a plurality of electrically insulated electrode patterns and a ground pattern are formed, a second substrate separated from the first substrate, a plurality of dielectric layers stacked between the first and second substrates, a plurality of metal layers inserted between the dielectric layers and connected to the electrode patterns of the first substrate, and a plurality of ground layers inserted between the dielectric layers alternately with the metal layers.
摘要翻译：嵌入式电容器包括：第一基板，其上形成有多个电绝缘电极图案和接地图案;与第一基板分离的第二基板，堆叠在第一和第二基板之间的多个电介质层，多个金属层插入在电介质层之间并连接到第一衬底的电极图案，以及多个接地层与金属层交替地插入在电介质层之间。

7. 发明申请

US20060098386A1 Embedded capacitor and method for manufacturing the same 失效
标题翻译：嵌入式电容器及其制造方法
公开(公告)号：US20060098386A1
公开(公告)日：2006-05-11
申请号：US11229756
申请日：2005-09-19
申请人： Jea-Hyuck Lee , Young-Min Lee , Shi-Yun Cho , Shin-Hee Cho , Kyung-Wan Park
发明人： Jea-Hyuck Lee , Young-Min Lee , Shi-Yun Cho , Shin-Hee Cho , Kyung-Wan Park
IPC分类号： H01G4/30
CPC分类号： H01G4/228 , H01G4/30 , H05K1/162 , H05K3/4641 , H05K2201/0355 , H05K2201/09336 , H05K2201/09763
摘要： An embedded capacitor comprises a first substrate on which a plurality of electrically insulated electrode patterns and a ground pattern are formed, a second substrate separated from the first substrate, a plurality of dielectric layers stacked between the first and second substrates, a plurality of metal layers inserted between the dielectric layers and connected to the electrode patterns of the first substrate, and a plurality of ground layers inserted between the dielectric layers alternately with the metal layers.
摘要翻译：嵌入式电容器包括：第一基板，其上形成有多个电绝缘电极图案和接地图案;与第一基板分离的第二基板，堆叠在第一和第二基板之间的多个电介质层，多个金属层插入在电介质层之间并连接到第一衬底的电极图案，以及多个接地层与金属层交替地插入在电介质层之间。

8. 发明申请

US20130100053A1 FLEXIBLE DISPLAY DEVICE 有权
标题翻译：柔性显示装置
公开(公告)号：US20130100053A1
公开(公告)日：2013-04-25
申请号：US13618086
申请日：2012-09-14
申请人： Seok-Myong KANG , Shi-Yun Cho , Ho-Seong Seo , In-Kuk Yun , Youn-Ho Choi
发明人： Seok-Myong KANG , Shi-Yun Cho , Ho-Seong Seo , In-Kuk Yun , Youn-Ho Choi
IPC分类号： G06F3/041 , B82Y15/00
CPC分类号： G06F3/041 , G06F3/03 , G06F3/044 , G06F2203/04102 , G06F2203/04106
摘要： Disclosed is a flexible display device adapted to accurately detect bending information when the flexible display device is flexed, bent or folded, and to be capable of variously controlling an image displayed on a screen on the basis of the detected bending information. The flexible display device includes a flexible touch screen part, and a bending detection part provided on the touch screen part, the bending detection part having an electrostatic capacitance or electric resistance that changes depending on a bending of the touch screen part, so as to detect bending information.
摘要翻译：公开了一种灵活的显示装置，其适用于当柔性显示装置弯曲，弯曲或折叠时精确地检测弯曲信息，并且能够基于检测到的弯曲信息来各种控制显示在屏幕上的图像。柔性显示装置包括柔性触摸屏部分和设置在触摸屏部分上的弯曲检测部分，弯曲检测部分具有根据触摸屏部分的弯曲而变化的静电电容或电阻，以便检测弯曲信息。

9. 发明申请

US20060142055A1 Printed circuit board structure for mobile terminal 审中-公开
标题翻译：移动终端印刷电路板结构
公开(公告)号：US20060142055A1
公开(公告)日：2006-06-29
申请号：US11114432
申请日：2005-04-26
申请人： Shi-Yun Cho , Young-Min Lee , Jea-Hyuck Lee , Shin-Hee Cho , Kyung-Wan Park
发明人： Shi-Yun Cho , Young-Min Lee , Jea-Hyuck Lee , Shin-Hee Cho , Kyung-Wan Park
IPC分类号： H04B1/28 , H04M1/00
CPC分类号： H01L25/162 , H01L23/50 , H01L23/66 , H01L2924/0002 , H01L2924/15192 , H01L2924/15311 , H01L2924/19105 , H05K1/0231 , H05K1/0237 , H05K1/0262 , H05K1/141 , H05K1/147 , H05K2201/10689 , H01L2924/00
摘要： A printed circuit board structure for a mobile terminal including a main printed circuit board including elements required for functions of the mobile terminal and mounted on an upper surface of the main printed circuit board, and an auxiliary printed circuit board laminated on the main printed circuit board including at least one element further required for the functions of the mobile terminal and mounted on an upper surface of the auxiliary printed circuit board.
摘要翻译：一种用于移动终端的印刷电路板结构，包括主印刷电路板，其包括移动终端的功能所需的元件，并且安装在主印刷电路板的上表面上，以及叠层在主印刷电路板上的辅助印刷电路板包括移动终端的功能进一步需要并安装在辅助印刷电路板的上表面上的至少一个元件。

10. 发明申请

US20050006654A1 Semiconductor monolithic integrated optical transmitter 失效
标题翻译：半导体单片集成光发射机
公开(公告)号：US20050006654A1
公开(公告)日：2005-01-13
申请号：US10716653
申请日：2003-11-19
申请人： Byung-Kwon Kang , Shi-Yun Cho , In Kim , Do-Young Rhee , Tae-Il Kim , Dong-Hoon Jang , Seung-Won Lee , Duk-Ho Jeon , June-Hyeon Ahn , Young-Min Lee , Jong-Ryeol Kim
发明人： Byung-Kwon Kang , Shi-Yun Cho , In Kim , Do-Young Rhee , Tae-Il Kim , Dong-Hoon Jang , Seung-Won Lee , Duk-Ho Jeon , June-Hyeon Ahn , Young-Min Lee , Jong-Ryeol Kim
IPC分类号： G02B6/12 , H01L33/00 , H01S5/026
CPC分类号： H01S5/026 , H01S5/0265
摘要： A semiconductor monolithic integrated optical transmitter including a plurality of active layers formed on a semiconductor substrate is disclosed, which comprises: a distributed feedback laser diode including a grating for reflecting light with a predetermined wavelength and a first active layer for oscillating received light from the grating; an electro-absorption modulator including a second active layer for receiving light from the first active layer, wherein the received light intensity is modulated through a change of absorbency in accordance with an applied voltage; an optical amplifier including a third active layer for amplifying received light from the second active layer; a first optical attenuator between the first active layer and the second active layer; and a second optical attenuator between the second active layer and the third active layer.
摘要翻译：公开了一种包括形成在半导体衬底上的多个有源层的半导体单片集成光发射器，其包括：分布反馈激光二极管，包括用于反射具有预定波长的光的光栅和用于振荡来自光栅的接收光的第一有源层 ; 一种电吸收调制器，包括用于接收来自第一有源层的光的第二有源层，其中根据施加的电压通过吸收变化改变接收的光强度; 光放大器，包括用于放大来自第二有源层的接收光的第三有源层; 第一有源层和第二有源层之间的第一光衰减器; 以及在第二有源层和第三有源层之间的第二光衰减器。

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