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1. 发明申请

US20150167953A1 LIGHT CONVERGENCE MODULE WITH HEAT DISSIPATION FUNCTION 审中-公开
标题翻译：具有散热功能的光合并模块
公开(公告)号：US20150167953A1
公开(公告)日：2015-06-18
申请号：US14324372
申请日：2014-07-07
申请人： KUO-CHIN HUANG
发明人： KUO-CHIN HUANG
IPC分类号： F21V29/74 , F21V13/04 , F21V5/04
CPC分类号： F21V19/004 , F21V13/04 , F21V19/0035 , F21V19/0045 , F21V29/70 , F21Y2101/00 , F21Y2115/10
摘要： A light convergence module with a heat dissipation function is revealed. It comprises a substrate, an assembling unit, a light convergence lampshade, and a heat sink, wherein the assembling unit with a first surface assembling to the substrate and a second surface assembling to the light convergence lampshade comprises a locating block and a plurality of position limiting blocks for respectively engaging with a locating slot and a plurality of position limiting slots of the substrate, and two buckles for correspondingly clasping two concave slots of the substrate to limit the substrate in position, and wherein the heat sink comprises a plurality of interspaces formed between every two adjacent heat dissipation fins for securing the buckles of the assembling unit and allowing the heat sink to closely dispose on the substrate.
摘要翻译：揭示了具有散热功能的光汇聚模块。其包括基板，组装单元，聚光灯罩和散热器，其中具有组装到基板的第一表面的组装单元和组装到聚光灯罩的第二表面包括定位块和多个位置用于分别与所述基板的定位槽和多个位置限制槽接合的限位块，以及两个带扣，用于相应地夹紧所述基板的两个凹槽以将所述基板限制在适当位置，并且其中所述散热器包括多个间隙在两个相邻的散热翅片之间，用于固定组装单元的带扣并且允许散热器紧密地布置在基板上。

2. 发明申请

US20130170225A1 CONVERGING LENS WITH MULTIPLE-CURVATURE COMPOUND SURFACE, CONCENTRATOR MODULE AND LIGHTING FIXTURE HAVING THE SAME 审中-公开
标题翻译：具有多个曲面复合表面的聚光镜，浓缩器模块及其相应的灯具
公开(公告)号：US20130170225A1
公开(公告)日：2013-07-04
申请号：US13339642
申请日：2011-12-29
申请人： KUO-CHIN HUANG
发明人： KUO-CHIN HUANG
IPC分类号： F21V5/04
CPC分类号： G02B27/0927 , F21S41/143 , F21S41/255 , G02B19/0014 , G02B19/0061
摘要： A converging lens with a multiple-curvature compound surface is revealed. The converging lens includes an incident surface and an emission surface. A crest-line along X axis and a crest-line along Y axis are on the emission surface, crossed each other and dividing the emission surface into four curved surface sections. The X-axis curvature as well as the Y-axis curvature of each curved surface section can be the same or different. An angle θ between the crest-line along X axis and the X-axis ranges from 0˜30 degrees. Thereby light from a light sources passes through the converging lens and projects to produce a light pattern required. The converging lens is used in concentrator modules and lighting fixtures.
摘要翻译：揭示了具有多曲率复合表面的会聚透镜。会聚透镜包括入射表面和发射表面。沿着X轴的峰线和沿着Y轴的波峰线在发射表面上，彼此交叉并将发射表面划分成四个弯曲表面部分。每个曲面部分的X轴曲率以及Y轴曲率可以相同或不同。沿X轴的峰顶线与X轴的角度θ范围为0〜30度。由此来自光源的光通过会聚透镜并投射以产生所需的光图案。会聚镜头用于集中器模块和照明灯具。

3. 发明授权

US08263991B2 Light-emitting gallium nitride-based III-V group compound semiconductor device and manufacturing method thereof 有权
标题翻译：发光氮化镓系III-V族化合物半导体器件及其制造方法
公开(公告)号：US08263991B2
公开(公告)日：2012-09-11
申请号：US11979963
申请日：2007-11-13
申请人： Kuo-Chin Huang , Shyi-Ming Pan , Cheng-Kuo Huang , Chi-Yang Chuang , Fen-Ren Chien
发明人： Kuo-Chin Huang , Shyi-Ming Pan , Cheng-Kuo Huang , Chi-Yang Chuang , Fen-Ren Chien
IPC分类号： H01L33/00
CPC分类号： H01L33/405 , H01L33/32 , H01L33/40 , H01L33/46
摘要： A light-emitting gallium nitride-based III-V group compound semiconductor device and a manufacturing method thereof are disclosed. The light emitting device includes a substrate, a n-type semiconductor layer over the substrate, an active layer over the n-type semiconductor layer, a p-type semiconductor layer over the active layer, a conductive layer over the p-type semiconductor layer, a first electrode disposed on the conductive layer and a second electrode arranged on exposed part of the n-type semiconductor layer. A resistant reflective layer or a contact window is disposed on the p-type semiconductor layer, corresponding to the first electrode so that current passes beside the resistant reflective layer or by the contact window to the active layer for generating light. When the light is transmitted to the conductive layer for being emitted, it is not absorbed or shielded by the first electrode. Thus the current is distributed efficiently over the conductive layer. Therefore, both LED brightness and efficiency are improved. Moreover, adhesion between the conductive layer and the p-type semiconductor layer is improved so that metal peel-off problem during manufacturing processes can be improved.
摘要翻译：公开了一种发光氮化镓III-V族化合物半导体器件及其制造方法。发光器件包括衬底，衬底上的n型半导体层，n型半导体层上的有源层，有源层上的p型半导体层，p型半导体层上的导电层设置在导电层上的第一电极和布置在n型半导体层的暴露部分上的第二电极。对应于第一电极，在p型半导体层上设置电阻反射层或接触窗，使得电流通过电阻反射层旁边或通过接触窗到有源层产生光。当光传输到导电层以发射时，其不被第一电极吸收或屏蔽。因此，电流在导电层上有效地分布。因此，提高了LED的亮度和效率。此外，改善了导电层和p型半导体层之间的粘附性，从而可以提高制造工艺期间的金属剥离问题。

4. 发明申请

US20090275156A1 Light-emitting gallium nitride-based III-V group compound semiconductor device and manufacturing method thereof 审中-公开
标题翻译：发光氮化镓系III-V族化合物半导体器件及其制造方法
公开(公告)号：US20090275156A1
公开(公告)日：2009-11-05
申请号：US12458482
申请日：2009-07-14
申请人： Kuo-Chin Huang , Shyi-Ming Pan , Cheng-Kuo Huang , Chi-Yang Chuang , Fen-Ren Chien
发明人： Kuo-Chin Huang , Shyi-Ming Pan , Cheng-Kuo Huang , Chi-Yang Chuang , Fen-Ren Chien
IPC分类号： H01L21/20
CPC分类号： H01L33/405 , H01L33/32 , H01L33/40 , H01L33/46
摘要： A light-emitting gallium nitride-based III-V group compound semiconductor device and a manufacturing method thereof are disclosed. The light emitting device includes a substrate, a n-type semiconductor layer over the substrate, an active layer over the n-type semiconductor layer, a p-type semiconductor layer over the active layer, a conductive layer over the p-type semiconductor layer, a first electrode disposed on the conductive layer and a second electrode arranged on exposed part of the n-type semiconductor layer. A resistant reflective layer or a contact window is disposed on the p-type semiconductor layer, corresponding to the first electrode so that current passes beside the resistant reflective layer or by the contact window to the active layer for generating light. When the light is transmitted to the conductive layer for being emitted, it is not absorbed or shielded by the first electrode. Thus the current is distributed efficiently over the conductive layer. Therefore, both LED brightness and efficiency are improved. Moreover, adhesion between the conductive layer and the p-type semiconductor layer is improved so that metal peel-off problem during manufacturing processes can be improved.
摘要翻译：公开了一种发光氮化镓III-V族化合物半导体器件及其制造方法。发光器件包括衬底，衬底上的n型半导体层，n型半导体层上的有源层，有源层上的p型半导体层，p型半导体层上的导电层设置在导电层上的第一电极和布置在n型半导体层的暴露部分上的第二电极。对应于第一电极，在p型半导体层上设置电阻反射层或接触窗，使得电流通过电阻反射层旁边或通过接触窗到有源层产生光。当光传输到导电层以发射时，其不被第一电极吸收或屏蔽。因此，电流在导电层上有效地分布。因此，提高了LED的亮度和效率。此外，改善了导电层和p型半导体层之间的粘附性，从而可以提高制造工艺期间的金属剥离问题。

5. 发明申请

US20090189172A1 Light emitting diode with higher illumination efficiency 有权
公开(公告)号：US20090189172A1
公开(公告)日：2009-07-30
申请号：US12106277
申请日：2008-04-19
申请人： Shyi-Ming Pan , Wei-Kang Cheng , Kuo-Chin Huang
发明人： Shyi-Ming Pan , Wei-Kang Cheng , Kuo-Chin Huang
IPC分类号： H01L33/00
CPC分类号： H01L33/44 , H01L33/22 , H01L33/508 , H01L33/60 , H01L2224/32245 , H01L2224/32257 , H01L2224/45139 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2924/00
摘要： A light emitting diode (LED) with higher illumination efficiency is revealed. The LED includes a LED chip and an optical layer arranged on the bottom of the LED chip. The optical layer is a light-guiding layer, a light reflective layer or an energy-conversion layer that increases light emitting efficiency of the LED. Furthermore, a rough layer is disposed between the LED chip and the optical layer so as to increase surface area of the LED chip. Thus light emitted from the LED chip enters the optical layer more easily and the illumination efficiency of the LED is increased.

6. 外观设计

USD566670S1 Clamshell-style mobile phone 有权
标题翻译：蛤壳式手机
公开(公告)号：USD566670S1
公开(公告)日：2008-04-15
申请号：US29246462
申请日：2006-04-14
申请人： Kuo-Chin Huang
设计人： Kuo-Chin Huang

7. 发明授权

US07118043B2 Hanging tab with sensing chip 失效
标题翻译：悬挂标签与感应芯片
公开(公告)号：US07118043B2
公开(公告)日：2006-10-10
申请号：US10885089
申请日：2004-07-07
申请人： Kuo Chin Huang
发明人： Kuo Chin Huang
IPC分类号： G06K19/00
CPC分类号： G09F3/16 , Y10T428/24331
摘要： A hanging tab with a sensing chip, when in manufacturing, a fine net section for sewing or knitting and a frame are integrally shaped by injection molding; the frame has a fine net section, and includes an integrally formed fine-net frame surrounding a fine net, and has a sensing-chip frame section with a recess to receive a sensing chip; a sensing-chip cover can be integrally formed with the frame or separately formed, it can cover the recess to seal the sensing chip in the sensing-chip frame section. Thereby, an effect of simplifying the manufacturing process and increasing the speed as well as lowering the cost of production can be acquired.
摘要翻译：具有感测芯片的悬挂片，当制造时，用于缝制或编织的细网段和框架通过注射成型一体成型; 框架具有细的网部，并且包括围绕细网的整体形成的细网框架，并且具有感测芯片框架部分，其具有用于接收感测芯片的凹部; 感测芯片盖可以与框架一体地形成或分开形成，它可以覆盖凹部以将感测芯片密封在感测芯片框架部分中。由此，能够获得简化制造工序，提高速度，降低生产成本的效果。

8. 发明授权

US08053797B2 Light-emitting device with reflection layer and structure of the reflection layer 有权
标题翻译：具有反射层和反射层结构的发光装置
公开(公告)号：US08053797B2
公开(公告)日：2011-11-08
申请号：US12234652
申请日：2008-09-20
申请人： Wei-Kang Cheng , Shyi-Ming Pan , Cheng-Kuo Huang , Yin-Cheng Chu , Kuo-Chin Huang
发明人： Wei-Kang Cheng , Shyi-Ming Pan , Cheng-Kuo Huang , Yin-Cheng Chu , Kuo-Chin Huang
IPC分类号： H01L33/00
CPC分类号： H01L33/46 , H01L33/64
摘要： The present invention provides a light-emitting device with a reflection layer and the structure of the reflection layer. The reflection layer comprises a variety of dielectric materials. The reflection layer includes a plurality of dielectric layers. The materials of the plurality of dielectric layers have two or more types with two or more thicknesses, except for the combination of two material types and two thicknesses, for forming the reflection layer with a variety of structures. The reflection layer according to the present invention can be applied to light-emitting diodes of various types to form new light-emitting devices. Owing to its excellent reflectivity, the reflection layer can improve light-emitting efficiency of the light-emitting devices.
摘要翻译：本发明提供一种具有反射层的发光装置和反射层的结构。反射层包括各种介电材料。反射层包括多个电介质层。除了两种材料类型和两种厚度的组合之外，多个电介质层的材料具有两种或更多种类型，具有两种或更多种厚度，用于形成具有各种结构的反射层。根据本发明的反射层可以应用于各种类型的发光二极管，以形成新的发光器件。由于反射率优异，因此能够提高发光元件的发光效率。

9. 发明授权

US07956365B2 Alternating current light emitting device with plural conductors of electrodes for coupling to adjacent light emitting unit 有权
标题翻译：具有用于耦合到相邻发光单元的多个电极导体的交流电发光器件
公开(公告)号：US07956365B2
公开(公告)日：2011-06-07
申请号：US12329770
申请日：2008-12-08
申请人： Hui Ching Feng , Kuo-Chin Huang , Shyi-Ming Pan , Hung-Li Pan
发明人： Hui Ching Feng , Kuo-Chin Huang , Shyi-Ming Pan , Hung-Li Pan
IPC分类号： H01L29/26 , H01L23/12
CPC分类号： H01L25/0753 , H01L27/156 , H01L33/62 , H01L2224/4847 , H01L2224/49107 , Y10S257/918
摘要： An alternating current (AC) light emitting device is revealed. The AC light emitting device includes a substrate and a plurality of light emitting units arranged on the substrate. The light emitting unit consists of a first semiconductor layer, a light emitting layer, a second semiconductor layer, at least one electrode and at least one second electrode respectively arranged on the first semiconductor layer and the second semiconductor layer from bottom to top. The plurality of light emitting units is coupled to at least one adjacent light emitting unit by a plurality of conductors. By the plurality of conductors that connect light emitting units with at least one adjacent light emitting unit, an open circuit will not occur in the AC light emitting device once one of the conductors is broken.
摘要翻译：发现交流（AC）发光器件。 AC发光装置包括基板和布置在基板上的多个发光单元。发光单元由第一半导体层，发光层，第二半导体层，至少一个电极和至少一个第二电极组成，第一半导体层，第一半导体层和第二半导体层分别从底部到顶部布置。多个发光单元通过多个导体耦合到至少一个相邻的发光单元。通过将发光单元与至少一个相邻的发光单元连接的多个导体，一旦导体断开，AC发光器件将不会发生开路。

10. 发明申请

US20100081220A1 METHOD FOR MANUFACTURING LIGHT-EMITTING DIODE 有权
标题翻译：制造发光二极管的方法
公开(公告)号：US20100081220A1
公开(公告)日：2010-04-01
申请号：US12552368
申请日：2009-09-02
申请人： Wei-Kang Cheng , Jia-Lin Li , Shyi-Ming Pan , Kuo-Chin Huang
发明人： Wei-Kang Cheng , Jia-Lin Li , Shyi-Ming Pan , Kuo-Chin Huang
IPC分类号： H01L21/56
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/504 , H01L33/507 , H01L33/508 , H01L33/56 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to a light-emitting diode (LED) and a method for manufacturing the same. The LED comprises an LED die, one or more metal pads, and a fluorescent layer. The characteristics of the present invention include that the metals pads are left exposed for the convenience of subsequent wiring and packaging processes. In addition, the LED provided by the present invention is a single light-mixing chip, which can be packaged directly without the need of coating fluorescent powders on the packaging glue. Because the fluorescent layer and the packaging glue are not processed simultaneously and are of different materials, the stress problem in the packaged LED can be reduced effectively.
摘要翻译：本发明涉及发光二极管（LED）及其制造方法。 LED包括LED管芯，一个或多个金属焊盘和荧光层。本发明的特征包括为了方便后续的布线和包装过程，将金属垫留下来露出。此外，本发明提供的LED是单一的混合芯片，其可以直接包装而不需要在包装胶上涂布荧光粉。由于荧光层和包装胶不是同时处理并且具有不同的材料，所以可以有效地降低封装LED中的应力问题。

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