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    • 1. 发明申请
    • EXHAUST SYSTEM
    • 排气系统
    • WO2007127294A3
    • 2008-01-24
    • PCT/US2007010112
    • 2007-04-25
    • MITSUBISHI CABLE IND LTDOSAKA RASENKAN KOGYO CO LTDSPANSION LLCSPANSION JAPAN LTD
    • C23F1/00C23C16/44H01L21/205H01L21/22H01L21/306H01L21/3065H01L21/31
    • C23C16/4412
    • An exhaust system includes: an exhaust pressure controller interposed in an exhaust passage and including: a pipe body including a side peripheral wall in which at least one port is formed; and a gas introduction wall for introducing an exhaust gas flowing from an upstream side of the pipe body so that the exhaust gas flows downstream without coming into direct contact with the port and vicinity thereof, one face of the gas introduction wall forming a pressure control path together with an inner face of the side peripheral wall while another face of the gas introduction wall forming an exhaust gas path along which the exhaust gas flows. The port communicates with the pressure control path, and the pressure control path communicates with the exhaust gas path at part downstream of the port.
    • 排气系统包括:置于排气通道中的排气压力控制器,包括:管体,其包括形成至少一个端口的侧壁; 以及气体引入壁,用于引入从管体的上游侧流出的排气,使得废气在下游流动而不与其端口及其附近直接接触,气体导入壁的一个面形成压力控制路径 与侧壁的内表面一起,同时气体导入壁的另一面形成废气流过的排气路径。 所述端口与所述压力控制路径连通,并且所述压力控制路径在所述端口的下游的部分与所述排气路径连通。
    • 2. 发明申请
    • EXHAUST SYSTEM
    • 排气系统
    • WO2007127294A9
    • 2009-02-12
    • PCT/US2007010112
    • 2007-04-25
    • MITSUBISHI CABLE IND LTDOSAKA RASENKAN KOGYO CO LTDSPANSION LLCSPANSION JAPAN LTD
    • C23F1/00C23C16/44H01L21/205H01L21/22H01L21/306H01L21/3065H01L21/31
    • C23C16/4412
    • An exhaust system includes: an exhaust pressure controller interposed in an exhaust passage and including: a pipe body including a side peripheral wall in which at least one port is formed; and a gas introduction wall for introducing an exhaust gas flowing from an upstream side of the pipe body so that the exhaust gas flows downstream without coming into direct contact with the port and vicinity thereof, one face of the gas introduction wall forming a pressure control path together with an inner face of the side peripheral wall while another face of the gas introduction wall forming an exhaust gas path along which the exhaust gas flows. The port communicates with the pressure control path, and the pressure control path communicates with the exhaust gas path at part downstream of the port.
    • 排气系统包括:置于排气通道中的排气压力控制器,包括:管体,其包括形成至少一个端口的侧壁; 以及气体引入壁,用于引入从管体的上游侧流出的排气,使得废气在下游流动而不与其端口及其附近直接接触,气体导入壁的一个面形成压力控制路径 与侧壁的内表面一起,同时气体导入壁的另一面形成废气流过的排气路径。 所述端口与所述压力控制路径连通,并且所述压力控制路径在所述端口的下游的部分与所述排气路径连通。
    • 8. 发明公开
    • SEMICONDUCTOR LIGHT-EMITTING DEVICE
    • LICHTEMITTIERENDHALBLEITERBAUELEMENT
    • EP1378949A4
    • 2006-03-22
    • EP02705381
    • 2002-03-20
    • MITSUBISHI CABLE IND LTD
    • TADATOMO KAZUYUKIOKAGAWA HIROAKIOUCHI YOICHIROTSUNEKAWA TAKASHI
    • H01L33/12H01L33/22H01L33/32H01L33/00
    • H01L33/22H01L33/12H01L33/32
    • Projections and recesses (1a) are formed in a first layer (1), and a second layer (2) having an index of refraction different from that of the first layer (1) is formed while filling in the recesses (alternatively, a first crystal (10) is grown on a crystal layer (S) serving as the foundation of the growth to have an uneven surface, and a second crystal (20) having an index of refraction different from that of the first crystal is grown). After the uneven refractive index interface (1a(10a)) is thus formed, a device structure where a semiconductor crystal layers including a light-emitting layer (A) are formed thereon. As a result, the light generated in the light-emitting layer (A) and traveling horizontally is bent by the influence of the uneven refractive index interface and directed to the outside. If ultraviolet light is emitted by using InGaN as the material of the light-emitting layer, a quantum well structure is used, and AlGaN is eliminated by forming all the layers between the quantum well structure and a low-temperature buffer layer by using a GaN crystal as the material. The quantum well structure is preferably made up of a well layer of InGaN and a barrier layer of GaN. The thickness of the barrier layer preferably ranges from 6 to 30 nm.
    • 在第一层(1)中形成凸起和凹槽(1a),并在填充凹槽时形成具有与第一层(1)不同的折射率的第二层(2)(或者,第一层 在作为生长基础的晶体层(S)上生长晶体(10)以具有不平坦表面,并且生长具有与第一晶体不同的折射率的第二晶体(20))。 在这样形成不均匀折射率界面(1a(10a))之后,形成其上形成包括发光层(A)的半导体晶体层的器件结构。 结果,在发光层(A)中产生并且水平行进的光在不均匀折射率界面的影响下弯曲并且被引导到外部。 如果通过使用InGaN作为发光层的材料来发射紫外光,则使用量子阱结构,并且通过使用GaN来形成量子阱结构和低温缓冲层之间的所有层来消除AlGaN 水晶作为材料。 量子阱结构优选由InGaN的阱层和GaN的势垒层构成。 阻挡层的厚度优选在6至30nm的范围内。