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1. 发明授权

US07498676B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US07498676B2
公开(公告)日：2009-03-03
申请号：US11276825
申请日：2006-03-15
申请人： Kenji Nagasaki
发明人： Kenji Nagasaki
IPC分类号： H01L23/48 , H01L23/52
CPC分类号： H01L23/3114 , H01L21/561 , H01L24/10 , H01L24/13 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05024 , H01L2224/05124 , H01L2224/05147 , H01L2224/05166 , H01L2224/05569 , H01L2224/056 , H01L2224/13 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/014 , H01L2924/00 , H01L2924/00014
摘要： A semiconductor device includes a semiconductor substrate, an electrode pad, a wiring, a conductive post, an insulator, a sealing resin, and an external electrode. The electrode pad is formed on the main surface of the semiconductor substrate. The wiring is formed above the semiconductor substrate, the wiring electrically connecting with the electrode pad. The conductive post is formed on the upper surface of the wiring, the conductive post electrically connecting with the wiring. The insulator is formed on the lateral surfaces of the conductive post and has a thermosetting property. The sealing resin is formed over the semiconductor substrate and the wiring and on the surface of the insulator. The external electrode is formed on the conductive post, the external electrode electrically connecting with the conductive post.
摘要翻译：半导体器件包括半导体衬底，电极焊盘，布线，导电柱，绝缘体，密封树脂和外部电极。电极焊盘形成在半导体衬底的主表面上。布线形成在半导体基板上方，布线与电极焊盘电连接。导电柱形成在布线的上表面上，导电柱与布线电连接。绝缘体形成在导电柱的侧表面上并且具有热固性。密封树脂形成在半导体衬底和布线上以及绝缘体的表面上。外部电极形成在导电柱上，外部电极与导电柱电连接。

2. 发明授权

US07341048B2 Fuel vapor treatment apparatus 有权
标题翻译：燃油蒸汽处理装置
公开(公告)号：US07341048B2
公开(公告)日：2008-03-11
申请号：US11453049
申请日：2006-06-15
申请人： Nobuhiko Koyama , Kenji Nagasaki , Shinsuke Kiyomiya
发明人： Nobuhiko Koyama , Kenji Nagasaki , Shinsuke Kiyomiya
IPC分类号： F02M51/00 , F02M33/02
CPC分类号： F02M25/089 , F02D41/0042 , F02D41/0045 , F02M25/0827 , F02M25/0836 , F02M33/04
摘要： A concentration-detecting unit detects concentration of fuel vapor flowing in a concentration-detecting passage branched from a purge passage. The concentration-detecting passage communicates with a communicating passage of a canister. Air including the fuel vapor of which concentration is detected by a concentration-detecting unit is returned to the communicating passage of the canister. The fuel vapor is adsorbed by an absorbent accommodated in a accommodating chamber to restrict a discharge of the fuel vapor into atmosphere.
摘要翻译：浓度检测单元检测在从净化通道分支的浓度检测通道中流动的燃料蒸汽的浓度。集中检测通道与罐的连通通道连通。包含由浓度检测单元检测浓度的燃料蒸气的空气返回到罐的连通通道。燃料蒸汽被容纳在容纳室中的吸收剂吸附以限制燃料蒸气排放到大气中。

3. 发明申请

US20070286747A1 Drive control device of fuel pump 失效
标题翻译：燃油泵驱动控制装置
公开(公告)号：US20070286747A1
公开(公告)日：2007-12-13
申请号：US11715397
申请日：2007-03-08
申请人： Kenichi Nagase , Kenji Nagasaki
发明人： Kenichi Nagase , Kenji Nagasaki
IPC分类号： F04B17/03
CPC分类号： F04B49/20 , F02D41/065 , F02D41/3082 , F02N11/0814
摘要： A drive control device of a fuel pump for sucking fuel in a fuel tank supplying the fuel to an internal combustion engine, and using a motor with a brush as a drive source thereof. The drive control device includes a starting current reduction control device that starts the fuel pump in a state where a drive current of the fuel pump is reduced.
摘要翻译：一种燃料泵的驱动控制装置，用于在向内燃机供应燃料的燃料箱中吸入燃料，并且使用具有刷子的电动机作为其驱动源。驱动控制装置包括起动电流降低控制装置，其在燃料泵的驱动电流减小的状态下启动燃料泵。

4. 发明授权

US07165446B2 Failure diagnostic apparatus for fuel vapor purge system and fuel vapor purge apparatus and combustion engine having failure diagnostic apparatus 有权
标题翻译：具有故障诊断装置的燃料蒸气吹扫系统和燃料蒸气吹扫装置和内燃机故障诊断装置
公开(公告)号：US07165446B2
公开(公告)日：2007-01-23
申请号：US11099479
申请日：2005-04-06
申请人： Hideki Miyahara , Tokiji Ito , Kenji Nagasaki
发明人： Hideki Miyahara , Tokiji Ito , Kenji Nagasaki
IPC分类号： G01M19/00
CPC分类号： F02M25/08 , F02M25/0809 , F02M25/0818 , F02M25/089
摘要： After a reference pressure using a reference hole is measured, a pressure in an evaporation path is measured. An ECU conducts failure diagnosis using, as a determination pressure for diagnosing presence/absence of a failure, a value obtained by correcting the reference pressure using the reference hole in a manner lowering the same by a predetermined amount, taking into account pressure lowering in the evaporation path due to condensation of fuel vapor at the time of adsorption in a canister when a vapor concentration in the evaporation path is high.
摘要翻译：在测量使用参考孔的参考压力之后，测量蒸发路径中的压力。作为用于诊断故障存在/不存在的判定压力，ECU通过使用基准孔将基准压力以下降方式进行校正的值进行故障诊断，考虑到压力降低当蒸发路径中的蒸汽浓度高时，由于在罐中吸附时的燃料蒸气的冷凝导致的蒸发路径。

5. 发明申请

US20060292742A1 Manufacturing method for packaged semiconductor device 有权
标题翻译：封装半导体器件的制造方法
公开(公告)号：US20060292742A1
公开(公告)日：2006-12-28
申请号：US11511267
申请日：2006-08-29
申请人： Kenji Nagasaki
发明人： Kenji Nagasaki
IPC分类号： H01L21/00
CPC分类号： H01L23/3121 , H01L23/3114 , H01L23/3171 , H01L24/03 , H01L24/05 , H01L24/13 , H01L2224/02313 , H01L2224/02377 , H01L2224/0346 , H01L2224/0384 , H01L2224/0391 , H01L2224/0401 , H01L2224/04105 , H01L2224/05008 , H01L2224/05022 , H01L2224/05027 , H01L2224/05147 , H01L2224/05548 , H01L2224/05571 , H01L2224/12105 , H01L2224/13023 , H01L2224/131 , H01L2924/0002 , H01L2924/01029 , H01L2924/351 , Y10S438/958 , H01L2924/00014 , H01L2924/00012 , H01L2924/014 , H01L2224/05552 , H01L2924/00
摘要： A semiconductor device in which moisture penetration into the package interior is suppressed, comprising a rewiring layer formed by plating, with improved reliability of electrical characteristics. On the main surface of a semiconductor chip comprising circuit elements and formed on a wafer, a passivation film opposing the circuit elements is formed, so as to expose a first region of the main surface along the edges of the main surface. An insulating film, which extends over the main surface and along the side faces of this passivation film and onto the main surface of the semiconductor chip, is formed such that there remains a second region within the first region, along the edges of the main surface. A sealing layer covering the insulating film is then formed on the second region.
摘要翻译：抑制了水分渗透到封装内部的半导体器件，包括通过电镀形成的再布线层，具有改善的电特性的可靠性。在包括电路元件并形成在晶片上的半导体芯片的主表面上，形成与电路元件相对的钝化膜，以便沿着主表面的边缘露出主表面的第一区域。形成绝缘膜，该绝缘膜在该钝化膜的主表面上并且沿着该钝化膜的侧面延伸到半导体芯片的主表面上，使得沿着主表面的边缘保留第一区域内的第二区域。然后在第二区域上形成覆盖绝缘膜的密封层。

6. 发明授权

US07066017B2 Method of detecting pressure leakage in evaporated fuel control system for use in automobile 失效
公开(公告)号：US07066017B2
公开(公告)日：2006-06-27
申请号：US10270155
申请日：2002-10-15
申请人： Masao Kano , Kenji Nagasaki
发明人： Masao Kano , Kenji Nagasaki
IPC分类号： G01M15/00
CPC分类号： F02M25/0809 , F02M25/0836
摘要： Pressure leakage in an evaporated fuel control system having a canister for absorbing evaporated fuel in a fuel tank is detected after an engine is stopped and a temperature in the system is stabilized. In the leakage detecting process, communication between the system and an atmospheric pressure is shut-off by closing an electromagnetic valve connected to the canister. The electromagnetic valve is closed by once supplying a full voltage thereto, and the closed-state is maintained by intermittently supplying a voltage in a duty-ratio-controlled manner or by supplying a lower voltage. Thus, power consumption for maintaining the closed-state is reduced.

7. 发明授权

US07004013B2 Evaporative emission leak detection system with brushless motor 有权
标题翻译：具有无刷电机的蒸发排放泄漏检测系统
公开(公告)号：US07004013B2
公开(公告)日：2006-02-28
申请号：US10459440
申请日：2003-06-12
申请人： Mitsuyuki Kobayashi , Yoshichika Yamada , Masao Kano , Kenji Nagasaki
发明人： Mitsuyuki Kobayashi , Yoshichika Yamada , Masao Kano , Kenji Nagasaki
IPC分类号： G01M3/04
CPC分类号： F02M25/0809
摘要： An evaporative emission leak detection system provides for detecting a leakage of a fuel vapor evaporating in a fuel tank by using a pressure difference between an inside and outside of the fuel tank. The system includes a pump for providing the pressure difference between the inside and outside of the fuel tank, a brushless motor for operating the pump, a first passage connecting to the fuel tank, a second passage connecting to the outside of the fuel tank, and a switching device for switching connections between the pump and at least one of the first passage and the second passage. The first passage has an adsorbent for adsorbing the fuel vapor. This system ensures a long life time and high accuracy of the leak detection.
摘要翻译：蒸发排放物泄漏检测系统通过使用燃料箱的内部和外部之间的压力差来检测在燃料箱中蒸发的燃料蒸气的泄漏。该系统包括用于提供燃料箱内部和外部之间的压力差的泵，用于操作泵的无刷电动机，连接到燃料箱的第一通道，连接到燃料箱外部的第二通道，以及用于切换泵与第一通道和第二通道中的至少一个之间的连接的开关装置。第一通道具有用于吸附燃料蒸气的吸附剂。该系统确保了长时间的使用和高精度的泄漏检测。

8. 发明授权

US07687320B2 Manufacturing method for packaged semiconductor device 有权
标题翻译：封装半导体器件的制造方法
公开(公告)号：US07687320B2
公开(公告)日：2010-03-30
申请号：US11511267
申请日：2006-08-29
申请人： Kenji Nagasaki
发明人： Kenji Nagasaki
IPC分类号： H01L23/29 , H01L23/12
CPC分类号： H01L23/3121 , H01L23/3114 , H01L23/3171 , H01L24/03 , H01L24/05 , H01L24/13 , H01L2224/02313 , H01L2224/02377 , H01L2224/0346 , H01L2224/0384 , H01L2224/0391 , H01L2224/0401 , H01L2224/04105 , H01L2224/05008 , H01L2224/05022 , H01L2224/05027 , H01L2224/05147 , H01L2224/05548 , H01L2224/05571 , H01L2224/12105 , H01L2224/13023 , H01L2224/131 , H01L2924/0002 , H01L2924/01029 , H01L2924/351 , Y10S438/958 , H01L2924/00014 , H01L2924/00012 , H01L2924/014 , H01L2224/05552 , H01L2924/00
摘要： A semiconductor device in which moisture penetration into the package interior is suppressed, comprising a rewiring layer formed by plating, with improved reliability of electrical characteristics. On the main surface of a semiconductor chip comprising circuit elements and formed on a wafer, a passivation film opposing the circuit elements is formed, so as to expose a first region of the main surface along the edges of the main surface. An insulating film, which extends over the main surface and along the side faces of this passivation film and onto the main surface of the semiconductor chip, is formed such that there remains a second region within the first region, along the edges of the main surface. A sealing layer covering the insulating film is then formed on the second region.
摘要翻译：抑制了水分渗透到封装内部的半导体器件，包括通过电镀形成的再布线层，具有改善的电特性的可靠性。在包括电路元件并形成在晶片上的半导体芯片的主表面上，形成与电路元件相对的钝化膜，以便沿着主表面的边缘露出主表面的第一区域。形成绝缘膜，该绝缘膜在该钝化膜的主表面上并且沿着该钝化膜的侧面延伸到半导体芯片的主表面上，使得沿着主表面的边缘保留第一区域内的第二区域。然后在第二区域上形成覆盖绝缘膜的密封层。

9. 发明申请

US20100044859A1 Semiconductor device and method of fabricating semiconductor device 有权
标题翻译：半导体器件及半导体器件的制造方法
公开(公告)号：US20100044859A1
公开(公告)日：2010-02-25
申请号：US12461089
申请日：2009-07-31
申请人： Tadashi Yamaguchi , Kenji Nagasaki
发明人： Tadashi Yamaguchi , Kenji Nagasaki
IPC分类号： H01L23/485 , H01L23/28
CPC分类号： H01L24/05 , H01L22/32 , H01L24/03 , H01L24/13 , H01L2224/02311 , H01L2224/02331 , H01L2224/0235 , H01L2224/0239 , H01L2224/0345 , H01L2224/03462 , H01L2224/0391 , H01L2224/0392 , H01L2224/0401 , H01L2224/05008 , H01L2224/0508 , H01L2224/05147 , H01L2224/05166 , H01L2224/05181 , H01L2224/05553 , H01L2224/05569 , H01L2224/05571 , H01L2224/05647 , H01L2224/13099 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/81191 , H01L2224/81815 , H01L2924/00013 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2924/19043 , H01L2924/30105 , H01L2924/01022 , H01L2924/01073 , H01L2924/00014 , H01L2924/01028 , H01L2224/05099 , H01L2224/13599 , H01L2224/05599 , H01L2224/29099 , H01L2224/29599 , H01L2924/014 , H01L2224/05552 , H01L2924/00
摘要： There is provided a semiconductor device including a semiconductor substrate on which at least one electrode pad is formed, a rewiring layer connected to the electrode pad, and an encapsulation part which encapsulates the semiconductor substrate, the electrode pad being formed of a first region including a connection part connected to the rewiring layer and a second region other than the first region, the device including: an insulating film provided on the semiconductor substrate, having an opening at which the first region in the electrode pad is exposed, and covering the second region of the electrode pad, wherein the rewiring layer is connected to the first region of the electrode pad exposed at the opening, and extends across the insulating film so as to cover the second region of the electrode pad from above.
摘要翻译：提供了一种半导体器件，包括其上形成有至少一个电极焊盘的半导体衬底，连接到电极焊盘的重新布线层和封装半导体衬底的封装部分，电极焊盘由包括第一区域的第一区域形成，连接部分连接到再布线层和除第一区域之外的第二区域，该装置包括：设置在半导体衬底上的绝缘膜，具有露出电极焊盘中的第一区域的开口，并覆盖第二区域，其中所述重新布线层连接到在所述开口处暴露的所述电极焊盘的所述第一区域，并且延伸穿过所述绝缘膜，以便从上方覆盖所述电极焊盘的所述第二区域。

10. 发明授权

US07284530B2 Leak detector for fuel vapor purge system 失效
标题翻译：泄漏检测器用于燃油蒸气清洗系统
公开(公告)号：US07284530B2
公开(公告)日：2007-10-23
申请号：US11264152
申请日：2005-11-02
申请人： Kenji Nagasaki , Tokiji Ito , Hideki Miyahara
发明人： Kenji Nagasaki , Tokiji Ito , Hideki Miyahara
IPC分类号： F02B77/08
CPC分类号： F02M25/0818 , F02M25/0836 , F02M25/0854 , F02M25/0872 , F02M25/089
摘要： A suction pump introduces negative pressure into a reference-pressure-detecting portion. A driving voltage V of the suction pump is adjusted in such a manner that pressure Pr in the reference-pressure-detecting portion is within a target pressure range. When the pressure Pr is brought into the target pressure range, the driving voltage V of the suction pump is stored as a first driving voltage V1 and the pressure Pr is stored as a reference pressure Pr. When pressure detection and leak detection process are conducted, the suction pump is driven at the first driving voltage V1 to introduce the negative pressure. The computer compares the pressure Pr with a leak determination value to determine whether a leak exists.
摘要翻译：抽吸泵将负压引入参考压力检测部分。调节吸入泵的驱动电压V，使得基准压力检测部的压力Pr在目标压力范围内。当压力Pr达到目标压力范围时，抽吸泵的驱动电压V被存储为第一驱动电压V 1，并且压力Pr被存储为参考压力Pr。当进行压力检测和泄漏检测处理时，抽吸泵以第一驱动电压V 1被驱动以引入负压。计算机将压力Pr与泄漏确定值进行比较，以确定是否存在泄漏。

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