会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明专利
    • OPTICAL APPARATUS FOR MEASURING THE TWO AND THREE-DIMENSIONAL SHAPE OF AN OBJECT
    • AU2003203202A1
    • 2003-07-30
    • AU2003203202
    • 2003-01-10
    • INTEK PLUS CO LTDLEE SANG YOON
    • LIM SSANG-GUNKIM KI-HONGCHO SANG-HYUNCHOI EE-BAE
    • G01B11/25G01B11/02G01B11/24G01B11/30
    • Disclosed is a two-dimensional and three-dimensional optical measurement apparatus capable of alternately or selectively measuring two-dimensional sizes and three-dimensional features of an object, and measuring three-dimensional features of an object without using reflected light from a reference plane but only using a projection grating, thereby minimizing reducing measurement error. The apparatus comprises a CCD camera installed at an upper portion in a probe casing for producing a two-dimensional image and a three-dimensional image of an object through an image-forming lens, a first lighting system installed under the CCD camera and illuminating a measurement surface of the object to be measured when measuring a two-dimensional size of the object, a second lighting system installed under the first lighting system and attached to an image pick-up tube provided to the bottom of the probe casing 10 for illuminating corners of the object to be measured when measuring a two-dimensional size of the object, a third lighting system installed in a portion of the probe casing for illuminating the measurement surface of the object through a projection grating, a projection lens, a total reflection mirror and the image pick-up tube when measuring a three-dimensional feature of the object, and a piezoelectric actuator for finely moving the projection grating.
    • 3. 发明授权
    • Firewood boiler
    • 烟火锅炉
    • KR101216129B1
    • 2012-12-27
    • KR20120033076
    • 2012-03-30
    • LEE SANG YOONPARK DONG SUBSEONG HA KYUNG
    • SEONG HA KYUNGLEE SANG YOON
    • F24B13/00F23B60/00F24C1/14F24H9/18
    • F24B9/00F24B5/023F24B7/005F24H1/34F24H2230/00
    • PURPOSE: A firewood boiler is provided to be operated over a long period of time without thermal losses as a water heating block and combustion block are manufactured by refractory bricks. CONSTITUTION: A firewood boiler comprises a fuel combustion block(110), a water heating block(120), a base block(130), a unit(140) for distributing combustion air, a steam generating water tank(150), and a combustion air supply member. A water heating block is connected to the upper part of the fuel combustion block, and a steam pipe is connected to one side of the water heating block. A water heating block comprises a space for heating water inside. The base block supplies the combustion air to the fuel combustion block, and forms a place for colleting ash. The unit for distributing combustion air is for diffusing the combustion air supplied from the base block. The steam generating water tank generates steam by heating the water in the water heating block. The combustion air supply member is placed inside the base block, and supplies the combustion air to the fuel combustion block.
    • 目的:提供燃木锅炉长时间运行,无需热损失,因为水加热块和燃烧块由耐火砖制成。 构成:柴火锅炉包括燃料燃烧块(110),水加热块(120),基块(130),用于分配燃烧空气的单元(140),蒸汽发生水箱(150)和 燃烧空气供应构件。 燃料燃烧块的上部连接有水加热块,在水加热块的一侧连接蒸汽管。 水加热块包括用于在其内部加热水的空间。 基座将燃烧空气供给到燃料燃烧块,形成集尘灰。 用于分配燃烧空气的单元用于扩散从基块供应的燃烧空气。 蒸汽发生水箱通过加热水加热块中的水来产生蒸汽。 燃烧用空气供给部件配置在基座内,向燃料燃烧块供给燃烧用空气。
    • 6. 发明申请
    • SEMICONDUCTOR PACKAGE SORTING METHOD
    • 半导体封装分选方法
    • WO2007046629A1
    • 2007-04-26
    • PCT/KR2006/004229
    • 2006-10-18
    • INTEKPLUS CO., LTD.KANG, Min-guLEE, Hyun-minSONG, Kyung-sooLEE, Sang-yoonLIM, Ssang-gun
    • KANG, Min-guLEE, Hyun-minSONG, Kyung-sooLEE, Sang-yoonLIM, Ssang-gun
    • H01L21/66
    • H01L22/20
    • Disclosed is a semiconductor package sorting method for improving sorting speed and yield of semiconductor packages. The method comprises performing a vision inspection on a tray, transferring the tray to a buffer unit, shifting defective products to a defective product tray, performing a vision inspection on a tray, transferring the tray to an unloading unit, determining whether defective products are found among semiconductor packages, if it is determined that the unloading tray receives defective products, shifting the defective products to the defective product tray and shifting normal products to fill the unloading tray, if a vision inspection for a last tray of a lot is completed, shifting the defective products to the defective product tray, discharging the defective product tray into a defective product storage unit, and if the re-inspection is determined, performing a defective product re-inspection simultaneously with arrangement of the normal products.
    • 公开了一种用于提高半导体封装的分选速度和产量的半导体封装分选方法。 该方法包括在托盘上执行视觉检查,将托盘传送到缓冲单元,将有缺陷的产品转移到有缺陷的产品托盘,对托盘进行视觉检查,将托盘传送到卸载单元,确定是否找到有缺陷的产品 在半导体封装中,如果确定卸载托盘接收到不良产品,则将缺陷产品转移到有缺陷的产品托盘并移动正常产品以填充卸载托盘,如果批次的最后托盘的视觉检查完成,则移位 有缺陷的产品到缺陷产品托盘,将有缺陷的产品托盘排放到有缺陷的产品存储单元中,并且如果确定了重新检查,则与正常产品的布置同时进行缺陷产品重新检查。
    • 7. 发明申请
    • METHOD FOR INSPECTING SEMICONDUCTOR DEVICE
    • 检查半导体器件的方法
    • WO2006132485A1
    • 2006-12-14
    • PCT/KR2006/002154
    • 2006-06-05
    • INTEKPLUS CO., LTD.LEE, Sang-yoonKANG, Min-guKIM, Il-namLEE, Hyun-minLIM, Ssang-gun
    • LEE, Sang-yoonKANG, Min-guKIM, Il-namLEE, Hyun-minLIM, Ssang-gun
    • H01L21/66
    • G06T7/001G06T2207/30148H01L22/20H01L2924/014
    • A method for inspecting a semiconductor device is disclosed, which increases the accuracy of an external- defect inspection capable of determining whether balls or PCBs (Printed Circuit Boards) of the semiconductor device have external defects. The method for inspecting the semiconductor device to determine whether a defect occurs in a ball grid array contained in a PCB via an image captured by a camera includes the steps of: a) capturing an image of the semiconductor device to allow a circumference of each ball contained in the semiconductor device to be displayed in white, and acquiring falling-illumination image information from the captured image; b) capturing an image of the semiconductor device to allow a center part of each ball contained in the semiconductor device to be displayed in white, and acquiring coaxial image information from the captured image; c) subtracting the coaxial image information from the falling-illumination image information, and acquiring ring-shaped image information; and d) comparing the ring- shaped image information with reference image information, and determining whether the ball is defective according to the comparison result.
    • 公开了一种用于检查半导体器件的方法,其增加了能够确定半导体器件的球或PCB(印刷电路板)是否具有外部缺陷的外部缺陷检查的精度。 用于通过照相机拍摄的图像检查半导体器件以确定在PCB中包含的球栅阵列中是否发生缺陷的方法包括以下步骤:a)捕获半导体器件的图像以允许每个球的圆周 包含在半导体装置中以白色显示,并从捕获图像获取落下照明图像信息; b)捕获半导体器件的图像,以允许包含在半导体器件中的每个球的中心部分以白色显示,并从捕获的图像获取同轴图像信息; c)从所述降落照明图像信息中减去所述同轴图像信息,并获取环形图像信息; 以及d)将环形图像信息与参考图像信息进行比较,并且根据比较结果确定球是否有缺陷。
    • 8. 发明申请
    • METHOD AND APPARATUS FOR INSPECTING AND PACKING CHIPS
    • 检查和包装的方法和装置
    • WO2003056623A1
    • 2003-07-10
    • PCT/KR2002/002420
    • 2002-12-24
    • INTEK PLUS CO., LTD.LIM, Ssang-GunLEE, Sang-Yoon
    • LIM, Ssang-GunLEE, Sang-Yoon
    • H01L21/58
    • G01R1/0408G01R31/01H05K13/022
    • Disclosed are a method and apparatus for simultaneously inspecting and packaging chips, the method comprising a first step for advancing a film having a plurality of chip receiving recesses thereon from a film supplying roll to a film recovery roll by a step movement, inserting an uninspected chip into the chip receiving recess of the film, inspecting the chip passing under a three dimensional measuring probe by the three dimensional measuring probe, and replacing the inspected chip with a new chip by a robot arm when the probe determines that the inspected chip is abnormal, and a second step for attaching a tape onto the film to close an opening of the chip receiving recess having a normal chips therein after the first step is performed.
    • 公开了一种用于同时检查和包装芯片的方法和装置,该方法包括第一步骤,用于通过步进运动将具有多个芯片接收凹部的膜从薄膜供应辊推送到薄膜恢复辊,将未预期的芯片 进入薄膜的芯片接收凹部,通过三维测量探头检查在三维测量探针下通过的芯片,并且当探针确定被检查的芯片异常时,用机器人手臂用新的芯片替换被检查的芯片, 以及第二步骤,用于在执行第一步骤之后,将胶带附着到胶片上以封闭其中具有普通芯片的芯片容纳凹部的开口。