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    • 1. 发明授权
    • Polishing apparatus and substrate retainer ring providing continuous slurry distribution
    • 抛光装置和基板保持环提供连续的浆料分布
    • US06447380B1
    • 2002-09-10
    • US09607896
    • 2000-06-30
    • Xuyen PhamJoe Simon
    • Xuyen PhamJoe Simon
    • B24B3704
    • B24B37/32
    • A polishing apparatus includes a rotatable head assembly including a substrate retainer that incorporates a cavity in the face surface of the substrate retainer for temporarily holding polishing slurry during operation of the polishing apparatus. The cavity resides in the face surface of the substrate retainer at a location adjacent the perimeter surface of the retainer. During operation of the polishing apparatus, slurry flowing along the surface of the polishing pad flows into the cavity where a portion of the slurry is temporarily held. As the head assembly of the polishing apparatus rotates against the polishing pad, slurry continuously flows from the cavity across the polishing pad and is uniformly distributed across the exposed surface of the substrate being polished. An offset in the cavity wall permits used slurry to flow away from the substrate retainer during rotation of the head assembly.
    • 抛光装置包括可旋转的头部组件,其包括基板保持器,该基板保持器在基板保持器的表面中并入腔体,用于在抛光装置的操作期间临时保持抛光浆料。 空腔位于与保持器的周边表面相邻的位置处的基板保持器的表面。 在抛光装置的操作期间,沿着抛光垫的表面流动的浆料流入其中浆料的一部分暂时保持的空腔。 当抛光装置的头部组件相对于抛光垫旋转时,浆料从腔体连续地流过抛光垫,并且均匀分布在被抛光的基底的暴露表面上。 空腔壁中的偏移允许使用的浆料在头部组件旋转期间从衬底保持器流出。