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2. 发明授权

US07902851B2 Hermeticity testing 有权
标题翻译：密码测试
公开(公告)号：US07902851B2
公开(公告)日：2011-03-08
申请号：US12569474
申请日：2009-09-29
申请人： Andreas Armin Fenner , Geoffrey Batchelder , Paul F. Gerrish , Lary R. Larson , Anna J. Malin , Trevor D. Marrott , Tyler Mueller , David A. Ruben
发明人： Andreas Armin Fenner , Geoffrey Batchelder , Paul F. Gerrish , Lary R. Larson , Anna J. Malin , Trevor D. Marrott , Tyler Mueller , David A. Ruben
IPC分类号： G01R31/02 , G01R31/26
CPC分类号： H05K1/144 , H01L23/3107 , H01L23/3185 , H01L23/564 , H01L24/05 , H01L24/06 , H01L24/80 , H01L24/81 , H01L24/94 , H01L25/0657 , H01L2224/0401 , H01L2224/05541 , H01L2224/0556 , H01L2224/05599 , H01L2224/16 , H01L2224/818 , H01L2224/81894 , H01L2224/83894 , H01L2225/06513 , H01L2924/00014 , H01L2924/0002 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/3025 , H05K1/0298 , H05K1/11 , H05K2201/041 , Y10T29/49117 , Y10T29/49147 , H01L2224/05552 , H01L2924/00
摘要： Electrical circuit apparatus and methods including hermeticity testing structures for testing the hermeticity of the electrical circuit apparatus.
摘要翻译：包括用于测试电路装置的气密性的气密性测试结构的电路装置和方法。

3. 发明申请

US20100324614A1 MEDICAL DEVICE ENCAPSULATED WITHIN BONDED DIES 有权
标题翻译：医疗器械在粘合剂中包封
公开(公告)号：US20100324614A1
公开(公告)日：2010-12-23
申请号：US12487369
申请日：2009-06-18
申请人： Michael F. Mattes , Paul F. Gerrish , Anna J. Malin , Tyler J. Mueller , Geoffrey DeWitt Batchelder , Clark B. Norgaard , Michael A. Schugt , Ralph Danzl , Richard J. O'Brien
发明人： Michael F. Mattes , Paul F. Gerrish , Anna J. Malin , Tyler J. Mueller , Geoffrey DeWitt Batchelder , Clark B. Norgaard , Michael A. Schugt , Ralph Danzl , Richard J. O'Brien
IPC分类号： A61N1/365 , A61B5/03 , A61B5/0215 , A61N1/39
CPC分类号： A61N1/375 , A61N1/3758
摘要： An implantable medical system includes a first die substrate with a first outer surface. The system also includes a second die substrate with a second outer surface. Furthermore, the system includes a medical device with a first portion that is mounted to the first die substrate and a second portion that is mounted to the second die substrate. The first and second die substrates are fixed to each other and substantially hermetically sealed to each other. Also, the medical device is substantially encapsulated between the first and second die substrates. The first portion is electrically connected to the second portion. Moreover, the first and second outer surfaces of the first and second die substrates are directly exposed to a biological material.
摘要翻译：可植入医疗系统包括具有第一外表面的第一模具衬底。该系统还包括具有第二外表面的第二管芯衬底。此外，该系统包括具有安装到第一管芯衬底的第一部分和安装到第二管芯衬底的第二部分的医疗器件。第一和第二管芯基板彼此固定并基本上彼此密封。此外，医疗装置基本上封装在第一和第二管芯基板之间。第一部分电连接到第二部分。此外，第一和第二管芯基板的第一和第二外表面直接暴露于生物材料。

4. 发明授权

US06627917B1 Method and apparatus for wafer-level burn-in 失效
标题翻译：晶圆级老化的方法和装置
公开(公告)号：US06627917B1
公开(公告)日：2003-09-30
申请号：US09557508
申请日：2000-04-25
申请人： Andreas A. Fenner , Lary R. Larson , Paul F. Gerrish , Daniel E. Fulton , James W. Bell , James Thomas May
发明人： Andreas A. Fenner , Lary R. Larson , Paul F. Gerrish , Daniel E. Fulton , James W. Bell , James Thomas May
IPC分类号： H01L2358
CPC分类号： G01R31/2831 , G01R31/316
摘要： Methods and apparatus for burn-in of integrated circuit (IC) dies at the wafer level. In one embodiment, a wafer is fabricated having an array of dies formed thereon wherein the dies are separated by scribe areas. Surrounding each die is one or more ring conductors which are electrically coupled to various circuits on the die via die bond pads. The wafer further includes a series of conductive pads located in an inactive region of the wafer. Electrically connecting the conductive pads to the ring conductors is a series of redundant scribe conductors. During burn-in, a burn-in indicating apparatus located on each die monitors burn-in parameters such as elapsed burn-in time. The indicating apparatus further records the elapsed burn-in time (or other parameter). The indicating apparatus may be subsequently interrogated to verify the burn-in time.
摘要翻译：集成电路（IC）老化的方法和设备在晶圆级处死。在一个实施例中，制造具有在其上形成的模具阵列的晶片，其中模具由划线区域分开。每个管芯周围是一个或多个环形导体，其通过管芯接合焊盘电耦合到管芯上的各种电路。晶片还包括位于晶片的无效区域中的一系列导电焊盘。将导电焊盘电连接到环形导体是一系列冗余划线导体。在老化期间，位于每个管芯上的老化指示装置会监视老化参数，例如经过的老化时间。指示装置还记录经过的老化时间（或其他参数）。随后询问指示装置以验证老化时间。

5. 发明授权

US08666505B2 Wafer-scale package including power source 有权
标题翻译：晶圆级封装，包括电源
公开(公告)号：US08666505B2
公开(公告)日：2014-03-04
申请号：US13016253
申请日：2011-01-28
申请人： Richard J. O'Brien , John K. Day , Paul F. Gerrish , Michael F. Mattes , David A. Ruben , Malcolm K. Grief
发明人： Richard J. O'Brien , John K. Day , Paul F. Gerrish , Michael F. Mattes , David A. Ruben , Malcolm K. Grief
IPC分类号： A61N1/05
CPC分类号： H01L23/12 , A61B5/0031 , A61B5/01 , A61B5/03 , A61B5/11 , A61N1/37211 , A61N1/3758 , B81B2201/0214 , B81B2207/012 , B81C1/0023 , H01L23/58 , H01L25/0655 , H01L2223/6677 , H01L2224/16145 , H01L2224/16225 , H01L2924/1461 , H01L2924/15153 , H01L2924/15192 , H01L2924/15313 , H01L2924/16195 , H01L2924/16251 , H01L2924/19105 , H01L2924/00
摘要： A medical device includes a first substrate, a second substrate, a control module, and an energy storage device. The first substrate includes at least one of a first semiconductor material and a first insulating material. The second substrate includes at least one of a second semiconductor material and a second insulating material. The second substrate is bonded to the first substrate such that the first and second substrates define an enclosed cavity between the first and second substrates. The control module is disposed within the enclosed cavity. The control module is configured to at least one of determine a physiological parameter of a patient and deliver electrical stimulation to the patient. The energy storage device is disposed within the cavity and is configured to supply power to the control module.
摘要翻译：医疗装置包括第一基板，第二基板，控制模块和能量存储装置。第一基板包括第一半导体材料和第一绝缘材料中的至少一个。第二基板包括第二半导体材料和第二绝缘材料中的至少一个。第二基板被结合到第一基板，使得第一和第二基板在第一和第二基板之间限定封闭的空腔。控制模块设置在封闭腔内。控制模块被配置为至少确定患者的生理参数并向患者传递电刺激中的至少一个。能量存储装置设置在空腔内并被配置为向控制模块供电。

6. 发明授权

US08482964B2 Robust SRAM memory cell capacitor plate voltage generator 有权
标题翻译：坚固的SRAM存储单元电容板电压发生器
公开(公告)号：US08482964B2
公开(公告)日：2013-07-09
申请号：US12645039
申请日：2009-12-22
申请人： Kevin K. Walsh , Paul F. Gerrish , Larry E. Tyler , Mark A. Lysinger , David C. McClure , Francois Jacquet
发明人： Kevin K. Walsh , Paul F. Gerrish , Larry E. Tyler , Mark A. Lysinger , David C. McClure , Francois Jacquet
IPC分类号： G11C11/00
CPC分类号： G11C5/14 , G11C5/147 , G11C11/417
摘要： An SRAM having two capacitors connected in series between respective bit storage nodes of each memory cell. The two inverters of the memory cell are powered by a positive voltage and a low voltage. The two capacitors are connected to each other at a common node. A leakage current generator is coupled to the common node. The leakage current generator supplies to the common node a leakage current to maintain a voltage which is approximately halfway between the voltages of the high and low SRAM supplies.
摘要翻译：具有串联连接在每个存储单元的相应位存储节点之间的两个电容器的SRAM。存储单元的两个反相器由正电压和低电压供电。两个电容器在公共节点处彼此连接。泄漏电流发生器耦合到公共节点。泄漏电流发生器向公共节点提供泄漏电流，以保持大约在高和低SRAM电源的电压之间的一半的电压。

7. 发明授权

US08389331B2 Apparatus for restricting moisture ingress 有权
标题翻译：用于限制水分进入的装置
公开(公告)号：US08389331B2
公开(公告)日：2013-03-05
申请号：US13593549
申请日：2012-08-24
申请人： Tyler Mueller , Geoffrey Batchelder , Ralph B. Danzl , Paul F. Gerrish , Anna J. Malin , Trevor D. Marrott , Michael F. Mattes
发明人： Tyler Mueller , Geoffrey Batchelder , Ralph B. Danzl , Paul F. Gerrish , Anna J. Malin , Trevor D. Marrott , Michael F. Mattes
IPC分类号： H01L21/00
CPC分类号： H05K1/144 , H01L23/3107 , H01L23/3185 , H01L23/564 , H01L24/05 , H01L24/06 , H01L24/80 , H01L24/81 , H01L24/94 , H01L25/0657 , H01L2224/0401 , H01L2224/05541 , H01L2224/0556 , H01L2224/05599 , H01L2224/16 , H01L2224/818 , H01L2224/81894 , H01L2224/83894 , H01L2225/06513 , H01L2924/00014 , H01L2924/0002 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/3025 , H05K1/0298 , H05K1/11 , H05K2201/041 , Y10T29/49117 , Y10T29/49147 , H01L2224/05552 , H01L2924/00
摘要： Apparatus and methods to protect circuitry from moisture ingress, e.g., using a metallic structure as part of a moisture ingress barrier.
摘要翻译：保护电路免受水分侵入的装置和方法，例如使用金属结构作为湿气入口屏障的一部分。

8. 发明申请

US20120101540A1 WAFER-SCALE PACKAGE INCLUDING POWER SOURCE 有权
标题翻译：包括电源的WAFER-SCALE包装
公开(公告)号：US20120101540A1
公开(公告)日：2012-04-26
申请号：US13016253
申请日：2011-01-28
申请人： Richard J. O'Brien , John K. Day , Paul F. Gerrish , Michael F. Mattes , David A. Ruben , Malcolm K. Grief
发明人： Richard J. O'Brien , John K. Day , Paul F. Gerrish , Michael F. Mattes , David A. Ruben , Malcolm K. Grief
IPC分类号： A61N1/05 , H01L23/538 , H01L29/84 , H01L31/12
CPC分类号： H01L23/12 , A61B5/0031 , A61B5/01 , A61B5/03 , A61B5/11 , A61N1/37211 , A61N1/3758 , B81B2201/0214 , B81B2207/012 , B81C1/0023 , H01L23/58 , H01L25/0655 , H01L2223/6677 , H01L2224/16145 , H01L2224/16225 , H01L2924/1461 , H01L2924/15153 , H01L2924/15192 , H01L2924/15313 , H01L2924/16195 , H01L2924/16251 , H01L2924/19105 , H01L2924/00
摘要： A medical device includes a first substrate, a second substrate, a control module, and an energy storage device. The first substrate includes at least one of a first semiconductor material and a first insulating material. The second substrate includes at least one of a second semiconductor material and a second insulating material. The second substrate is bonded to the first substrate such that the first and second substrates define an enclosed cavity between the first and second substrates. The control module is disposed within the enclosed cavity. The control module is configured to at least one of determine a physiological parameter of a patient and deliver electrical stimulation to the patient. The energy storage device is disposed within the cavity and is configured to supply power to the control module.
摘要翻译：医疗装置包括第一基板，第二基板，控制模块和能量存储装置。第一基板包括第一半导体材料和第一绝缘材料中的至少一个。第二基板包括第二半导体材料和第二绝缘材料中的至少一个。第二基板被结合到第一基板，使得第一和第二基板在第一和第二基板之间限定封闭的空腔。控制模块设置在封闭腔内。控制模块被配置为至少确定患者的生理参数并向患者传递电刺激中的至少一个。能量存储装置设置在空腔内并被配置为向控制模块供电。

9. 发明授权

US08072056B2 Apparatus for restricting moisture ingress 有权
标题翻译：用于限制水分进入的装置
公开(公告)号：US08072056B2
公开(公告)日：2011-12-06
申请号：US12569504
申请日：2009-09-29
申请人： Tyler Mueller , Geoffrey Batchelder , Ralph B. Danzl , Paul F. Gerrish , Anna J. Malin , Trevor D. Marrott , Michael F. Mattes
发明人： Tyler Mueller , Geoffrey Batchelder , Ralph B. Danzl , Paul F. Gerrish , Anna J. Malin , Trevor D. Marrott , Michael F. Mattes
IPC分类号： H01L23/02
CPC分类号： H05K1/144 , H01L23/3107 , H01L23/3185 , H01L23/564 , H01L24/05 , H01L24/06 , H01L24/80 , H01L24/81 , H01L24/94 , H01L25/0657 , H01L2224/0401 , H01L2224/05541 , H01L2224/0556 , H01L2224/05599 , H01L2224/16 , H01L2224/818 , H01L2224/81894 , H01L2224/83894 , H01L2225/06513 , H01L2924/00014 , H01L2924/0002 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/3025 , H05K1/0298 , H05K1/11 , H05K2201/041 , Y10T29/49117 , Y10T29/49147 , H01L2224/05552 , H01L2924/00
摘要： Apparatus and methods to protect circuitry from moisture ingress, e.g., using a metallic structure as part of a moisture ingress barrier.
摘要翻译：保护电路免受水分侵入的装置和方法，例如使用金属结构作为湿气入口屏障的一部分。

10. 发明申请

US20100315110A1 HERMETICITY TESTING 有权
标题翻译：感染测试
公开(公告)号：US20100315110A1
公开(公告)日：2010-12-16
申请号：US12569474
申请日：2009-09-29
申请人： Andreas Armin Fenner , Geoffrey Batchelder , Paul F. Gerrish , Lary R. Larson , Anna J. Malin , Trevor D. Marrott , Tyler Mueller , David A. Ruben
发明人： Andreas Armin Fenner , Geoffrey Batchelder , Paul F. Gerrish , Lary R. Larson , Anna J. Malin , Trevor D. Marrott , Tyler Mueller , David A. Ruben
IPC分类号： G01R31/02 , G01R1/04
CPC分类号： H05K1/144 , H01L23/3107 , H01L23/3185 , H01L23/564 , H01L24/05 , H01L24/06 , H01L24/80 , H01L24/81 , H01L24/94 , H01L25/0657 , H01L2224/0401 , H01L2224/05541 , H01L2224/0556 , H01L2224/05599 , H01L2224/16 , H01L2224/818 , H01L2224/81894 , H01L2224/83894 , H01L2225/06513 , H01L2924/00014 , H01L2924/0002 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/3025 , H05K1/0298 , H05K1/11 , H05K2201/041 , Y10T29/49117 , Y10T29/49147 , H01L2224/05552 , H01L2924/00
摘要： Electrical circuit apparatus and methods including hermeticity testing structures for testing the hermeticity of the electrical circuit apparatus.
摘要翻译：包括用于测试电路装置的气密性的气密性测试结构的电路装置和方法。

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