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1. 发明申请

US20130315722A1 PRESSURE RELEASE SLOT FOR FAN NOISE IMPROVEMENT 有权
标题翻译：压力释放槽用于风扇噪声改进
公开(公告)号：US20130315722A1
公开(公告)日：2013-11-28
申请号：US13478188
申请日：2012-05-23
申请人： Sang Bae Park
发明人： Sang Bae Park
IPC分类号： F03B11/02
CPC分类号： F01P11/12
摘要： A fan shroud includes a body portion and a barrel portion. The body portion and the barrel portion have a first side and a second side. The barrel portion is adjacent to the body portion and defines a cylindrical opening for a fan. The barrel portion and the body portion define a slot in the fan shroud designed to release excess air pressure from the shroud. The slot extends through at least one of the first side and the second side. Any number of slots of different shapes and sizes may be arranged on the fan shroud to reduce noise radiating from the fan shroud.
摘要翻译：风扇罩包括主体部分和筒部。主体部分和筒部具有第一侧和第二侧。筒体部分与主体部分相邻并且限定了用于风扇的圆柱形开口。枪管部分和主体部分限定了风扇护罩中的狭槽，其设计成从护罩释放过多的空气压力。狭槽延伸穿过第一侧和第二侧中的至少一个。可以在风扇罩上布置不同形状和尺寸的任何数量的狭槽，以减少从风扇罩辐射的噪音。

2. 发明申请

US20070164402A1 Semiconductor package and process for making the same 有权
公开(公告)号：US20070164402A1
公开(公告)日：2007-07-19
申请号：US11332891
申请日：2006-01-17
申请人： Dae-Hoon Jung , Seok-Won Lee , Sang-Bae Park
发明人： Dae-Hoon Jung , Seok-Won Lee , Sang-Bae Park
IPC分类号： H01L23/495
CPC分类号： H01L23/3107 , G01L19/141 , H01L23/49575 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/1433 , H01L2924/15747 , H01L2924/181 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package mainly includes a leadframe and a first semiconductor chip such as an application specific integrated circuit (ASIC) encapsulated in a first package body having a cavity for receiving a second semiconductor chip such as a pressure sensor chip, and a cover disposed over the cavity of the first package body. At least a portion of the first package body is formed between the second semiconductor chip and the die pad such that the second semiconductor chip is directly disposed on the portion of the first package body instead of the die pad.

3. 发明授权

US08281848B2 Spring mounting feature for heat exchanger 失效
标题翻译：热交换器的弹簧安装特性
公开(公告)号：US08281848B2
公开(公告)日：2012-10-09
申请号：US12008968
申请日：2008-01-15
申请人： Sang Bae Park
发明人： Sang Bae Park
IPC分类号： F28F9/007
CPC分类号： F28D1/0435 , F28F9/002
摘要： A heat exchanger assembly includes a first heat exchanger having a pair of mounts attached to one of the tanks of the first heat exchanger and a second heat exchanger having a pair of brackets attached to one of the tanks of the second heat exchanger. The brackets are freely insertable into the mounts when the two heat exchangers are at an acute angle with respect to each other. When the two heat exchangers are parallel with each other, an interference condition exists between the brackets and the mounts. The opposite side of the heat exchangers is secured using a retainer on one heat exchanger extending through a strap on the other heat exchanger.
摘要翻译：热交换器组件包括第一热交换器，其具有附接到第一热交换器的一个罐的一对安装件和具有附接到第二热交换器的一个罐的一对支架的第二热交换器。当两个热交换器相对于彼此成锐角时，托架可自由地插入到安装件中。当两个热交换器彼此平行时，支架和支架之间存在干涉条件。热交换器的相反侧通过一个热交换器上的保持器固定，该热交换器延伸穿过另一热交换器上的带。

4. 发明授权

US07282786B2 Semiconductor package and process for making the same 有权
标题翻译：半导体封装和制造相同的工艺
公开(公告)号：US07282786B2
公开(公告)日：2007-10-16
申请号：US11332891
申请日：2006-01-17
申请人： Dae-Hoon Jung , Seok-Won Lee , Sang-Bae Park
发明人： Dae-Hoon Jung , Seok-Won Lee , Sang-Bae Park
IPC分类号： H01L23/495
CPC分类号： H01L23/3107 , G01L19/141 , H01L23/49575 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/1433 , H01L2924/15747 , H01L2924/181 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package mainly includes a leadframe and a first semiconductor chip such as an application specific integrated circuit (ASIC) encapsulated in a first package body having a cavity for receiving a second semiconductor chip such as a pressure sensor chip, and a cover disposed over the cavity of the first package body. At least a portion of the first package body is formed between the second semiconductor chip and the die pad such that the second semiconductor chip is directly disposed on the portion of the first package body instead of the die pad.
摘要翻译：半导体封装主要包括引线框和封装在第一封装主体中的专用集成电路（ASIC）的第一半导体芯片，该第一封装主体具有用于接收诸如压力传感器芯片的第二半导体芯片的空腔，第一包装体的腔体。第一封装体的至少一部分形成在第二半导体芯片和管芯焊盘之间，使得第二半导体芯片直接设置在第一封装体的部分上而不是管芯焊盘。

5. 发明授权

US07087462B1 Method for forming leadless semiconductor packages 有权
标题翻译：无铅半导体封装形成方法
公开(公告)号：US07087462B1
公开(公告)日：2006-08-08
申请号：US11160070
申请日：2005-06-07
申请人： Sang-Bae Park , Yong-Gill Lee , Hyung-Jun Park , Chang-Young Sohn
发明人： Sang-Bae Park , Yong-Gill Lee , Hyung-Jun Park , Chang-Young Sohn
IPC分类号： H01L21/44
CPC分类号： H01L21/561 , H01L23/3107 , H01L23/49548 , H01L23/49582 , H01L24/48 , H01L24/97 , H01L2221/68377 , H01L2224/05599 , H01L2224/48091 , H01L2224/48247 , H01L2224/484 , H01L2224/85399 , H01L2224/85439 , H01L2224/97 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2924/30107 , H01L2224/85 , H01L2224/45099 , H01L2924/00012
摘要： The present invention includes providing a leadframe including a metal layer formed on an upper surface of the leadframe and a plurality of units in an array arrangement, in which each unit includes a die pad, a plurality of leads, and a plurality of outer dambars, adhering a die to the die pad, forming a plurality of conductive wires to electrically connect bond pads of the die with bond regions of the leads, forming an encapsulation covering the leadframe, forming a patterned photoresist layer on a lower surface of the leadframe to expose a plurality of interval regions and the outer dambars, performing an etching process to expose the metal layer located in the interval regions and the outer dambars, cutting off the metal layer located in the interval regions by a half cutting process, and performing a singulation process to singulate the units.
摘要翻译：本发明包括提供一种引线框，其包括形成在引线框的上表面上的金属层和阵列布置中的多个单元，其中每个单元包括管芯焊盘，多个引线和多个外部堤坝，将管芯附接到管芯焊盘，形成多个导电线以将管芯的接合焊盘与引线的接合区域电连接，形成覆盖引线框架的封装，在引线框架的下表面上形成图案化的光致抗蚀剂层以暴露多个间隔区域和外部堤坝，进行蚀刻处理以暴露位于间隔区域中的金属层和外部堤坝，通过半切割过程切割位于间隔区域中的金属层，并执行单个切割处理单位单位。

6. 发明授权

US06984878B2 Leadless leadframe with an improved die pad for mold locking 有权
标题翻译：无铅引线框架，具有改进的模具垫用于模具锁定
公开(公告)号：US06984878B2
公开(公告)日：2006-01-10
申请号：US10851112
申请日：2004-05-24
申请人： Sang-Bae Park , Yong-Gill Lee , Hyung-Jun Park , Kyung-Soo Rho , Jin-Hee Won
发明人： Sang-Bae Park , Yong-Gill Lee , Hyung-Jun Park , Kyung-Soo Rho , Jin-Hee Won
IPC分类号： H01L23/495
CPC分类号： H01L24/97 , H01L23/3107 , H01L23/49503 , H01L23/49568 , H01L23/49582 , H01L24/15 , H01L24/48 , H01L2224/0401 , H01L2224/05599 , H01L2224/05639 , H01L2224/05644 , H01L2224/05655 , H01L2224/13099 , H01L2224/16245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/484 , H01L2224/85399 , H01L2224/85439 , H01L2224/85444 , H01L2924/00014 , H01L2924/01006 , H01L2924/01023 , H01L2924/01028 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/181 , H01L2924/18301 , H01L2924/351 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： A leadless leadframe with an improved die pad for mold locking includes a die pad and a plurality of leads. The leads are arranged around the die pad. A plurality of indentations, such as side semi-vias, are formed on the sidewall of the die pad for filling a package body of the semiconductor package so as to enhance the horizontal mold locking capability of the die pad.
摘要翻译：具有用于模具锁定的改进的芯片焊盘的无引线框架包括芯片焊盘和多个引线。引线布置在管芯焊盘的周围。在管芯焊盘的侧壁上形成多个凹口，例如侧半通孔，用于填充半导体封装的封装体，以增强管芯焊盘的水平模具锁定能力。

7. 发明授权

US09157362B2 Pressure release slot for fan noise improvement 有权
标题翻译：用于风扇噪音改善的压力释放槽
公开(公告)号：US09157362B2
公开(公告)日：2015-10-13
申请号：US13478188
申请日：2012-05-23
申请人： Sang Bae Park
发明人： Sang Bae Park
IPC分类号： F01P11/12
CPC分类号： F01P11/12
摘要： A fan shroud includes a body portion and a barrel portion. The body portion and the barrel portion have a first side and a second side. The barrel portion is adjacent to the body portion and defines a cylindrical opening for a fan. The barrel portion and the body portion define a slot in the fan shroud designed to release excess air pressure from the shroud. The slot extends through at least one of the first side and the second side. Any number of slots of different shapes and sizes may be arranged on the fan shroud to reduce noise radiating from the fan shroud.
摘要翻译：风扇罩包括主体部分和筒部。主体部分和筒部具有第一侧和第二侧。筒体部分与主体部分相邻并且限定了用于风扇的圆柱形开口。枪管部分和主体部分限定了风扇护罩中的狭槽，其设计成从护罩释放过多的空气压力。狭槽延伸穿过第一侧和第二侧中的至少一个。可以在风扇罩上布置不同形状和尺寸的任何数量的狭槽，以减少从风扇罩辐射的噪音。

8. 发明申请

US20050258521A1 LEADLESS LEADFRAME WITH AN IMPROVED DIE PAD FOR MOLD LOCKING 有权
标题翻译：无铅LEADFRAME与改进的模具用于模具锁定
公开(公告)号：US20050258521A1
公开(公告)日：2005-11-24
申请号：US10851112
申请日：2004-05-24
申请人： Sang-Bae Park , Yong-Gill Lee , Hyung-Jun Park , Kyung-Soo Rho , Jin-Hee Won
发明人： Sang-Bae Park , Yong-Gill Lee , Hyung-Jun Park , Kyung-Soo Rho , Jin-Hee Won
IPC分类号： H01L21/58 , H01L23/31 , H01L23/495
CPC分类号： H01L24/97 , H01L23/3107 , H01L23/49503 , H01L23/49568 , H01L23/49582 , H01L24/15 , H01L24/48 , H01L2224/0401 , H01L2224/05599 , H01L2224/05639 , H01L2224/05644 , H01L2224/05655 , H01L2224/13099 , H01L2224/16245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/484 , H01L2224/85399 , H01L2224/85439 , H01L2224/85444 , H01L2924/00014 , H01L2924/01006 , H01L2924/01023 , H01L2924/01028 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/181 , H01L2924/18301 , H01L2924/351 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： A leadless leadframe with an improved die pad for mold locking includes a die pad and a plurality of leads. The leads are arranged around the die pad. A plurality of indentations, such as side semi-vias, are formed on the sidewall of the die pad for filling a package body of the semiconductor package so as to enhance the horizontal mold locking capability of the die pad.
摘要翻译：具有用于模具锁定的改进的芯片焊盘的无引线框架包括芯片焊盘和多个引线。引线布置在管芯焊盘的周围。在管芯焊盘的侧壁上形成多个凹口，例如侧半通孔，用于填充半导体封装的封装体，以增强管芯焊盘的水平模具锁定能力。

9. 发明授权

US07703730B2 Fastenerless attachment system applied to vehicle engine cooling module components 有权
标题翻译：紧固件连接系统应用于车辆发动机冷却模块组件
公开(公告)号：US07703730B2
公开(公告)日：2010-04-27
申请号：US11584392
申请日：2006-10-20
申请人： William F. Best, Jr. , Christopher Wisniewski , Sang Bae Park
发明人： William F. Best, Jr. , Christopher Wisniewski , Sang Bae Park
IPC分类号： A47B96/06
CPC分类号： F01P3/18 , F01P2070/50
摘要： A fastening system fastens a radiator, an electric fan support and a fan shroud as a single unit. The radiator has lower and upper posts to which slotted plates protruding from the fan support and fan shroud fit over. A structural sandwich is formed with the fan support lying between the radiator and the fan shroud. A flexible lever arm with a locking tab lies adjacent to the upper post of the radiator and connects to the radiator. When the fan support is fitted over the posts, the top plate of the electric fan support locks under the first lever arm tab. The fan shroud also has two slotted plates that also fit over the posts of the radiator. The fan shroud locks into place when a lever arm with a tab on the fan shroud locks under a tab that protrudes from the top plate of the fan support.
摘要翻译：紧固系统将散热器，电风扇支架和风扇罩固定为一个单元。散热器具有下部和上部柱，其中开槽板从风扇支撑件和风扇罩罩配合到其上。形成结构三明治，风扇支架位于散热器和风扇罩之间。具有锁定突出部的柔性杠杆臂邻近散热器的上部柱体并且连接到散热器。当风扇支撑件安装在柱上时，电风扇的顶板支撑在第一杠杆臂突出部下方锁定。风扇罩还有两个开槽板，也可以放在散热器的柱上。当具有风扇罩上的突出部的杠杆臂锁定在从风扇支架的顶板突出的突出部下方时，风扇罩锁定到位。

10. 发明申请

US20090178781A1 Spring mounting feature for heat exchanger 失效
标题翻译：热交换器的弹簧安装特性
公开(公告)号：US20090178781A1
公开(公告)日：2009-07-16
申请号：US12008968
申请日：2008-01-15
申请人： Sang Bae Park
发明人： Sang Bae Park
IPC分类号： F28F9/007 , F28D1/00
CPC分类号： F28D1/0435 , F28F9/002
摘要： A heat exchanger assembly includes a first heat exchanger having a pair of mounts attached to one of the tanks of the first heat exchanger and a second heat exchanger having a pair of brackets attached to one of the tanks of the second heat exchanger. The brackets are freely insertable into the mounts when the two heat exchangers are at an acute angle with respect to each other. When the two heat exchangers are parallel with each other, an interference condition exists between the brackets and the mounts. The opposite side of the heat exchangers is secured using a retainer on one heat exchanger extending through a strap on the other heat exchanger.
摘要翻译：热交换器组件包括第一热交换器，其具有附接到第一热交换器的一个罐的一对安装件和具有附接到第二热交换器的一个罐的一对支架的第二热交换器。当两个热交换器相对于彼此成锐角时，托架可自由地插入到安装件中。当两个热交换器彼此平行时，支架和支架之间存在干涉条件。热交换器的相反侧通过一个热交换器上的保持器固定，该热交换器延伸穿过另一热交换器上的带。

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