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1. 发明授权

US08884321B2 Luminous element 有权
标题翻译：发光元件
公开(公告)号：US08884321B2
公开(公告)日：2014-11-11
申请号：US12936477
申请日：2009-04-06
申请人： June O. Song
发明人： June O. Song
IPC分类号： H01L33/00 , H01L33/38 , H01L33/40 , H01L27/15
CPC分类号： H01L33/0033 , H01L23/60 , H01L27/15 , H01L33/385 , H01L33/405 , H01L33/60 , H01L2924/0002 , H01L2924/00
摘要： A light emitting device according to the embodiment includes a first conductive semiconductor layer; an active layer over the first conductive semiconductor layer; a second conductive semiconductor layer over the active layer; a bonding layer over the second conductive semiconductor layer; a schottky diode layer over the bonding layer; an insulating layer for partially exposing the bonding layer, the schottky diode layer, and the first conductive semiconductor layer; a first electrode layer electrically connected to both of the first conductive semiconductor layer and the schottky diode layer; and a second electrode layer electrically connected to the bonding layer.
摘要翻译：根据实施例的发光器件包括第一导电半导体层; 在第一导电半导体层上方的有源层; 在有源层上的第二导电半导体层; 在第二导电半导体层上的结合层; 结合层上的肖特基二极管层; 用于部分地暴露所述接合层，所述肖特基二极管层和所述第一导电半导体层的绝缘层; 与第一导电半导体层和肖特基二极管层电连接的第一电极层; 以及与所述接合层电连接的第二电极层。

2. 发明授权

US08872215B2 Light emitting device and light emitting device package 有权
标题翻译：发光器件和发光器件封装
公开(公告)号：US08872215B2
公开(公告)日：2014-10-28
申请号：US13033224
申请日：2011-02-23
申请人： Kwang Ki Choi , Hwan Hee Jeong , Sang Youl Lee , June O Song
发明人： Kwang Ki Choi , Hwan Hee Jeong , Sang Youl Lee , June O Song
IPC分类号： H01L33/36 , H01L33/38 , H01L33/14 , H01L27/15 , H01L33/22
CPC分类号： H01L27/15 , H01L29/78 , H01L33/22 , H01L33/38 , H01L33/385 , H01L33/46 , H01L33/62 , H01L2224/48091 , H01L2924/13062 , H01L2924/13091 , H01L2924/00014 , H01L2924/00
摘要： A light emitting device according to the embodiment includes a first electrode; a light emitting structure including a first semiconductor layer, an active layer and a second semiconductor layer on the first electrode; a second electrode on the light emitting structure; and a control switch installed on the light emitting structure to control the light emitting structure.
摘要翻译：根据实施例的发光器件包括第一电极; 在第一电极上包括第一半导体层，有源层和第二半导体层的发光结构; 在发光结构上的第二电极; 以及安装在发光结构上以控制发光结构的控制开关。

3. 发明授权

US08791494B2 Light emitting device and light emitting device package 有权
公开(公告)号：US08791494B2
公开(公告)日：2014-07-29
申请号：US14055675
申请日：2013-10-16
申请人： Hwan Hee Jeong , Sang Youl Lee , Ji Hyung Moon , June O Song , Kwang Ki Choi
发明人： Hwan Hee Jeong , Sang Youl Lee , Ji Hyung Moon , June O Song , Kwang Ki Choi
IPC分类号： H01L33/00 , H01L33/36 , H01L33/44 , H01L33/40 , H01L33/42 , H01L33/10 , H01L33/22
CPC分类号： H01L33/44 , F21K9/23 , F21Y2105/10 , F21Y2113/13 , F21Y2115/10 , H01L33/0079 , H01L33/06 , H01L33/10 , H01L33/22 , H01L33/32 , H01L33/36 , H01L33/38 , H01L33/387 , H01L33/40 , H01L33/42 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/0002 , H01L2924/12032 , H01L2924/00014 , H01L2924/00
摘要： Disclosed are a light emitting device and a light emitting device package. The light emitting device includes a light emitting structure including a first conductive semiconductor layer, an active layer on the first conductive semiconductor layer, and a second conductive semiconductor layer on the active layer, an adhesive layer contacting a top surface of the first conductive semiconductor layer, a first electrode contacting a top surface of the first conductive semiconductor and a top surface of the adhesive layer, and a second electrode contacting the second conductive semiconductor layer, wherein the adhesive layer contacting the first electrode is spaced apart from the second electrode.

4. 发明授权

US08791481B2 Light emitting device and manufacturing method for same 有权
标题翻译：发光元件及其制造方法
公开(公告)号：US08791481B2
公开(公告)日：2014-07-29
申请号：US12936071
申请日：2009-04-01
申请人： June O Song
发明人： June O Song
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L33/0079 , H01L33/0095 , H01L33/08 , H01L33/145 , H01L33/387 , H01L33/44 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： Disclosed are a light emitting device and a method of manufacturing the same. The light emitting device includes a support substrate, a reflective ohmic contact layer on the support substrate, a functional complex layer including a process assisting region and ohmic contact regions divided by the process assisting region on the reflective ohmic contact layer, and a light emitting semiconductor layer including a second conductive semiconductor layer, an active layer, and a first conductive semiconductor layer on each ohmic contact region.
摘要翻译：公开了一种发光器件及其制造方法。发光器件包括支撑衬底，支撑衬底上的反射欧姆接触层，包括由反射欧姆接触层上的工艺辅助区划分的工艺辅助区和欧姆接触区的功能复合层，以及发光半导体层，包括在每个欧姆接触区域上的第二导电半导体层，有源层和第一导电半导体层。

5. 发明授权

US08766287B2 Light emitting device, light emitting device package, and lighting device with the same 有权
标题翻译：发光装置，发光装置封装和照明装置
公开(公告)号：US08766287B2
公开(公告)日：2014-07-01
申请号：US13242345
申请日：2011-09-23
申请人： Ji Hyung Moon , Sang Youl Lee , Chung Song Kim , Kwang Ki Choi , June O Song
发明人： Ji Hyung Moon , Sang Youl Lee , Chung Song Kim , Kwang Ki Choi , June O Song
IPC分类号： H01L29/18 , H01L33/38 , H01L25/075 , H01L33/62 , H01L27/15 , H01L33/20 , F21K99/00
CPC分类号： H01L33/382 , F21K9/00 , H01L25/0753 , H01L27/153 , H01L33/20 , H01L33/387 , H01L33/405 , H01L33/62 , H01L2924/0002 , H01L2933/0016 , H01L2924/00
摘要： The present invention relates to a light emitting device, a light emitting device package, and a lighting device with the same.The light emitting device includes a light emitting structure including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer, a second electrode layer formed on an underside of the light emitting structure connected to the second conductive type semiconductor layer electrically, a first electrode layer in contact with the first conductive type semiconductor layer passed through the second conductive type semiconductor layer and the active layer, and an insulating layer formed between the second electrode layer and the first electrode layer, between the second conductive type semiconductor layer and the first electrode layer, and between the active layer and the first electrode layer.
摘要翻译：本发明涉及一种发光器件，发光器件封装以及具有该发光器件的照明器件。发光器件包括：发光结构，包括第一导电类型半导体层，有源层和第二导电类型半导体层，形成在与第二导电类型半导体层连接的发光结构的下侧上的第二电极层与通过第二导电类型半导体层和有源层的第一导电类型半导体层接触的第一电极层和形成在第二电极层和第一电极层之间的绝缘层，在第二导电类型半导体层和第一电极层，以及有源层和第一电极层之间。

6. 发明授权

US08653547B2 Light emitting device and light emitting device package 有权
标题翻译：发光器件和发光器件封装
公开(公告)号：US08653547B2
公开(公告)日：2014-02-18
申请号：US12943628
申请日：2010-11-10
申请人： Hwan Hee Jeong , Sang Youl Lee , June O Song , Kwang Ki Choi
发明人： Hwan Hee Jeong , Sang Youl Lee , June O Song , Kwang Ki Choi
IPC分类号： H01L33/00
CPC分类号： H01L33/22 , H01L33/005 , H01L33/36 , H01L33/38 , H01L33/405 , H01L33/42 , H01L33/60 , H01L33/62 , H01L2224/45139 , H01L2224/48091 , H01L2924/12032 , H01L2933/0016 , H01L2924/00014 , H01L2924/00 , H01L2924/00011
摘要： Provided are a light emitting device and a light emitting device package. The light emitting device includes a first electrode, a light emitting structure including a first semiconductor layer, an active layer, and a second semiconductor layer on the first electrode, a second electrode on the light emitting structure, and a reflective member on at least lateral surface of the second electrode.
摘要翻译：提供了一种发光器件和发光器件封装。发光器件包括第一电极，在第一电极上包括第一半导体层，有源层和第二半导体层的发光结构，发光结构上的第二电极和至少侧向的反射构件第二电极的表面。

7. 发明申请

US20140042487A1 LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE 有权
公开(公告)号：US20140042487A1
公开(公告)日：2014-02-13
申请号：US14055675
申请日：2013-10-16
申请人： Hwan Hee JEONG , Sang Youl Lee , Ji Hyung Moon , June O Song , Kwang Ki Choi
发明人： Hwan Hee JEONG , Sang Youl Lee , Ji Hyung Moon , June O Song , Kwang Ki Choi
IPC分类号： H01L33/40
CPC分类号： H01L33/44 , F21K9/23 , F21Y2105/10 , F21Y2113/13 , F21Y2115/10 , H01L33/0079 , H01L33/06 , H01L33/10 , H01L33/22 , H01L33/32 , H01L33/36 , H01L33/38 , H01L33/387 , H01L33/40 , H01L33/42 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/0002 , H01L2924/12032 , H01L2924/00014 , H01L2924/00
摘要： Disclosed are a light emitting device and a light emitting device package. The light emitting device includes a light emitting structure including a first conductive semiconductor layer, an active layer on the first conductive semiconductor layer, and a second conductive semiconductor layer on the active layer, an adhesive layer contacting a top surface of the first conductive semiconductor layer, a first electrode contacting a top surface of the first conductive semiconductor and a top surface of the adhesive layer, and a second electrode contacting the second conductive semiconductor layer, wherein the adhesive layer contacting the first electrode is spaced apart from the second electrode.

8. 发明授权

US08575644B2 Light emitting device having an electro-static discharge protection part 有权
标题翻译：具有静电放电保护部的发光装置
公开(公告)号：US08575644B2
公开(公告)日：2013-11-05
申请号：US13192142
申请日：2011-07-27
申请人： Hwan Hee Jeong , Sang Youl Lee , Jung Hyeok Bae , Kwang Ki Choi , June O Song
发明人： Hwan Hee Jeong , Sang Youl Lee , Jung Hyeok Bae , Kwang Ki Choi , June O Song
IPC分类号： H01L33/00
CPC分类号： H01L27/15 , H01L33/0079 , H01L33/405 , H01L33/44 , H01L2224/48227 , H01L2924/12032 , H01L2924/00
摘要： Provided are a light emitting device and a light emitting device package. According to the light emitting device, a light emitting part and an electro-static discharge (ESD) protection part are disposed on a conductive support member. A connection layer electrically connects a first conducitve type semiconductor layer of the light emitting part to a second conductive type semiconductor layer of the ESD protection part. A ptrtection member is disposed on the connection layer and the ESD protection layer.
摘要翻译：提供了一种发光器件和发光器件封装。根据发光装置，发光部和静电放电（ESD）保护部设置在导电性支撑部件上。连接层将发光部的第一导通型半导体层与ESD保护部的第二导电型半导体层电连接。保护构件设置在连接层和ESD保护层上。

9. 发明授权

US08471241B2 Light emitting device, light emitting device package, and lighting system 有权
标题翻译：发光装置，发光装置封装和照明系统
公开(公告)号：US08471241B2
公开(公告)日：2013-06-25
申请号：US13049126
申请日：2011-03-16
申请人： Kwang Ki Choi , Hwan Hee Jeong , Sang Youl Lee , June O Song , Ji Hyung Moon
发明人： Kwang Ki Choi , Hwan Hee Jeong , Sang Youl Lee , June O Song , Ji Hyung Moon
IPC分类号： H01L33/06
CPC分类号： H01L33/62 , H01L33/0079 , H01L33/22 , H01L33/385 , H01L33/44 , H01L2924/0002 , H01L2924/00
摘要： Provided are a light emitting device, a light emitting device package, and a lighting system. The light emitting device includes a light emitting structure layer, a conductive layer, a bonding layer, a support member, first and second pads, and first and second electrodes. The light emitting structure layer includes a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer. The conductive layer is disposed under the light emitting structure layer. The bonding layer is disposed under the conductive layer. The support member is disposed under the bonding layer. The first pad is disposed under the support member. The second pad is disposed under the support member at a distance from the first pad. The first electrode is connected between the first conductive type semiconductor layer and the first pad. The second electrode is connected between the bonding layer and the second pad.
摘要翻译：提供了一种发光器件，发光器件封装和照明系统。发光器件包括发光结构层，导电层，接合层，支撑构件，第一和第二焊盘以及第一和第二电极。发光结构层包括第一导电类型半导体层，有源层和第二导电类型半导体层。导电层设置在发光结构层的下方。接合层设置在导电层下方。支撑构件设置在接合层下方。第一衬垫设置在支撑构件的下方。第二垫片设置在支撑构件的下方距离第一垫片一定距离处。第一电极连接在第一导电类型半导体层和第一焊盘之间。第二电极连接在接合层和第二焊盘之间。

10. 发明授权

US08421112B2 Light emitting device and light emitting device package having the same 有权
标题翻译：发光器件和具有该发光器件的发光器件封装
公开(公告)号：US08421112B2
公开(公告)日：2013-04-16
申请号：US12986592
申请日：2011-01-07
申请人： Hwan Hee Jeong , Sang Youl Lee , Ji Hyung Moon , June O Song , Kwang Ki Choi
发明人： Hwan Hee Jeong , Sang Youl Lee , Ji Hyung Moon , June O Song , Kwang Ki Choi
IPC分类号： H01L31/0224
CPC分类号： H01L33/44 , H01L33/0079 , H01L33/382 , H01L33/385 , H01L33/62 , H01L2224/48091 , H01L2933/0016 , H01L2924/00014
摘要： Disclosed are a light emitting device and a light emitting device package having the same. The light emitting device includes a light emitting structure including a first conductive semiconductor layer, an active layer under the first conductive semiconductor layer, and a second conductive semiconductor layer under the active layer; a first electrode layer under the second conductive semiconductor layer; an electrode including a top surface making contact with a part of a bottom surface of the first conductive semiconductor layer; and an insulating member for covering an outer peripheral surface of the electrode, wherein a part of the insulating member extends into a region between the second conductive semiconductor layer and the first electrode layer from a bottom surface of the electrode.
摘要翻译：公开了一种发光器件和具有该发光器件的发光器件封装。发光器件包括发光结构，其包括第一导电半导体层，第一导电半导体层下方的有源层和有源层下的第二导电半导体层; 第二导电半导体层下面的第一电极层; 电极，其包括与所述第一导电半导体层的底表面的一部分接触的顶表面; 以及用于覆盖电极的外周面的绝缘构件，其中绝缘构件的一部分从电极的底面延伸到第二导电半导体层和第一电极层之间的区域中。

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