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1. 发明授权

US07748909B2 Bearing apparatus for a wheel of vehicle 有权
标题翻译：用于车轮的轴承装置
公开(公告)号：US07748909B2
公开(公告)日：2010-07-06
申请号：US12257412
申请日：2008-10-24
申请人： Kazuo Komori , Kazuhiro Baba , Kazunori Kubota , Takayuki Norimatsu , Akira Fujimura , Shinji Morita
发明人： Kazuo Komori , Kazuhiro Baba , Kazunori Kubota , Takayuki Norimatsu , Akira Fujimura , Shinji Morita
IPC分类号： F16C13/00 , F16C43/00
CPC分类号： B60B27/0094 , B60B27/0005 , B60B27/001 , B60B27/0084 , F16C19/497 , F16C33/585 , F16C33/64 , F16C2240/80 , F16C2326/02
摘要： A vehicle wheel bearing apparatus has an outer member with a body flange and double row outer raceway surfaces. An inner member includes a wheel hub and an inner ring. They include inner raceway surfaces arranged opposite to the double row outer raceway surfaces. Double row rolling elements are freely rollably contained between the outer and inner raceway surfaces. Outer side rolling elements of the double row rolling elements are balls and inner side rolling elements of the double row rolling elements are tapered rollers. A pitch circle diameter of the inner side tapered rollers is set smaller than that of the outer side balls. A substantially conical recess is formed at an outer side end portion of the wheel hub. The depth of the recess extends to at least near the bottom of the inner raceway surface of the wheel hub. The thickness of a portion of the wheel hub where the inner raceway surface is formed is set within a predetermined range. The outer side wall of the wheel hub has a constant thickness substantially along the inner surface of the recess.
摘要翻译：车轮轴承装置具有外部构件，其具有主体凸缘和双列外滚道表面。内部构件包括轮毂和内圈。它们包括与双列外滚道表面相对布置的内滚道表面。双列滚动元件可自由滚动地容纳在外滚道表面和内滚道表面之间。双列滚动元件的外侧滚动元件是滚珠，双列滚动元件的内侧滚动元件是圆锥滚子。内侧圆锥滚子的节圆直径设定为小于外侧球的节圆直径。在轮毂的外侧端部形成大致圆锥形的凹部。凹槽的深度至少靠近轮毂的内滚道表面的底部附近。形成内滚道表面的轮毂的一部分的厚度设定在预定范围内。轮毂的外侧壁基本上沿着凹部的内表面具有恒定的厚度。

2. 发明授权

US07585699B2 Semiconductor package board using a metal base 有权
公开(公告)号：US07585699B2
公开(公告)日：2009-09-08
申请号：US11477111
申请日：2006-06-29
申请人： Katsumi Kikuchi , Tadanori Shimoto , Koji Matsui , Kazuhiro Baba
发明人： Katsumi Kikuchi , Tadanori Shimoto , Koji Matsui , Kazuhiro Baba
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L21/4857 , H01L21/6835 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L23/49833 , H01L23/5389 , H01L24/19 , H01L24/81 , H01L2224/73204 , H01L2224/81801 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/014 , H01L2924/12042 , H01L2924/19041 , H01L2924/19043 , H05K3/0097 , H05K3/06 , H05K3/20 , H05K3/205 , H05K3/4007 , H05K3/44 , H05K3/4644 , H05K3/4682 , H05K2201/0367 , H05K2201/0969 , H05K2203/0323 , H05K2203/0376 , H05K2203/061 , H05K2203/1536 , H01L2924/00
摘要： A semiconductor package board for mounting thereon a semiconductor chip includes a metal base having an opening for receiving therein the semiconductor chip and a multilayer wiring film layered onto the metal base. The semiconductor chip is flip-chip bonded onto the metal pads disposed on the multilayer wiring film within the opening. The surface of the metal base is flush with the top surface of the semiconductor chip received in the opening. The resultant semiconductor device has a larger number of external pins and a smaller deformation without using a stiffener.

3. 发明授权

US07566834B2 Wiring board and semiconductor package using the same 失效
标题翻译：接线板和半导体封装使用相同
公开(公告)号：US07566834B2
公开(公告)日：2009-07-28
申请号：US12140041
申请日：2008-06-16
申请人： Tadanori Shimoto , Katsumi Kikuchi , Hideya Murai , Kazuhiro Baba , Hirokazu Honda , Keiichiro Kata
发明人： Tadanori Shimoto , Katsumi Kikuchi , Hideya Murai , Kazuhiro Baba , Hirokazu Honda , Keiichiro Kata
IPC分类号： H05K1/00
CPC分类号： H01L23/49816 , H01L21/4857 , H01L21/6835 , H01L23/145 , H01L23/49822 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L2221/68345 , H01L2224/16225 , H01L2224/16237 , H01L2224/32014 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/83102 , H01L2224/92125 , H01L2225/0651 , H01L2225/06517 , H01L2225/06586 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/30107 , H01L2924/3011 , H05K1/0366 , H05K3/205 , H05K3/423 , H05K2201/0376 , H05K2201/068 , H05K2203/0733 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A wiring board has a base insulating film. The base insulating film has a thickness of 20 to 100 μm and is made of a heat-resistant resin which has a glass-transition temperature of 150° C. or higher and which contains reinforcing fibers made of glass or aramid. The base insulating film has the following physical properties (1) to (6) when an elastic modulus at a temperature of T° C. is given as DT (GPa) and a breaking strength at a temperature of T° C. is given as HT (MPa). (1) A coefficient of thermal expansion in the direction of thickness thereof is 90 ppm/K or less. (2) D23≧5 (3) D150≧2.5 (4) (D−65/D150)≦3.0 (5) H23≧140 (6) (H−65/H150)≦2.3.
摘要翻译：布线板具有基底绝缘膜。基底绝缘膜的厚度为20〜100μm，由玻璃化转变温度为150℃以上的含有玻璃或芳族聚酰胺的增强纤维的耐热性树脂构成。当T℃温度下的弹性模量为DT（GPa）时，基体绝缘膜具有以下物理性质（1）〜（6）），在温度T℃下的断裂强度为 HT（MPa）。（1）其厚度方向的热膨胀系数为90ppm / K以下。（2）D23> = 5（3）D150> = 2.5（4）（D-65 / D150）<= 3.0（5）H23> = 140（6）（H-65 / H150）<= 2.3。

4. 发明申请

US20090116779A1 BEARING APPARATUS FOR A WHEEL OF VEHICLE 有权
标题翻译：汽车轮轴承装置
公开(公告)号：US20090116779A1
公开(公告)日：2009-05-07
申请号：US12277427
申请日：2008-11-25
申请人： Kazuo Komori , Kazuhiro Baba , Kazunori Kubota
发明人： Kazuo Komori , Kazuhiro Baba , Kazunori Kubota
IPC分类号： F16C19/14 , F16C19/18
CPC分类号： F16C19/386 , B60B27/00 , B60B27/001 , F16C19/497 , F16C19/505 , F16C33/64 , F16C43/04 , F16C2240/40 , F16C2240/80 , F16C2326/02
摘要： A vehicle wheel bearing apparatus has an outer member and inner member. The inner member includes a wheel hub and inner ring. The outer member and inner member include respective raceway surfaces. Double row rolling elements are freely rollably contained between the outer and inner raceway surfaces, respectively, of the outer member and the inner member. At least the inner side rolling elements of the double row rolling elements are tapered rollers. A pitch circle diameter of the inner side rolling elements is set smaller than a pitch circle diameter of the outer side rolling elements. A substantially conical recess is formed at an outer side end portion of the wheel hub. The depth of the recess extends near to a shaft shaped portion beyond the bottom of the inner raceway surface of the wheel hub. The thickness of a portion of the wheel hub where the inner raceway surface is formed is set within a predetermined range. The outer side wall of the wheel hub is formed to have a substantially constant thickness along the inner surface of the recess.
摘要翻译：车轮轴承装置具有外部构件和内部构件。内部构件包括轮毂和内圈。外部构件和内部构件包括相应的滚道表面。双列滚动元件可自由地滚动地容纳在外部构件和内部构件的外部和内部滚道表面之间。至少双列滚动元件的内侧滚动元件是圆锥滚子。内侧滚动体的节圆直径设定为小于外侧滚动体的节圆直径。在轮毂的外侧端部形成大致圆锥形的凹部。所述凹部的深度靠近所述轮毂的所述内滚道表面的底部之外的轴形部分延伸。形成内滚道表面的轮毂的一部分的厚度设定在预定范围内。轮毂的外侧壁沿着凹部的内表面形成为具有基本恒定的厚度。

5. 发明申请

US20090052823A1 Bearing Apparatus for a Wheel of Vehicle 有权
标题翻译：车轮用轴承装置
公开(公告)号：US20090052823A1
公开(公告)日：2009-02-26
申请号：US12257412
申请日：2008-10-24
申请人： Kazuo Komori , Kazuhiro Baba , Kazunori Kubota , Takayuki Norimatsu , Akira Fujimura , Shinji Morita
发明人： Kazuo Komori , Kazuhiro Baba , Kazunori Kubota , Takayuki Norimatsu , Akira Fujimura , Shinji Morita
IPC分类号： F16C19/54
CPC分类号： B60B27/0094 , B60B27/0005 , B60B27/001 , B60B27/0084 , F16C19/497 , F16C33/585 , F16C33/64 , F16C2240/80 , F16C2326/02
摘要： A vehicle wheel bearing apparatus has an outer member with a body flange and double row outer raceway surfaces. An inner member includes a wheel hub and an inner ring. They include inner raceway surfaces arranged opposite to the double row outer raceway surfaces. Double row rolling elements are freely rollably contained between the outer and inner raceway surfaces. Outer side rolling elements of the double row rolling elements are balls and inner side rolling elements of the double row rolling elements are tapered rollers. A pitch circle diameter of the inner side tapered rollers is set smaller than that of the outer side balls. A substantially conical recess is formed at an outer side end portion of the wheel hub. The depth of the recess extends to at least near the bottom of the inner raceway surface of the wheel hub. The thickness of a portion of the wheel hub where the inner raceway surface is formed is set within a predetermined range. The outer side wall of the wheel hub has a constant thickness substantially along the inner surface of the recess.
摘要翻译：车轮轴承装置具有外部构件，其具有主体凸缘和双列外滚道表面。内部构件包括轮毂和内圈。它们包括与双列外滚道表面相对布置的内滚道表面。双列滚动元件可自由滚动地容纳在外滚道表面和内滚道表面之间。双列滚动元件的外侧滚动元件是滚珠，双列滚动元件的内侧滚动元件是圆锥滚子。内侧圆锥滚子的节圆直径设定为小于外侧球的节圆直径。在轮毂的外侧端部形成大致圆锥形的凹部。凹槽的深度至少靠近轮毂的内滚道表面的底部附近。形成内滚道表面的轮毂的一部分的厚度设定在预定范围内。轮毂的外侧壁基本上沿着凹部的内表面具有恒定的厚度。

6. 发明申请

US20080205811A1 Bearing Apparatus For A Wheel of Vehicle 有权
标题翻译：车轮轴承装置
公开(公告)号：US20080205811A1
公开(公告)日：2008-08-28
申请号：US12107144
申请日：2008-04-22
申请人： Kazuo Komori , Kazuhiro Baba
发明人： Kazuo Komori , Kazuhiro Baba
IPC分类号： F16C13/02
CPC分类号： F16C19/186 , B60B27/0005 , B60B27/0084 , B60B27/0094 , F16C19/185 , F16C33/581 , F16C33/64 , F16C43/06 , F16C2240/80 , F16C2326/02 , Y02T10/86
摘要： A vehicle wheel bearing apparatus has a pitch circle diameter of an outer side ball group that is larger than a pitch circle diameter of an inner side ball group. Each corner portion of the outer circumferential surfaces of the inner member is rounded as a smooth circular arc.
摘要翻译：车轮轴承装置具有比内侧球组的节圆直径大的外侧球轴组的节圆直径。内部构件的外圆周表面的每个角部分被圆形为平滑的圆弧。

7. 发明申请

US20060244137A1 Semiconductor package board using a metal base 有权
公开(公告)号：US20060244137A1
公开(公告)日：2006-11-02
申请号：US11477111
申请日：2006-06-29
申请人： Katsumi Kikuchi , Tadanori Shimoto , Koji Matsui , Kazuhiro Baba
发明人： Katsumi Kikuchi , Tadanori Shimoto , Koji Matsui , Kazuhiro Baba
IPC分类号： H01L23/48
CPC分类号： H01L21/4857 , H01L21/6835 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L23/49833 , H01L23/5389 , H01L24/19 , H01L24/81 , H01L2224/73204 , H01L2224/81801 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/014 , H01L2924/12042 , H01L2924/19041 , H01L2924/19043 , H05K3/0097 , H05K3/06 , H05K3/20 , H05K3/205 , H05K3/4007 , H05K3/44 , H05K3/4644 , H05K3/4682 , H05K2201/0367 , H05K2201/0969 , H05K2203/0323 , H05K2203/0376 , H05K2203/061 , H05K2203/1536 , H01L2924/00
摘要： A semiconductor package board for mounting thereon a semiconductor chip includes a metal base having an opening for receiving therein the semiconductor chip and a multilayer wiring film layered onto the metal base. The semiconductor chip is flip-chip bonded onto the metal pads disposed on the multilayer wiring film within the opening. The surface of the metal base is flush with the top surface of the semiconductor chip received in the opening. The resultant semiconductor device has a larger number of external pins and a smaller deformation without using a stiffener.

8. 发明申请

US20050252682A1 Wiring board and semiconductor package using the same 失效
标题翻译：接线板和半导体封装使用相同
公开(公告)号：US20050252682A1
公开(公告)日：2005-11-17
申请号：US11125158
申请日：2005-05-10
申请人： Tadanori Shimoto , Katsumi Kikuchi , Hideya Murai , Kazuhiro Baba , Hirokazu Honda , Keiichiro Kata
发明人： Tadanori Shimoto , Katsumi Kikuchi , Hideya Murai , Kazuhiro Baba , Hirokazu Honda , Keiichiro Kata
IPC分类号： H01L23/12 , H01L21/48 , H01L21/68 , H01L23/14 , H01L23/498 , H01L25/065 , H05K1/03 , H05K1/11 , H05K3/20 , H05K3/42
CPC分类号： H01L23/49816 , H01L21/4857 , H01L21/6835 , H01L23/145 , H01L23/49822 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L2221/68345 , H01L2224/16225 , H01L2224/16237 , H01L2224/32014 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/83102 , H01L2224/92125 , H01L2225/0651 , H01L2225/06517 , H01L2225/06586 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/30107 , H01L2924/3011 , H05K1/0366 , H05K3/205 , H05K3/423 , H05K2201/0376 , H05K2201/068 , H05K2203/0733 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A wiring board has a base insulating film. The base insulating film has a thickness of 20 to 100 μm and is made of a heat-resistant resin which has a glass-transition temperature of 150° C. or higher and which contains reinforcing fibers made of glass or aramid. The base insulating film has the following physical properties (1) to (6) when an elastic modulus at a temperature of T° C. is given as DT (GPa) and a breaking strength at a temperature of T° C. is given as HT (MPa). (1) A coefficient of thermal expansion in the direction of thickness thereof is 90 ppm/K or less. (2) D23≧5 (3) D150≧2.5 (4) (D-65/D150)≦3.0 (5) H23≧140 (6) (H-65/H150)≦2.3
摘要翻译：布线板具有基底绝缘膜。基底绝缘膜的厚度为20〜100μm，由玻璃化转变温度为150℃以上的含有玻璃或芳族聚酰胺的增强纤维的耐热性树脂构成。当在T℃的温度下的弹性模量为D T（GPa）时，基体绝缘膜具有以下物理性质（1）至（6））和在温度下的断裂强度的T℃给出为H T（MPa）。（1）其厚度方向的热膨胀系数为90ppm / K以下。（2）D 23 = 5（3）D 150 > = 2.5（4）（D-65 / D 150 <= 3.0（5）H 23 = 140（6）（H-65 / H 150） 2.3

9. 发明授权

US06841862B2 Semiconductor package board using a metal base 有权
标题翻译：半导体封装板采用金属底座
公开(公告)号：US06841862B2
公开(公告)日：2005-01-11
申请号：US09894123
申请日：2001-06-29
申请人： Katsumi Kikuchi , Tadanori Shimoto , Koji Matsui , Kazuhiro Baba
发明人： Katsumi Kikuchi , Tadanori Shimoto , Koji Matsui , Kazuhiro Baba
IPC分类号： H01L21/60 , H01L23/498 , H01L23/538 , H05K3/00 , H05K3/06 , H05K3/20 , H05K3/40 , H05K3/44 , H05K3/46 , H01L23/02 , H05K1/03
CPC分类号： H01L21/4857 , H01L21/6835 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L23/49833 , H01L23/5389 , H01L24/19 , H01L24/81 , H01L2224/73204 , H01L2224/81801 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/014 , H01L2924/12042 , H01L2924/19041 , H01L2924/19043 , H05K3/0097 , H05K3/06 , H05K3/20 , H05K3/205 , H05K3/4007 , H05K3/44 , H05K3/4644 , H05K3/4682 , H05K2201/0367 , H05K2201/0969 , H05K2203/0323 , H05K2203/0376 , H05K2203/061 , H05K2203/1536 , H01L2924/00
摘要： A semiconductor package board for mounting thereon a semiconductor chip includes a metal base having an opening for receiving therein the semiconductor chip and a multilayer wiring film layered onto the metal base. The semiconductor chip is flip-chip bonded onto the metal pads disposed on the multilayer wiring film within the opening. The surface of the metal base is flush with the top surface of the semiconductor chip received in the opening. The resultant semiconductor device has a larger number of external pins and a smaller deformation without using a stiffener.
摘要翻译：用于安装半导体芯片的半导体封装板包括具有用于在其中接收半导体芯片的开口的金属基体和层叠在金属基底上的多层布线膜。将半导体芯片倒装芯片接合到设置在开口内的多层布线膜上的金属焊盘上。金属基体的表面与容纳在开口中的半导体芯片的顶表面齐平。所得的半导体器件在不使用加强件的情况下具有较大数量的外部引脚和较小的变形。

10. 发明授权

US08313242B2 Sensor-equipped bearing for wheel 有权
标题翻译：带传感器的轴承用于车轮
公开(公告)号：US08313242B2
公开(公告)日：2012-11-20
申请号：US13349934
申请日：2012-01-13
申请人： Takayuki Norimatsu , Toru Takahashi , Kazuo Komori , Kazuhiro Baba , Kentarou Nishikawa
发明人： Takayuki Norimatsu , Toru Takahashi , Kazuo Komori , Kazuhiro Baba , Kentarou Nishikawa
IPC分类号： F16C32/00 , G01L3/14
CPC分类号： F16C33/58 , B60B27/0005 , B60B27/0068 , B60B27/0094 , F16C19/186 , F16C19/522 , F16C41/00 , F16C2326/02 , G01L5/0019
摘要： A sensor equipped wheel support bearing assembly for supporting a vehicle wheel rotatably relative to a vehicle body, including an outer member; an inner member; a plurality of rows of rolling elements interposed between the outer and inner member; a strain sensor unit, made up of a strain generating member and a sensor element fitted to the strain generating member for detecting strains induced in the strain generating member, is fitted to one of the outer and inner members, that serves as a stationary member; and a covering member that covers at least the sensor element sealingly, provided on a mounting surface of the strain generating member of the strain sensor unit, on which the sensor element is mounted, the covering member being made of a resin which is over-molded or an elastomer bonded by vulcanization.
摘要翻译：一种传感器配备的车轮支撑轴承组件，用于相对于车身可转动地支撑车轮，包括外部构件; 内部成员; 插入在所述外部构件和所述内部构件之间的多排滚动元件; 应变传感器单元由应变发生部件和安装在应变发生部件上的检测应变发生部件引起的应变的传感器部件配合在作为固定部件的外部部件和内部部件之一上; 以及覆盖部件，其至少覆盖传感器元件，设置在安装有传感器元件的应变传感器单元的应变发生部件的安装面上，所述覆盖部件由外部成形的树脂制成或通过硫化粘合的弹性体。

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