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1. 发明申请

US20070017699A1 Circuit board 审中-公开
标题翻译：电路板
公开(公告)号：US20070017699A1
公开(公告)日：2007-01-25
申请号：US11486028
申请日：2006-07-14
申请人： Toshio Ishimoto , Toshihiko Sasaki , Naofumi Okayama , Masayoshi Terashima
发明人： Toshio Ishimoto , Toshihiko Sasaki , Naofumi Okayama , Masayoshi Terashima
IPC分类号： H05K1/11 , H05K1/18
CPC分类号： H05K3/306 , H05K3/3447 , H05K3/3452 , H05K3/3468 , H05K3/4069 , H05K2201/0367 , H05K2201/09909 , H05K2201/10651 , H05K2201/2036 , H05K2203/1178
摘要： A pair of through holes are formed in a circuit board, and a silver paste filled up in the through holes connects lands formed on a front surface and a rear surface of the circuit board, respectively to each other. When the silver paste is solidified, the silver paste bulges curvedly from the front and rear surfaces of the circuit board and forms a bump. A surface of the bump is covered with an overcoat. An electronic component is brought into contact with the bump, thereby forming a degassing gap between the electronic component and the circuit board. A gas generated during soldering is discharged from the penetrating hole, into which the lead terminal is inserted, to an outside via the gap between the electronic component and the circuit board.
摘要翻译：一对通孔形成在电路板中，并且填充在通孔中的银浆分别将形成在电路板的前表面和后表面上的焊盘彼此连接。当银膏凝固时，银膏从电路板的前表面和后表面弯曲地凸起并形成凸起。凸起的表面被外涂层覆盖。电子部件与凸块接触，从而在电子部件和电路板之间形成脱气间隙。在焊接期间产生的气体经由电子部件和电路板之间的间隙从引导端子插入的贯通孔排出到外部。

2. 发明申请

US20070074088A1 Disk reproducing apparatus and disk reproducing method 审中-公开
标题翻译：磁盘重放装置和磁盘重放方法
公开(公告)号：US20070074088A1
公开(公告)日：2007-03-29
申请号：US11506854
申请日：2006-08-21
申请人： Naofumi Okayama , Kiyozumi Gotou
发明人： Naofumi Okayama , Kiyozumi Gotou
IPC分类号： G11C29/00
CPC分类号： G11B20/1883 , G11B2020/10537 , G11B2020/1823 , G11B2020/1826 , G11B2220/20 , G11B2220/2537
摘要： The invention provides a disk reproducing apparatus and a disk reproducing method capable of reducing constrained reproduction by reproducing another type of reproducible data for the portion in which the designated type of data cannot be reproduced. In step S250, it is determined whether there is an error in the reproducing audio data or not, and if there is an error in the reproducing audio data, the procedure advances to step S260. In step S260, it is determined whether there are errors in all the audio data, and if there are errors in all the data, the procedure advances to step S270, whereas if not, the procedure advances to step S310. In step S270, it is determined that audio is not to be output. In step S310 and onward, other reproducible data are reproduced.
摘要翻译：本发明提供了一种盘再现装置和盘重放方法，其能够通过再现其中指定类型的数据不能被再现的部分再现另一种类型的可重现数据来减少约束再现。在步骤S250中，确定再现音频数据中是否存在错误，如果再现音频数据有错误，则过程前进到步骤S 260。在步骤S260中，确定所有音频数据中是否存在错误，并且如果在所有数据中存在错误，则过程前进到步骤S 270，否则，过程前进到步骤3101。在步骤S 270中，确定不输出音频。在步骤S310中，再次再现其他可重现的数据。

3. 发明申请

US20050284653A1 Condition display method and wiring board for wiring board design 审中-公开
标题翻译：布线板设计条件显示方式和接线板
公开(公告)号：US20050284653A1
公开(公告)日：2005-12-29
申请号：US11157822
申请日：2005-06-22
申请人： Naofumi Okayama
发明人： Naofumi Okayama
IPC分类号： H05K1/00 , H05K1/14 , H05K1/18 , H05K3/00
CPC分类号： H05K3/0005 , H05K1/141 , H05K1/18 , H05K2201/10189 , H05K2201/10515
摘要： When designing and arranging an electronic part such as a PC card connector on a wiring board using a CAD device, it is an object of the present invention to provide a condition display method for a wiring board design with excellent practicability capable of efficiently arranging other electronic parts lower than the height of a gap produced between the card connector and the underlying wiring board in the gap area. The method includes the steps of reading shape/size data of a PC card connector or the like producing a gap in an underlying part from an electronic parts catalog thereof, inputting gap area data and height limits which falls within an allowable height range in the gap area in a CAD menu of the wiring board design CAD device, thereby partitioning and displaying mountable areas with a height limit on a drawing of the wiring board with lines indicating the areas and displaying height limits of electronic parts that can be arranged in the mountable areas.
摘要翻译：当使用CAD装置在布线板上设计和布置诸如PC卡连接器的电子部件时，本发明的目的是提供一种具有优异实用性的布线板设计的条件显示方法，能够有效地布置其他电子部分低于在间隙区域中卡连接器和底层布线板之间产生的间隙的高度。该方法包括以下步骤：从其电子零件目录中读取PC卡连接器等的形状/尺寸数据，从而在底层部分中产生间隙，输入间隙区域数据和位于间隙中的允许高度范围内的高度限制在布线板设计CAD设备的CAD菜单中的区域，从而在布线板的图形上划分并显示具有高度限制的可安装区域，线路指示可布置在可安装区域中的电子部件的区域和显示高度限制。

4. 发明申请

US20060067062A1 Electronic apparatus incorporating printed circuit board with grounding land 审中-公开
标题翻译：电子设备结合印刷电路板与接地层
公开(公告)号：US20060067062A1
公开(公告)日：2006-03-30
申请号：US11226305
申请日：2005-09-15
申请人： Toshio Ishimoto , Naofumi Okayama , Toshihiko Sasaki
发明人： Toshio Ishimoto , Naofumi Okayama , Toshihiko Sasaki
IPC分类号： H05K7/04 , H05K7/06
CPC分类号： H05K9/0039 , H05K1/0215 , H05K3/325 , H05K3/3452 , H05K3/3457 , H05K2201/099 , H05K2201/10409
摘要： To provide a grounding structure for connecting and fixing a printed circuit board and a conductive frame to a conductive chassis of an electronic apparatus, the height of solder applied to the grounding land is made uniform, thereby ensuring electrical connection between the printed circuit board and the conductive chassis. A copper-foil coating 54 formed on a printed circuit board 50 is divided by a substantially-lattice-shaped resist 55 to form a grounding land 56 including a plurality of obliquely elongated land elements 56c in an area close to the edge of an opening 51 and a plurality of rhombic land elements 56a in the remaining area, and the grounding land 56 is brought into contact with and screw-clamped to a conductive chassis 60 using a locking leg 41.
摘要翻译：为了提供一种用于将印刷电路板和导电框架连接和固定到电子设备的导电底盘的接地结构，施加到接地台面的焊料的高度被均匀，从而确保印刷电路板和导电底盘。形成在印刷电路板50上的铜箔涂层54由基本上格子状的抗蚀剂55分开，以形成接地片56，该接地片56包括在接近开口边缘的区域中的多个倾斜细长的接地元件56c 51和其余区域中的多个菱形陆片元件56a，并且接地平台56使用锁定腿41与导电底盘60接触并螺纹夹紧。

5. 发明申请

US20070020959A1 Circuit board including jacks 审中-公开
标题翻译：电路板包括千斤顶
公开(公告)号：US20070020959A1
公开(公告)日：2007-01-25
申请号：US11486027
申请日：2006-07-14
申请人： Toshihiko Sasaki , Toshio Ishimoto , Masayoshi Terashima , Naofumi Okayama
发明人： Toshihiko Sasaki , Toshio Ishimoto , Masayoshi Terashima , Naofumi Okayama
IPC分类号： H05K1/00
CPC分类号： H05K3/306 , H01R12/7011 , H01R13/64 , H05K2201/10189 , H05K2201/10446 , H05K2201/10568 , H05K2201/10598 , H05K2203/167 , H05K2203/168
摘要： A plurality of jacks are a video signal jack, a left audio signal jack, and a right audio signal jack from left to right. Jack fixing protrusions are formed on a surface of each jack which surface is attached to a circuit board. The jack fixing protrusions are arranged differently among the respective jacks, and can be inserted only into attachment portions of the circuit board corresponding to the respective jacks. Namely, insertion of the respective jacks into incorrect attachment portions is made physically impossible, and erroneous insertion of the jacks can be prevented.
摘要翻译：多个插孔是从左到右的视频信号插孔，左音频信号插孔和右音频信号插孔。千斤顶固定突起形成在每个千斤顶的表面附接到电路板的表面上。千斤顶固定突起在各个插孔之间布置不同，并且可以仅插入到对应于各个插孔的电路板的安装部分中。也就是说，将各个千斤顶插入错误的安装部分在物理上是不可能的，并且可以防止插座的错误插入。

6. 发明申请

US20060200332A1 CAD system for a printed circuit board 审中-公开
标题翻译： CAD系统印刷电路板
公开(公告)号：US20060200332A1
公开(公告)日：2006-09-07
申请号：US11350788
申请日：2006-02-10
申请人： Toshio Ishimoto , Naofumi Okayama , Toshihiko Sasaki
发明人： Toshio Ishimoto , Naofumi Okayama , Toshihiko Sasaki
IPC分类号： G06F17/50 , G06G7/62
CPC分类号： G06F17/5068 , H05K1/0269 , H05K3/0002 , H05K3/0005 , H05K3/0082 , H05K3/064 , H05K2201/09918 , H05K2203/056
摘要： A pattern design of a film for manufacturing a printed circuit board is made by using a CAD system, and a plurality of types of Gerber data are produced in which a series of various data has been encoded. For example, a pattern film is formed by combining pattern Gerber data with pattern cut Gerber data. Data for check marks whose sizes are different from each other is added as well as pattern data to each Gerber data such that their central coordinates are to be the same. In this manner, a judgment mark having the check marks combined therewith is formed on the pattern film having the items of Gerber data combined therewith.
摘要翻译：通过使用CAD系统制造用于制造印刷电路板的胶片的图案设计，并且生成多种类型的格柏数据，其中已经编码了一系列各种数据。例如，通过将图案格伯数据与图案切割格伯数据组合来形成图案胶片。将尺寸彼此不同的检查标记的数据以及模式数据添加到每个Gerber数据中，使得它们的中心坐标相同。以这种方式，在具有与其组合的Gerber数据项的图案膜上形成具有与其组合的复选标记的判断标记。

7. 发明申请

US20070121304A1 Printed circuit board with guidance portion for mounting component 审中-公开
标题翻译：印刷电路板，带有用于安装部件的引导部分
公开(公告)号：US20070121304A1
公开(公告)日：2007-05-31
申请号：US11604336
申请日：2006-11-27
申请人： Naofumi Okayama , Yoshiyuki Miyajima , Kiyozumi Gotou
发明人： Naofumi Okayama , Yoshiyuki Miyajima , Kiyozumi Gotou
IPC分类号： H05K7/00
CPC分类号： H05K7/02 , H01R12/7023 , H01R12/7058 , H05K1/119 , H05K3/301 , H05K3/306 , H05K2201/09854 , H05K2201/10189 , H05K2201/10446 , H05K2201/10598 , H05K2201/10863 , H05K2201/2027
摘要： The invention provides a printed circuit board capable of preventing an electronic component from tilting or uplifting without adopting special structures in an existing electronic component. The printed circuit board has an engagement portion and terminal holes and for mounting an electronic component, comprising narrowed portions and having substantially the same width as the mounting leg portions and connecting terminals of the electronic component, and guidance portions having a width wider than the narrowed portion, wherein the mounting leg portions and connecting terminals are inserted to the guidance portion, and the electronic component is moved via sliding motion, by which the mounting leg portions and the connecting terminals are supported tightly in the narrowed portion. Thus, it becomes possible to prevent the displacement or tilt of the electronic component.
摘要翻译：本发明提供一种印刷电路板，其能够防止电子部件在现有电子部件中不采用特殊结构而倾斜或抬起。印刷电路板具有接合部分和端子孔，并且用于安装电子部件，包括狭窄部分，并且具有与电子部件的安装腿部和连接端子基本相同的宽度，以及宽度比狭窄宽度的引导部分其中安装脚部分和连接端子被插入到引导部分中，并且电子部件通过滑动运动移动，安装脚部分和连接端子紧紧地被支撑在狭窄部分中。因此，可以防止电子部件的位移或倾斜。

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