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    • 1. 发明授权
    • Shunt regulator having over-voltage protection circuit and semiconductor device including the same
    • 具有过电压保护电路的分路稳压器和包括其的半导体器件
    • US08461812B2
    • 2013-06-11
    • US12327458
    • 2008-12-03
    • Han-Su KimJoo-Hyun Jeong
    • Han-Su KimJoo-Hyun Jeong
    • G05F1/613
    • G05F1/613
    • A shunt regulator includes a control circuit, a bypass circuit and a protection circuit. The control circuit is coupled between a first node and a ground, and generates a gate control signal in response to a voltage of the first node and a reference voltage. The bypass circuit forms a first current path between the first node and the ground in response to the gate control signal. The protection circuit has an MOS transistor that is fully turned on in response to a current flowing through the bypass circuit, and forms a second current path between the first node and the ground. Therefore, the shunt regulator occupies a relatively small area in an integrated circuit.
    • 并联调节器包括控制电路,旁路电路和保护电路。 控制电路耦合在第一节点和地之间,并且响应于第一节点的电压和参考电压而产生门控制信号。 旁路电路响应于门控制信号在第一节点和地之间形成第一电流路径。 保护电路具有响应于流过旁路电路的电流而完全导通的MOS晶体管,并且在第一节点和地之间形成第二电流路径。 因此,分流调节器在集成电路中占据相对较小的面积。
    • 2. 发明授权
    • Method of fabricating semiconductor device
    • 制造半导体器件的方法
    • US08216860B2
    • 2012-07-10
    • US13083309
    • 2011-04-08
    • Joo-hyun JeongChul-ho Chung
    • Joo-hyun JeongChul-ho Chung
    • H01L21/02
    • H01L21/76841H01L21/2855H01L23/5227H01L23/53223H01L23/53238H01L28/10H01L2924/0002H01L2924/00
    • A semiconductor device and a method of fabricating a semiconductor device that includes forming an interlayer insulating film on a semiconductor substrate; depositing a first soft magnetic thin film on the interlayer insulating film through sputtering using a target containing at least one of Fe, Co, Ni, or alloys thereof, the target further containing at least one of Ti, Hf, or B, the sputtering being performed using an N2 reactive gas; forming a metal film on the first soft magnetic thin film; depositing a second soft magnetic thin film on the metal film through sputtering using the same or another target containing at least one of Fe, Co, Ni, or alloys thereof, the target further containing at least one of Ti, Hf, or B, the sputtering being performed using an N2 reactive gas; and patterning to form an inductor.
    • 一种半导体器件和制造半导体器件的方法,包括在半导体衬底上形成层间绝缘膜; 通过使用包含Fe,Co,Ni或其合金中的至少一种的靶通过溅射,在层间绝缘膜上沉积第一软磁性薄膜,靶还含有Ti,Hf或B中的至少一种,溅射为 使用N2反应气体进行; 在第一软磁薄膜上形成金属膜; 通过溅射使用含有Fe,Co,Ni或其合金中的至少一种的相同或另一靶的溅射在金属膜上沉积第二软磁薄膜,靶还含有Ti,Hf或B中的至少一种, 使用N 2反应气体进行溅射; 并图案化以形成电感器。