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    • 3. 发明公开
    • Aerogel-open cell foam composite
    • AIRGEL-OPEN CELL FOAM COMPOSITE
    • KR20120054389A
    • 2012-05-30
    • KR20100115743
    • 2010-11-19
    • SAMSUNG FINE CHEMICALS CO LTD
    • AHN JI SOOYOON KI CHEOLCHUN JONG PILBYUN KIL SEUK
    • C04B38/00C04B14/00C04B24/24C04B26/02
    • C04B38/08C04B14/02C04B24/24C04B38/0051C04B2201/20
    • PURPOSE: An aerogel-open cell form complex is provided to improve mechanical strength and thermal ability by controlling ratio between total specific surface area of the aerogel - open-cell foam composite and the aerogel. CONSTITUTION: An aerogel-open cell form complex comprises an open-cell foam and an aerogel. A total specific surface area(SAc) ratio(SAc/SAa) of the aerogel-open-cell foam composite compare to the specific surface area(SAa) of the aerogel is 0.7-0.9. The open-cell foam includes pores and skeletons, and a width of the skeleton is 20-80 micro meters. The open-cell foam comprises polymer materials. In the open-cell foam, a volume ratio of pore is 85-95%. A density of the open-cell foam is 0.01-0.4g/cm^3. The aerogel is selected from inorganic aerogel, organic aerogel, and an organic-inorganic hybrid aerogel. A density of the aerogel-open-cell foam composite is 0.08-0.30g/ cm^3. A thermal conductivity of the aerogel-open-cell foam composite is 20mW/mK or less.
    • 目的:通过控制气凝胶 - 开孔泡沫复合材料和气凝胶的总比表面积之比,提供气凝胶开孔复合物,以提高机械强度和热能。 构成:气凝胶开放的细胞形式复合物包括开孔泡沫和气凝胶。 气凝胶 - 开孔泡沫复合材料的总比表面积(SAc)比(SAc / SAa)与气凝胶的比表面积(SAa)相比为0.7-0.9。 开孔泡沫包括孔和骨架,骨架的宽度为20-80微米。 开孔泡沫包括聚合物材料。 在开孔泡沫中,孔的体积比为85-95%。 开孔泡沫的密度为0.01-0.4g / cm 3。 气凝胶选自无机气凝胶,有机气凝胶和有机 - 无机混合气凝胶。 气凝胶 - 开孔泡沫复合材料的密度为0.08-0.30g / cm 3。 气凝胶 - 开孔泡沫复合材料的导热系数为20mW / mK以下。
    • 4. 发明公开
    • Aerogel-open cell foam composite
    • AIRGEL-OPEN CELL FOAM COMPOSITE
    • KR20120051513A
    • 2012-05-22
    • KR20100112996
    • 2010-11-12
    • SAMSUNG FINE CHEMICALS CO LTD
    • YOON KI CHEOLCHUN JONG PILAHN JI SOOBYUN KIL SEUK
    • C08J9/00C08K3/22C08K7/22C08L101/00
    • PURPOSE: An aerogel-open cell foam composite is provided to improve flexural strength without degradation of insulating ability by comprising open-cell foam of which frame width is wide. CONSTITUTION: An aerogel-open cell foam composite comprises open-cell foam, and aerogel, and the flexural strength is 35N/cm^2 or higher. The open-cell foam comprises pores and a frame. The width of the frame is 20-80 micron. The open-cell foam comprises at least one selected from a group consisting of polycarbonate-polyurethane copolymer, polyolefins, polyurethanes, phenolics, polycarbonate, acrylonitrile butadiene styrene, a methylmethacrylate-styrene copolymer, cellulose acetate, and polystyrene.
    • 目的:提供气凝胶开孔泡沫复合材料,以通过包括宽度宽的开孔泡沫来提高抗弯强度而不降低绝缘能力。 构成:气凝胶开孔泡沫复合材料包括开孔泡沫和气凝胶,抗弯强度为35N / cm ^ 2或更高。 开孔泡沫包括孔和框架。 框架的宽度为20-80微米。 开孔泡沫体包括选自聚碳酸酯 - 聚氨酯共聚物,聚烯烃,聚氨酯,酚醛树脂,聚碳酸酯,丙烯腈丁二烯苯乙烯,甲基丙烯酸甲酯 - 苯乙烯共聚物,乙酸纤维素和聚苯乙烯中的至少一种。
    • 10. 发明公开
    • Aerogel-open cell foam composite
    • AIRGEL-OPEN CELL FOAM COMPOSITE
    • KR20120051512A
    • 2012-05-22
    • KR20100112995
    • 2010-11-12
    • SAMSUNG FINE CHEMICALS CO LTD
    • CHUN JONG PILAHN JI SOOYOON KI CHEOLBYUN KIL SEUK
    • C08J9/00C08K3/22C08K7/22C08L101/00
    • PURPOSE: An aerogel-open cell foam composite is provided to improve compressive strength without degradation of insulating ability by comprising open-cell foam of which frame width is wide. CONSTITUTION: An aerogel-open cell foam composite comprises open-cell foam, and aerogel, and the compressive strength is 16N/cm^2 or higher. The open-cell foam comprises pores and a frame. The width of the frame is 20-80 micron. The open ratio of the pores is 85-95%. The density of the open ratio is 0.01-0.4 g/cm^3. The density of the aerogel-open cell foam composite is 0.08~0.30 g/cm^3. The thermal conductivity of the aerogel-open cell foam composite is 20 mW/mk or less.
    • 目的:提供气凝胶开孔泡沫复合材料,通过包括宽度宽的开孔泡沫,提高抗压强度而不降低绝缘能力。 构成:气凝胶开孔泡沫复合材料包括开孔泡沫和气凝胶,抗压强度为16N / cm ^ 2或更高。 开孔泡沫包括孔和框架。 框架的宽度是20-80微米。 孔的开放比为85-95%。 开放比的密度为0.01-0.4g / cm 3。 气凝胶 - 开孔泡沫复合材料的密度为0.08〜0.30g / cm 3。 气凝胶 - 开孔泡沫复合材料的导热系数为20mW / mk以下。