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1. 发明授权

US08754737B2 Large inductance integrated magnetic induction devices and methods of fabricating the same 有权
标题翻译：大电感集成磁感应装置及其制造方法
公开(公告)号：US08754737B2
公开(公告)日：2014-06-17
申请号：US13434848
申请日：2012-03-29
申请人： Johnny Kin On Sin , Rongxiang Wu , Xiangming Fang
发明人： Johnny Kin On Sin , Rongxiang Wu , Xiangming Fang
IPC分类号： H01F5/00 , H01F27/28 , H01L23/522 , H01F17/00 , H01L49/02
CPC分类号： H01L28/10 , H01F17/0033 , H01L23/5227 , H01L2924/0002 , H01L2924/00
摘要： Methods and apparatus described herein are associated with integrated magnetic induction devices. A magnetic induction device can include a groove formed in a substrate, a magnetic core included in the groove and surrounded by a conductive winding that is adjacent to portion(s) of the substrate, and respective insulation layers included between the substrate and the conductive winding and between the magnetic core and the conductive winding. An inductor can further include conductive vias formed in the substrate and connected to respective portions of the conductive winding. Further, a transformer can include a groove formed in a substrate, a closed-loop/gapped magnetic core included in the groove and surrounded by first and second conductive windings that are adjacent to respective portions of the substrate, and respective insulation layers formed between the substrate and the first and second conductive windings, and between the closed-loop/gapped magnetic core and the first and second conductive windings.
摘要翻译：本文所述的方法和装置与集成磁感应装置相关联。磁感应装置可以包括形成在基板中的凹槽，包括在凹槽中并被与基板的一部分相邻的导电绕组包围的磁芯以及包括在基板和导电绕组之间的各个绝缘层并且在磁芯和导电绕组之间。电感器还可以包括形成在衬底中并连接到导电绕组的相应部分的导电通孔。此外，变压器可以包括形成在基板中的凹槽，包括在凹槽中的闭环/间隙磁芯，并且被与基板的相应部分相邻的第一和第二导电绕组围绕，并且在基板以及第一和第二导电绕组之间以及闭环/带隙磁芯与第一和第二导电绕组之间。

2. 发明申请

US20120068301A1 MONOLITHIC MAGNETIC INDUCTION DEVICE 审中-公开
标题翻译：单相磁感应装置
公开(公告)号：US20120068301A1
公开(公告)日：2012-03-22
申请号：US13215350
申请日：2011-08-23
申请人： Johnny Kin On Sin , Rongxiang Wu , Ron Shu Yuen Hui
发明人： Johnny Kin On Sin , Rongxiang Wu , Ron Shu Yuen Hui
IPC分类号： H01L29/86 , H01F5/00 , H01L21/02
CPC分类号： H01L28/10 , H01F27/28 , H01L23/645 , H01L2924/0002 , H01L2924/00
摘要： Providing for a monolithic magnetic induction device having low DC resistance and small surface area is described herein. By way of example, the magnetic induction device can comprise a substrate (e.g., a semiconductor substrate) having trenches formed in a bottom layer of the substrate, and holes formed in the substrate between the trenches and an upper layer of the substrate. Additionally, the magnetic induction device can comprise a conductive coil embedded or deposited within the trenches. The magnetic induction device can further comprise a set of conductive vias formed in the holes that electrically connect the bottom layer of the substrate with the upper layer. Further, one or more integrated circuit components, such as active devices, can be formed in the upper layer, at least in part above the conductive coil. The vias can be utilized to connect to integrated circuit components with the conductive coil, where suitable.
摘要翻译：本文描述了提供具有低直流电阻和小表面积的单片磁感应装置。作为示例，磁感应装置可以包括在衬底的底层中形成有沟槽的衬底（例如，半导体衬底），以及形成在衬底中的沟槽和衬底的上层之间的孔。此外，磁感应装置可以包括嵌入或沉积在沟槽内的导电线圈。磁感应装置还可包括形成在孔中的一组导电通路，其将基底的底层与上层电连接。此外，一个或多个集成电路部件，例如有源器件，可以形成在上层中，至少部分地在导电线圈上方。在合适的情况下，通孔可以用于连接到具有导电线圈的集成电路部件。

3. 发明申请

US20120249282A1 LARGE INDUCTANCE INTEGRATED MAGNETIC INDUCTION DEVICES AND METHODS OF FABRICATING THE SAME 有权
标题翻译：大电感一体化磁感应装置及其制造方法
公开(公告)号：US20120249282A1
公开(公告)日：2012-10-04
申请号：US13434848
申请日：2012-03-29
申请人： Johnny Kin On Sin , Rongxiang Wu , Xiangming Fang
发明人： Johnny Kin On Sin , Rongxiang Wu , Xiangming Fang
IPC分类号： H01F5/00 , H01F41/06
CPC分类号： H01L28/10 , H01F17/0033 , H01L23/5227 , H01L2924/0002 , H01L2924/00
摘要： Methods and apparatus described herein are associated with integrated magnetic induction devices. A magnetic induction device can include a groove formed in a substrate, a magnetic core included in the groove and surrounded by a conductive winding that is adjacent to portion(s) of the substrate, and respective insulation layers included between the substrate and the conductive winding and between the magnetic core and the conductive winding. An inductor can further include conductive vias formed in the substrate and connected to respective portions of the conductive winding. Further, a transformer can include a groove formed in a substrate, a closed-loop/gapped magnetic core included in the groove and surrounded by first and second conductive windings that are adjacent to respective portions of the substrate, and respective insulation layers formed between the substrate and the first and second conductive windings, and between the closed-loop/gapped magnetic core and the first and second conductive windings.
摘要翻译：本文描述的方法和装置与集成磁感应装置相关联。磁感应装置可以包括形成在基板中的凹槽，包括在凹槽中并被与基板的一部分相邻的导电绕组包围的磁芯以及包括在基板和导电绕组之间的各个绝缘层并且在磁芯和导电绕组之间。电感器还可以包括形成在衬底中并连接到导电绕组的相应部分的导电通孔。此外，变压器可以包括形成在基板中的凹槽，包括在凹槽中的闭环/间隙磁芯，并且被与基板的相应部分相邻的第一和第二导电绕组围绕，并且在衬底以及第一和第二导电绕组之间，以及闭环/间隙磁芯与第一和第二导电绕组之间。

4. 发明授权

US09287344B2 Monolithic magnetic induction device 有权
标题翻译：单片磁感应装置
公开(公告)号：US09287344B2
公开(公告)日：2016-03-15
申请号：US13215350
申请日：2011-08-23
申请人： Johnny Kin On Sin , Rongxiang Wu , Ron Shu Yuen Hui
发明人： Johnny Kin On Sin , Rongxiang Wu , Ron Shu Yuen Hui
IPC分类号： H01F27/28 , H01L49/02 , H01L23/64 , H01L27/04
CPC分类号： H01L28/10 , H01F27/28 , H01L23/645 , H01L2924/0002 , H01L2924/00
摘要： Providing for a monolithic magnetic induction device having low DC resistance and small surface area is described herein. By way of example, the magnetic induction device can comprise a substrate (e.g., a semiconductor substrate) having trenches formed in a bottom layer of the substrate, and holes formed in the substrate between the trenches and an upper layer of the substrate. Additionally, the magnetic induction device can comprise a conductive coil embedded or deposited within the trenches. The magnetic induction device can further comprise a set of conductive vias formed in the holes that electrically connect the bottom layer of the substrate with the upper layer. Further, one or more integrated circuit components, such as active devices, can be formed in the upper layer, at least in part above the conductive coil. The vias can be utilized to connect to integrated circuit components with the conductive coil, where suitable.
摘要翻译：本文描述了提供具有低直流电阻和小表面积的单片磁感应装置。作为示例，磁感应装置可以包括在衬底的底层中形成有沟槽的衬底（例如，半导体衬底），以及形成在衬底中的沟槽和衬底的上层之间的孔。此外，磁感应装置可以包括嵌入或沉积在沟槽内的导电线圈。磁感应装置还可包括形成在孔中的一组导电通路，其将基底的底层与上层电连接。此外，可以在上层中至少部分地在导电线圈上方形成诸如有源器件的一个或多个集成电路部件。在合适的情况下，通孔可以用于连接到具有导电线圈的集成电路部件。

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