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    • 1. 发明授权
    • Manufacturing method for MIS-type semiconductor device
    • MIS型半导体器件的制造方法
    • US4517728A
    • 1985-05-21
    • US559399
    • 1983-12-08
    • Morihiro Niimi
    • Morihiro Niimi
    • H01L29/78H01L21/033H01L21/321H01L21/336H01L21/22
    • H01L29/66575H01L21/033H01L21/321
    • A manufacturing method for an MIS type semiconductor device features in the preferred form a single masking operation used to define source, gate, and drain windows simultaneously in an upper insulating oxide layer disposed over a semiconducting polysilicon layer, the polysilicon layer being separated from the semiconductor substrate by a thin insulating oxide layer serving as the gate oxide. By subsequent deposition of an overall capping nitride layer, followed by selective removal of layers, using relatively low resolution photoresist and portions of the layers themselves as intermediate etching barriers, and by finally converting the polycrystalline layer to an oxide except where it is protected from oxidation by the presence of a nitride stripe over a gate window, the resulting gate electrode is precisely centered between the source and drain windows, and is sealed on all three sides by a protective oxide layer.
    • 一种用于MIS型半导体器件的制造方法的特征在于优选的形式,用于在设置在半导体多晶硅层上的上绝缘氧化物层中同时限定源极,栅极和漏极窗口的单个掩模操作,所述多晶硅层与半导体 衬底由用作栅极氧化物的薄绝缘氧化物层。 通过随后沉积整个封盖氮化物层,随后选择性地去除层,使用相对低分辨率的光致抗蚀剂和部分层本身作为中间蚀刻屏障,并且最终将多晶层转化为氧化物,除了其被保护以免氧化 通过在栅极窗口上存在氮化物条纹,所得到的栅电极在源极和漏极窗口之间精确地居中,并且通过保护氧化物层在所有三个侧面上被密封。