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1. 发明公开

KR20090117970A MAT MATERIALS, METHOD FOR PRODUCING MAT MATERIALS, SILENCER AND METHOD FOR PRODUCING SILENCER 审中-公开
标题翻译：垫材，生产垫材的方法，消音器和生产消音器的方法
公开(公告)号：KR20090117970A
公开(公告)日：2009-11-17
申请号：KR20087030070
申请日：2008-04-30
申请人： IBIDEN CO LTD
发明人： OKABE TAKAHIKO , SUZUKI DAISUKE
IPC分类号： F01N1/24 , D04H1/4209 , D04H1/4218 , D04H1/46 , D04H1/488 , F01N13/16
CPC分类号： F01N1/04 , D04H1/4209 , D04H1/4218 , D04H1/46 , D04H1/488 , F01N3/2853 , F01N2310/02 , Y02A50/2322 , Y10T29/49398 , Y10T156/1033 , Y10T428/24281 , Y10T442/682 , Y10T442/687
摘要： A mat material that even when disposed in high-temperature conditions in the use in automobile muffler, etc., can be free from breakage due to wind erosion and thermal deterioration and excels in handleability. The mat material has the following characteristics. The mat material is composed mainly of an inorganic fiber. The mat material has multiple needle vestiges each provided by needle punching running from a needle penetration vestige provided on one surface to a needle departure vestige provided on the surface opposite to the surface provided with the needle penetration vestige. The needle departure vestige is provided with an inorganic fiber hank resulting from orientation of multiple inorganic fibers into a closed-loop configuration. The inorganic fiber hank is provided on at least one of the surfaces.
摘要翻译：即使在汽车消声器等使用时处于高温条件下，也能够避免由于风蚀和热劣化而引起的破损，并且操作性优异。垫材料具有以下特征。垫材主要由无机纤维构成。垫材具有多个针迹，每个针迹通过针刺从设置在一个表面上的针刺痕迹延伸到设置在与设置有针刺痕迹的表面相反的表面上的针迹离开痕迹。针偏离痕迹具有由多种无机纤维定向为闭环结构而产生的无机纤维绞纱。无机纤维绞线设置在至少一个表面上。

2. 发明公开

KR20080098496A HOLDING SEALER, EXHAUST GAS PROCESSING DEVICE AND MANUFACTURING METHOD OF THE SAME 有权
标题翻译：保持密封件，排气处理装置及其制造方法
公开(公告)号：KR20080098496A
公开(公告)日：2008-11-10
申请号：KR20087020109
申请日：2008-08-18
申请人： IBIDEN CO LTD
发明人： GOSHIMA NORITSUNA , SHINOHARA TOMOHIDE
IPC分类号： F01N3/28 , F01N3/24
摘要： 본 발명의 목적은, 우레아 SCR 시스템에 사용하는 배기 가스 정화 장치에 적용했을 때에, 장기간의 사용 후에도 높은 유지력을 유지할 수 있는 유지 시일재를 제공하는 것으로, 본 발명의 유지 시일재는 매트상이고, 우레아를 흡착시키기 위한 흡착부와, 배기 가스 유지체를 유지하기 위한 유지부로 이루어지고, 상기 흡착부의 장측면과 상기 유지부의 장측면이 공간을 사이에 두고 서로 대향하고 있고, 상기 흡착부와 상기 유지부가 연결부를 개재하여 연결되어 있으며, 상기 흡착부의 폭이 상기 유지부의 폭보다 작은 것을 특징으로 한다.

3. 发明公开

KR20100095033A Flex-rigid wiring board and electronic device 审中-公开
标题翻译：柔性刚性接线板和电子设备
公开(公告)号：KR20100095033A
公开(公告)日：2010-08-27
申请号：KR20107017241
申请日：2008-12-19
申请人： IBIDEN CO LTD
发明人： SAGISAKA KATSUMI
IPC分类号： H05K3/46 , H05K1/14
CPC分类号： H05K1/141 , H05K1/16 , H05K1/185 , H05K3/325 , H05K3/3421 , H05K3/3436 , H05K3/4602 , H05K3/4691 , H05K2201/052 , H05K2201/09109 , H05K2201/09127 , H05K2201/09236 , H05K2201/09245 , H05K2201/09254 , H05K2201/09272 , H05K2201/096 , H05K2201/10265 , H05K2203/0455 , H05K2203/049
摘要： 본 발명은 리지드 인쇄 배선판 (11, 12)와, 연성 기재를 갖는 연성 인쇄 배선판 (13)을 구비하는 플렉스 리지드 배선판 (10)에 관한 것이며, 연성 인쇄 배선판 (13)은 연성 기재 위에 제1 도체를 갖고, 리지드 인쇄 배선판 (11, 12)는 제2 도체를 갖고, 제1 도체와 제2 도체는 전기적으로 접속되어 있다. 또한, 연성 인쇄 배선판 (13)은 리지드 인쇄 배선판 (11, 12)와 접속된다. 또한, 연성 인쇄 배선판 (13)은 그 접속 개소로부터, 리지드 인쇄 배선판 (11, 12)의 외형의 변에 대하여 예각 또는 둔각의 각도 (θ11, θ12, θ21, θ22)를 갖는 방향으로 연장 설치되어 있다.

4. 发明申请

WO2016141579A1 METHOD FOR MANUFACTURING CVD-SIC MATERIAL 审中-公开
标题翻译：制造CVD-SIC材料的方法
公开(公告)号：WO2016141579A1
公开(公告)日：2016-09-15
申请号：PCT/CN2015/074065
申请日：2015-03-12
申请人： IBIDEN CO., LTD. , WUHAN UNIVERSITY OF TECHNOLOGY , GOTO, Takashi
发明人： GOTO, Takashi , ZHANG, Song , TU, Rong , HAN, Mingxu
IPC分类号： C23C16/32 , C23C16/455 , C30B28/14
CPC分类号： C23C16/325 , C30B28/14
摘要： A method for manufacturing a CVD-SiC material using a carbon source composed of C 2 H 2 and a silicon source composed of a halogenated silane as a raw material gas and forming polycrystalline SiC by the CVD method.
摘要翻译：使用由C2H2构成的碳源和由卤化硅烷构成的硅源作为原料气体并通过CVD法形成多晶SiC的CVD-SiC材料的制造方法。

5. 发明申请

WO0145160A8 CERAMIC HEATER AND SUPPORT PIN 审中-公开
标题翻译：陶瓷加热器和支撑针
公开(公告)号：WO0145160A8
公开(公告)日：2001-07-19
申请号：PCT/JP0008871
申请日：2000-12-14
申请人： IBIDEN CO LTD , HIRAMATSU YASUJI , ITO YASUTAKA
发明人： HIRAMATSU YASUJI , ITO YASUTAKA
IPC分类号： H05B3/20 , H01L21/00 , H01L21/68 , H01L21/683 , H01L21/687 , H05B3/14 , H05B3/26 , H05B3/28 , H01L21/02 , H05B3/16 , H05B3/18 , H05B3/68
CPC分类号： H05B3/283 , H01L21/67103 , H01L21/67109 , H01L21/6835 , H01L21/6875 , H05B3/143 , H05B3/265
摘要： A ceramic heater having an advantage that the distance between a semiconductor wafer and the heating surface of a ceramic base can be maintained constant, the semiconductor wafer can be heated at even temperature, pollution of the semiconductor wafer is prevented, and no support pins come off. The ceramic heater having a ceramic base on or in which a heater is provided is characterized in that the semiconductor wafer is spaced from the surface of the ceramic base and heated.
摘要翻译：陶瓷加热器具有以下优点：半导体晶片与陶瓷基体的加热面之间的距离可以保持恒定，半导体晶片可以在均匀的温度下被加热，从而防止了半导体晶片的污染，并且没有支撑销脱落。陶瓷加热器在其上设置有加热器的陶瓷加热器的特征在于，半导体晶片与陶瓷基体的表面间隔开并被加热。

6. 发明申请

WO1998026639A1 MULTILAYERED PRINTED WIRING BOARD 审中-公开
标题翻译：多层印刷线路板
公开(公告)号：WO1998026639A1
公开(公告)日：1998-06-18
申请号：PCT/JP1996003655
申请日：1996-12-13
申请人： IBIDEN CO., LTD. , ASAI, Motoo , NAKAMURA, Akihito
发明人： IBIDEN CO., LTD.
IPC分类号： H05K03/46
CPC分类号： H05K1/0224 , H05K1/0253 , H05K1/0298 , H05K3/184 , H05K3/38 , H05K3/4641 , H05K3/4661 , H05K2201/09681 , H05K2203/1178
摘要： A multilayered printed wiring board such that the swell of the conductor layer and the deterioration of the adhesion between the insulating resin layer and the conductor caused by remaining solvent are prevented. The multilayered printed wiring board is a lamination of the insulating resin layer and the conductor layer upon a sheet. The conductor layer composed at least of a signal layer and a power supply layer has a lattice-like conductor pattern of the power supply layer.
摘要翻译：能够防止导体层的隆起和由残留的溶剂导致的绝缘树脂层与导体之间的粘附性的劣化的多层印刷电路板。多层印刷布线板是层叠绝缘树脂层和导体层的片材。至少构成信号层和电源层的导体层具有电源层的格子状的导体图案。

7. 发明申请

WO1997016848A1 ELECTRONIC PART MODULE AND PROCESS FOR MANUFACTURING THE SAME 审中-公开
标题翻译：电子零件模块及其制造方法
公开(公告)号：WO1997016848A1
公开(公告)日：1997-05-09
申请号：PCT/JP1996003153
申请日：1996-10-28
申请人： IBIDEN CO., LTD. , MORI, Mikio , KOHMURA, Toshimi
发明人： IBIDEN CO., LTD.
IPC分类号： H01L21/60
CPC分类号： H01L24/81 , H01L21/563 , H01L23/49855 , H01L24/29 , H01L24/48 , H01L24/83 , H01L24/90 , H01L2224/16225 , H01L2224/16237 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/75 , H01L2224/75252 , H01L2224/75301 , H01L2224/75745 , H01L2224/81191 , H01L2224/81204 , H01L2224/81801 , H01L2224/83102 , H01L2224/83192 , H01L2224/92125 , H01L2224/92225 , H01L2924/00014 , H01L2924/00015 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H05K3/303 , H05K3/3431 , H01L2924/00 , H01L2224/05599 , H01L2224/85399 , H01L2224/45099 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： An electronic part module which is reduced in cost by using an inexpensive thermoplastic resin as the base material of a circuit board. In order to electrically connect the solder bumps of an electronic part such as an IC chip to a connection pattern, the electronic part is heated and then pressed against the circuit board. Then the board is partially fused and the bumps penetrate through the board, even though no connection holes are made in advance. The material of the board also serves as adhesive. Heating the electronic part (3) to a temperature higher than the fusing temperature of the thermoplastic resin and lower than the melting point of the bumps (2), the bumps (2) are pressed against the resin board (4). The solder bumps (2) penetrate through the base material (4) and come into contact with a connection pattern (5). Next the parts (3) are further heated to a temperature higher than the melting point of the bumps (2), and then the bumps are fused and welded to the connection pattern. Therefore, the part (3) is bonded and fixed to the pattern through the thermoplastic resin of the base material (4) around the bumps (2).
摘要翻译：一种电子部件模块，其通过使用廉价的热塑性树脂作为电路板的基材而降低了成本。为了将诸如IC芯片的电子部件的焊料凸块电连接到连接图案，电子部件被加热然后压靠在电路板上。然后，即使没有提前连接孔，板被部分熔化，凸块也穿过板。板的材料也用作粘合剂。将电子部件（3）加热到高于热塑性树脂的定影温度的温度并低于凸点（2）的熔点，将凸块（2）压在树脂基板（4）上。焊料凸块（2）穿过基材（4）并与连接图案（5）接触。接下来，将部分（3）进一步加热到高于凸块（2）的熔点的温度，然后将凸块熔合并焊接到连接图案。因此，通过基体材料（4）的热塑性树脂围绕凸块（2）将部分（3）结合并固定到图案上。

8. 发明申请

WO1996038679A1 HIGH-SPEED ROTARY BODY 审中-公开
标题翻译：高速旋转体
公开(公告)号：WO1996038679A1
公开(公告)日：1996-12-05
申请号：PCT/JP1995001078
申请日：1995-06-02
申请人： IBIDEN CO., LTD. , KUWAYAMA, Yoichi , IZUME, Hiroyuki , JINBO, Naoyuki , OHNO, Kazushige
发明人： IBIDEN CO., LTD.
IPC分类号： F16C32/00
CPC分类号： F16C32/0417 , F16C17/02 , F16C17/026 , F16C25/045 , F16C33/1015 , G02B26/121 , H02K5/1677 , H02K7/09
摘要： A ring-shaped magnet (19) is bonded to an outer circumferential portion of a rotary body (21) supported on a rotary shaft (13) which forms a radial dynamic gas pressure bearing. A ring-shaped magnet (23) is provided with a predetermined distance maintained between itself and the ring-shaped magnet (19). Owing to the magnetic attractive force of these two ring-shaped magnets (19, 23), the rotary body (21) is restricted in its axial movement and held radially rotatable. Since the rotary body (21) is held in a 0.5 decentered state due to the difference in the magnetic balance between the ring-shaped magnets (19, 23), the radial dynamic gas pressure bearing generates a high dynamic pressure. A high dynamic pressure occurs due to herringbone dynamic gas generating grooves (15a, 15b) as well. Owing to the synergetic effect of these parts, a very high radial load capacity occurs, and the rotational accuracy is improved.
摘要翻译：环形磁体（19）被结合到支撑在形成径向动态气体压力轴承的旋转轴（13）上的旋转体（21）的外周部分上。环状磁体（23）在其与环状磁体（19）之间保持预定距离。由于这两个环形磁体（19,23）的磁性吸引力，旋转体（21）的轴向运动被限制并保持径向可旋转。由于旋转体（21）由于环形磁体（19,23）之间的磁平衡的差异而保持在0.5偏心状态，所以径向动态气体压力轴承产生高动态压力。由于人字动态气体发生槽（15a，15b）也产生高动态压力。由于这些部件的协同效应，发生非常高的径向载荷能力，并提高了旋转精度。

9. 发明申请

WO1993025060A1 SOLDER-PRECOATED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：焊接预处理接线板及其制造方法
公开(公告)号：WO1993025060A1
公开(公告)日：1993-12-09
申请号：PCT/JP1993000736
申请日：1993-06-01
申请人： IBIDEN CO., LTD. , TAKAHASHI, Shinji , TUCHIYA, Toshihisa
发明人： IBIDEN CO., LTD.
IPC分类号： H05K03/24
CPC分类号： H05K3/244 , H05K3/3452 , H05K3/3473 , H05K2201/0338 , H05K2203/043 , H05K2203/0571 , H05K2203/072 , H05K2203/073 , Y10S428/901 , Y10T428/12687 , Y10T428/12694 , Y10T428/24917
摘要： A solder-precoated wiring board on which devices and component can be mounted at fine pitches and which can be manufactured with a high productivity. A solder layer on a conductor for connection of electronic components on the wiring board comprises an Sn thin film layer formed by, for example, Cu-Sn substitution reaction on the basis of forming a Cu-complex of thiourea, and a Pb-coated Sn layer made by forming an Sn film, forming Sn crystalline particles film by Sn disproportionating reaction based on selective deposition on the Sn film, and substituting Pb for at least part of the Sn crystalline particles by Sn-Pb substituting reaction on the basis of the ionization tendency. It is desirable to melt this solder layer, and then, cool it to form an alloyed layer.
摘要翻译：焊料预涂布线板，其上可以以细间距安装器件和部件，并且可以以高生产率制造。用于在电路板上连接电子部件的导体上的焊料层包括通过例如基于形成硫脲的Cu络合物的Cu-Sn取代反应形成的Sn薄膜层和Pb涂覆的Sn 通过形成Sn膜形成的Sn层，通过Sn选择性沉积在Sn膜上形成Sn结晶粒子膜，通过Sn-Pb取代反应用Pb取代至少部分Sn结晶粒子，趋势。熔化该焊料层是理想的，然后将其冷却以形成合金层。

10. 发明申请

WO1991004360A1 THIN FILM OF LITHIUM NIOBATE SINGLE CRYSTAL AND PRODUCTION THEREOF 审中-公开
标题翻译：单晶硅薄膜及其生产薄膜
公开(公告)号：WO1991004360A1
公开(公告)日：1991-04-04
申请号：PCT/JP1990001207
申请日：1990-09-20
申请人： IBIDEN CO., LTD. , YAMADA, Masaya , OONO, Satoshi , ENOMOTO, Ryo
发明人： IBIDEN CO., LTD.
IPC分类号： C30B29/30
CPC分类号： G02B6/13 , C30B19/02 , C30B19/04 , C30B29/30 , Y10S117/918
摘要： A thin film of lithium niobate single crystal formed on a lithium tantalate substrate, wherein the lattice constant of the a axis of said substrate is matched to that of the a axis of said thin film. A method of matching the lattice constants comprises bringing a lithium tantalate substrate into contact with a molten substance to effect the epitaxial growth of a thin film of lithium niobate single crystal thereon, wherein a composition comprising Li2O, V2O5, Nb2O5, Na2O, and MgO is mainly used as the molten substance. This method affords a thin film of lithium niobate single crystal which does not necessitate a poling step, is reduced in propagation loss, and has a large thickness, thus greatly contributing to the optical device industry.

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