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1. 发明授权

US08241957B2 Negative thermal expansion system (NTES) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging 有权
标题翻译：负热膨胀系统（NTES）装置用于弹性体复合材料中的TCE补偿和微电子封装中的导电弹性体互连
公开(公告)号：US08241957B2
公开(公告)日：2012-08-14
申请号：US12906690
申请日：2010-10-18
申请人： Gareth Geoffrey Hougham , S. Jay Chey , James Patrick Doyle , Xiao Hu Liu , Christopher V. Jahnes , Paul Alfred Lauro , Nancy C. LaBianca , Michael J. Rooks
发明人： Gareth Geoffrey Hougham , S. Jay Chey , James Patrick Doyle , Xiao Hu Liu , Christopher V. Jahnes , Paul Alfred Lauro , Nancy C. LaBianca , Michael J. Rooks
IPC分类号： H01L21/00 , H01L21/44 , H01R12/00 , H01R4/58
CPC分类号： B81B3/0035 , H01L2924/0002 , Y10T428/249986 , H01L2924/00
摘要： A method for fabricating a negative thermal expanding system device includes coating a wafer with a thermally decomposable polymer, patterning the decomposable polymer into repeating disk patterns, releasing the decomposable polymer from the wafer and forming a sheet of repeating patterned disks, suspending the sheet into a first solution with seeding compounds for electroless decomposition, removing the sheet from the first solution, suspending the sheet into a second solution to electrolessly deposit a first layer material onto the sheet, removing the sheet from the second solution, suspending the sheet into a third solution to deposit a second layer of material having a lower TCE value than the first layer of material, separating the patterned disks from one another, and annealing thermally the patterned disks to decompose the decomposable polymer and creating a cavity in place of the decomposable polymer.
摘要翻译：一种制造负热膨胀系统装置的方法包括用可热分解的聚合物涂覆晶片，将可分解的聚合物图案化成重复的圆盘图案，将可分解的聚合物从晶片上释放出来并形成一张重复图案的圆盘，将薄片悬挂在用于无电解分解的接种化合物的第一溶液，从第一溶液中除去片材，将片材悬浮在第二溶液中以将第一层材料无电沉积到片材上，从第二溶液中除去片材，将片材悬浮在第三溶液中沉积具有比第一层材料低的TCE值的第二层材料，将图案化的盘彼此分离，并对图案化的盘进行热退火以分解可分解聚合物并产生空腔以代替可分解的聚合物。

2. 发明申请

US20090251698A1 METHOD AND SYSTEM FOR COLLECTING ALIGNMENT DATA FROM COATED CHIPS OR WAFERS 失效
标题翻译：用于从涂覆的晶片或晶圆收集对准数据的方法和系统
公开(公告)号：US20090251698A1
公开(公告)日：2009-10-08
申请号：US12061196
申请日：2008-04-02
申请人： Claudius Feger , Nancy C. LaBianca , Steven E. Steen
发明人： Claudius Feger , Nancy C. LaBianca , Steven E. Steen
IPC分类号： G01B11/00
CPC分类号： H01L23/544 , H01L24/81 , H01L2223/54426 , H01L2223/54453 , H01L2223/5448 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/73104 , H01L2224/81121 , H01L2224/81801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01076 , H01L2224/05599
摘要： A process and system for determining alignment data for features on wafers or chips when a wafer or chip is substantially coated by an over bump applied material, e.g. a resin or film, and using that data to align the wafers or chips for subsequent operations such as dicing or joining. Position data for alignment is produced by identifying a location of an at least partially obscured feature by varying the depth of focus upon a work piece to determine an SNR approximating a maximum value from an image captured by optical scanning. An SNR above a threshold value can be employed.
摘要翻译：一种用于当晶片或芯片基本上涂覆有超过凸起的应用材料（例如，晶片或芯片）时，用于确定晶片或芯片上的特征的对准数据的过程和系统。树脂或膜，并且使用该数据来对准用于后续操作的晶片或芯片，例如切割或接合。用于对准的位置数据通过通过改变工件上的焦点深度来识别至少部分模糊的特征的位置而产生，以从通过光学扫描捕获的图像确定接近最大值的SNR。可以使用高于阈值的SNR。

3. 发明授权

US07238547B2 Packaging integrated circuits for accelerated detection of transient particle induced soft error rates 有权
标题翻译：封装集成电路，用于加速检测瞬态粒子引起的软错误率
公开(公告)号：US07238547B2
公开(公告)日：2007-07-03
申请号：US11098343
申请日：2005-04-04
申请人： Janes Jones, legal representative , Jerry D. Ackaret , Michael A. Gaynes , Michael S. Gordon , Nancy C. LaBianca
发明人： Theodore H. Zabel, deceased
IPC分类号： H01L21/56
CPC分类号： G06F11/00
摘要： An IC device is packaged for accelerated transient particle emission by doping the underfill thereof with a transient-particle-emitting material having a predetermined, substantially constant emission rate. The emission rate may be tunable. In one aspect, a radioactive adhesive composition is provided for bonding a semiconductor device to a chip carrier. The radioactive adhesive composition is made from a cured reaction product including a resin and a filler, and may be reworkable or non-reworkable. Either the resin or the filler, individually or both together as a mix, are doped substantially uniformly with the transient-particle-emitting material, thereby putting the transient-particle-emitting in close proximity with the IC to be tested. The underfill is formulated to have a stable chemistry, and the doped particles are encapsulated, so as to contain the emissions. Accelerated transient-particle-emission testing may then be performed on the IC in situ to provide accelerated detection of soft errors.
摘要翻译：通过用具有预定的，基本上恒定的发射速率的瞬态粒子发射材料掺杂其底部填充物来封装IC器件用于加速瞬态粒子发射。排放率可能是可调的。在一个方面，提供了用于将半导体器件接合到芯片载体的放射性粘合剂组合物。放射性粘合剂组合物由包括树脂和填料的固化反应产物制成，并且可以是可再加工的或不可再加工的。单独或两者一起作为混合物的树脂或填料均以瞬态粒子发射材料基本上均匀地掺杂，从而使瞬态粒子发射紧密接近待测试的IC。底层填料配制成具有稳定的化学性质，并且掺杂的颗粒被包封，以便包含排放物。然后可以在IC上原位进行加速瞬态粒子发射测试，以提供软错误的加速检测。

4. 发明授权

US07063127B2 Method and apparatus for chip-cooling 有权
标题翻译：芯片冷却方法和装置
公开(公告)号：US07063127B2
公开(公告)日：2006-06-20
申请号：US10665798
申请日：2003-09-18
申请人： Jeffrey D. Gelorme , Hendrik F. Hamann , Nancy C. LaBianca , Yves C. Martin , Theodore G. Van Kessel
发明人： Jeffrey D. Gelorme , Hendrik F. Hamann , Nancy C. LaBianca , Yves C. Martin , Theodore G. Van Kessel
IPC分类号： F28F7/00
CPC分类号： H01L23/433 , H01L2924/0002 , H01L2924/00
摘要： A thermal interface for IC chip cooling is provided. One embodiment of the thermal interface includes a thermally conductive liquid or paste-like metal(s) disposed within a flexible, thermally conductive enclosure. The enclosure is adapted to be placed between an IC chip and a heat sink to enhance heat transfer from the chip to the heat sink, thereby enabling quicker and more efficient cooling of the chip than can be achieved by conventional techniques. In several embodiments, the thermal interface is held in place by mechanical pressure rather than by bonding, which further facilitates inspection and repair of the IC device.
摘要翻译：提供了用于IC芯片冷却的热接口。热界面的一个实施例包括设置在柔性导热外壳内的导热液体或糊状金属。壳体适于放置在IC芯片和散热器之间，以增强从芯片到散热片的热传递，从而比通过常规技术可以实现的更快和更有效地冷却芯片。在几个实施例中，热界面通过机械压力而不是通过粘合保持在适当位置，这进一步便于IC器件的检查和修理。

5. 发明授权

US08288177B2 SER testing for an IC chip using hot underfill 有权
标题翻译： SER测试使用热底部填充的IC芯片
公开(公告)号：US08288177B2
公开(公告)日：2012-10-16
申请号：US12857864
申请日：2010-08-17
申请人： Michael Gaynes , Michael S. Gordon , Nancy C. LaBianca , Kenneth F. Latzko , Aparna Prabhakar
发明人： Michael Gaynes , Michael S. Gordon , Nancy C. LaBianca , Kenneth F. Latzko , Aparna Prabhakar
IPC分类号： G01R31/26 , G01R31/00 , H01L21/00 , H01L21/44 , H01L23/58 , H01L23/552
CPC分类号： H01L22/20 , G01R31/31816 , H01L21/563 , H01L22/14 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/83102 , H01L2224/92125 , H01L2924/014 , H01L2924/3511 , H01L2924/00
摘要： A method for detecting soft errors in an integrated circuit (IC) due to transient-particle emission, the IC comprising at least one chip and a substrate includes mixing an epoxy with a radioactive source to form a hot underfill (HUF); underfilling the chip with the HUF; sealing the underfilled chip; measuring a radioactivity of the HUF at an edge of the chip; measuring the radioactivity of the HUF on a test coupon; testing the IC for soft errors by determining a current radioactivity of the HUF at the time of testing based on the measured radioactivity; and after the expiration of a radioactive decay period of the radioactive source, using the IC in a computing device by a user.
摘要翻译：一种用于检测由于瞬态粒子发射引起的集成电路（IC）中的软错误的方法，包括至少一个芯片和基板的IC包括将环氧树脂与放射源混合以形成热底部填充物（HUF）; 用HUF填充芯片; 密封未充足的芯片; 测量芯片边缘处的HUF的放射性; 测量试样上HUF的放射性; 通过基于测量的放射性确定在测试时的HUF的当前放射性来测试IC的软错误; 并在放射源的放射性衰变期到期后，由用户在计算装置中使用IC。

6. 发明授权

US07883919B2 Negative thermal expansion system (NTEs) device for TCE compensation in elastomer compsites and conductive elastomer interconnects in microelectronic packaging 有权
标题翻译：用于弹性体TCE补偿的负热膨胀系统（NTE）装置包括微电子封装中的导电弹性体互连
公开(公告)号：US07883919B2
公开(公告)日：2011-02-08
申请号：US12497903
申请日：2009-07-06
申请人： Gareth Geoffrey Hougham , S. Jay Chey , James Patrick Doyle , Xiao Hu Liu , Christopher V. Jahnes , Paul Alfred Lauro , Nancy C. LaBianca , Michael J. Rooks
发明人： Gareth Geoffrey Hougham , S. Jay Chey , James Patrick Doyle , Xiao Hu Liu , Christopher V. Jahnes , Paul Alfred Lauro , Nancy C. LaBianca , Michael J. Rooks
IPC分类号： H01L21/00 , H01L21/30 , H01L21/44
CPC分类号： B81B3/0035 , H01L2924/0002 , Y10T428/249986 , H01L2924/00
摘要： A method for fabricating a negative thermal expanding system device includes coating a wafer with a thermally decomposable polymer, patterning the decomposable polymer into repeating disk patterns, releasing the decomposable polymer from the wafer and forming a sheet of repeating patterned disks, suspending the sheet into a first solution with seeding compounds for electroless decomposition, removing the sheet from the first solution, suspending the sheet into a second solution to electrolessly deposit a first layer material onto the sheet, removing the sheet from the second solution, suspending the sheet into a third solution to deposit a second layer of material having a lower TCE value than the first layer of material, separating the patterned disks from one another, and annealing thermally the patterned disks to decompose the decomposable polymer and creating a cavity in place of the decomposable polymer.
摘要翻译：一种制造负热膨胀系统装置的方法包括用可热分解的聚合物涂覆晶片，将可分解的聚合物图案化成重复的圆盘图案，将可分解的聚合物从晶片上释放出来并形成一张重复图案的圆盘，将薄片悬挂在用于无电解分解的接种化合物的第一溶液，从第一溶液中除去片材，将片材悬浮在第二溶液中以将第一层材料无电沉积到片材上，从第二溶液中除去片材，将片材悬浮在第三溶液中沉积具有比第一层材料低的TCE值的第二层材料，将图案化的盘彼此分离，并对图案化的盘进行热退火以分解可分解聚合物并产生空腔以代替可分解的聚合物。

7. 发明授权

US07556979B2 Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging 失效
标题翻译：负热膨胀系统（NTE）装置用于弹性体复合材料中的TCE补偿和微电子封装中的导电弹性体互连
公开(公告)号：US07556979B2
公开(公告)日：2009-07-07
申请号：US11932385
申请日：2007-10-31
申请人： Gareth Geoffrey Hougham , S. Jay Chey , James Patrick Doyle , Xiao Hu Liu , Christopher V. Jahnes , Paul Alfred Lauro , Nancy C. LaBianca , Michael J. Rooks
发明人： Gareth Geoffrey Hougham , S. Jay Chey , James Patrick Doyle , Xiao Hu Liu , Christopher V. Jahnes , Paul Alfred Lauro , Nancy C. LaBianca , Michael J. Rooks
IPC分类号： H01L21/00
CPC分类号： B81B3/0035 , H01L2924/0002 , Y10T428/249986 , H01L2924/00
摘要： A Negative Thermal Expansion system (NTEs) device for TCE compensation or CTE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging. One aspect of the present invention provides a method for fabricating micromachine devices that have negative thermal expansion coefficients that can be made into a composite for manipulation of the TCE of the material. These devices and composites made with these devices are in the categories of materials called “smart materials” or “responsive materials.” Another aspect of the present invention provides microdevices comprised of dual opposed bilayers of material where the two bilayers are attached to one another at the peripheral edges only, and where the bilayers themselves are at a minimum stress conditions at a reference temperature defined by the temperature at which the bilayers are formed. These devices have the technologically useful property of volumetrically expanding upon lowering of the device temperature below the reference or processing temperature.
摘要翻译：用于微电子封装中弹性体复合材料和导电弹性体互连的TCE补偿或CTE补偿的负热膨胀系统（NTE）装置。本发明的一个方面提供了一种用于制造具有负热膨胀系数的微机械装置的方法，该热膨胀系数可以制成用于操纵材料的TCE的复合材料。这些设备和这些设备制成的复合材料属于称为“智能材料”或“响应材料”的材料类别。本发明的另一方面提供了由双重相对的双层材料构成的微器件，其中两个双层仅在外围边缘处彼此附接，并且其中双层本身处于由温度定义的参考温度下的最小应力条件双层形成。当器件温度降低到参考温度或加工温度以下时，这些器件具有技术上有用的特性。

8. 发明授权

US06777817B2 Reworkable and thermally conductive adhesive and use thereof 有权
标题翻译：可再造和导热粘合剂及其用途
公开(公告)号：US06777817B2
公开(公告)日：2004-08-17
申请号：US10654978
申请日：2003-09-05
申请人： Stephen Buchwalter , Michael Anthony Gaynes , Nancy C. LaBianca , Stefano Sergio Oggioni , Son K. Tran
发明人： Stephen Buchwalter , Michael Anthony Gaynes , Nancy C. LaBianca , Stefano Sergio Oggioni , Son K. Tran
IPC分类号： H01L2348
CPC分类号： H01L24/29 , C08G59/24 , C08G59/42 , H01L21/563 , H01L23/293 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L29/0657 , H01L2224/16225 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29386 , H01L2224/29486 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/83194 , H01L2224/8385 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10158 , H01L2924/15311 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/00 , H01L2924/00012 , H01L2924/05032 , H01L2924/05442 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/0401
摘要： Reworkable thermally conductive adhesive composition including a cured reaction product from a diepoxide wherein the epoxy groups are connected through an acyclic acetal moiety, a cyclic anhydride and a thermally conductive filler are provided and used to bond semiconductive devices to a chip carrier or heat spreader.
摘要翻译：提供了包含来自二环氧化物的固化反应产物的可再结合的导热粘合剂组合物，其中环氧基团通过无环缩醛部分连接，环状酸酐和导热填料，并用于将半导体器件粘合到芯片载体或散热器。

9. 发明授权

US06617698B2 Reworkable and thermally conductive adhesive and use thereof 有权
公开(公告)号：US06617698B2
公开(公告)日：2003-09-09
申请号：US09801655
申请日：2001-03-09
申请人： Stephen Buchwalter , Michael Anthony Gaynes , Nancy C. LaBianca , Stefano Sergio Oggioni , Son K. Tran
发明人： Stephen Buchwalter , Michael Anthony Gaynes , Nancy C. LaBianca , Stefano Sergio Oggioni , Son K. Tran
IPC分类号： H01L2348
CPC分类号： H01L24/29 , C08G59/24 , C08G59/42 , H01L21/563 , H01L23/293 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L29/0657 , H01L2224/16225 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29386 , H01L2224/29486 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/83194 , H01L2224/8385 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10158 , H01L2924/15311 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/00 , H01L2924/00012 , H01L2924/05032 , H01L2924/05442 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/0401
摘要： Reworkable thermally conductive adhesive composition comprising a cured reaction product from a diepoxide wherein the epoxy groups are connected through an acyclic acetal moiety, a cyclic anhydride and a thermally conductive filler are provided and used to bond semiconductive devices to a chip carrier or heat spreader.

10. 发明授权

US4806455A Thermal stabilization of photoresist images 失效
标题翻译：光致抗蚀剂图像的热稳定性
公开(公告)号：US4806455A
公开(公告)日：1989-02-21
申请号：US34344
申请日：1987-04-03
申请人： Nancy C. LaBianca
发明人： Nancy C. LaBianca
IPC分类号： G03F7/40 , G03C5/00
CPC分类号： G03F7/40
摘要： Application of a high temperature resistant film forming polymer has previously proved successful in stabilizing photoresist image layers, particularly those used for high resolution geometries in microelectronic applications, against distortion or degradation by the heat generated during subsequent etching, ion implantation processes and the like. It has been found that, when the thickness of the photoresist image layer exceeds about 1 micron, the coating of the film forming polymer tends to distort and/or cause cracks, breaks and the like in the photoresist resulting in loss of the required geometry in the image. In accordance with the invention this problem can be overcome by applying the film forming polymer in the form of an ultrasonically atomized spray under controlled conditions.
摘要翻译：耐高温成膜聚合物的应用先前证明在光致抗蚀剂图像层，特别是用于微电子应用中用于高分辨率几何形状的抗蚀剂图像层中，可以防止在随后的蚀刻，离子注入工艺等期间产生的热量的失真或劣化。已经发现，当光致抗蚀剂图像层的厚度超过约1微米时，成膜聚合物的涂层倾向于在光致抗蚀剂中变形和/或引起裂纹，断裂等，导致所需几何形状的损失图片。根据本发明，可以通过在受控条件下以超声雾化喷雾的形式应用成膜聚合物来克服这个问题。

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