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    • 1. 发明申请
    • SEMICONDUCTOR DEVICE HAVING SELF-ALIGNED CONTACT HOLE AND METHOD OF FABRICATING THE SAME
    • 具有自对准接触孔的半导体器件及其制造方法
    • US20070077709A1
    • 2007-04-05
    • US11463814
    • 2006-08-10
    • Hyoung-Sub KIM
    • Hyoung-Sub KIM
    • H01L21/336H01L21/44
    • H01L21/76831H01L21/76897H01L21/823425H01L21/823475H01L27/10873H01L27/10888H01L27/10894
    • According to embodiments of the invention, word line patterns are placed on a semiconductor substrate in a cell array region and at least one gate pattern is placed on the semiconductor substrate in a peripheral circuit region. Side walls of the word line patterns and the gate pattern are covered with word line spacers and gate spacers having the same width as that of the word line spacers, respectively. The semiconductor substrate having the word line spacers and the gate spacers is covered with an interlayer insulating layer. A self-aligned contact hole formed in the interlayer insulating layer penetrates a predetermined region between the word line patterns. The self-aligned contact hole is formed by etching the interlayer insulating layer and the word line spacers. The side walls of the self-aligned contact hole are covered with a self-aligned contact spacer having a width different from that of the gate spacers.
    • 根据本发明的实施例,字线图形被放置在单元阵列区域中的半导体衬底上,并且至少一个栅极图案被放置在外围电路区域中的半导体衬底上。 字线图案和栅极图案的侧壁分别用与字线间隔件宽度相同的字线间隔物和栅极间隔物覆盖。 具有字线间隔物和栅极间隔物的半导体衬底被层间绝缘层覆盖。 形成在层间绝缘层中的自对准接触孔穿过字线图案之间的预定区域。 通过蚀刻层间绝缘层和字线间隔物形成自对准接触孔。 自对准接触孔的侧壁被具有与栅极间隔物的宽度不同的宽度的自对准接触间隔物覆盖。
    • 3. 发明授权
    • Transistor having reverse self-aligned structure
    • 晶体管具有反向自对准结构
    • US06218690B1
    • 2001-04-17
    • US09376041
    • 1999-08-16
    • Hyoung-sub KimJa-hum KuChul-sung KimJung-woo Park
    • Hyoung-sub KimJa-hum KuChul-sung KimJung-woo Park
    • H01L2976
    • H01L29/66606H01L29/66621
    • A reverse self-aligned field effect transistor and a method of fabricating the same are provided. The reverse self-aligned transistor includes a source formed on an active region of a semiconductor substrate and a drain formed on the active region of the semiconductor substrate, the drain being positioned a predetermined distance from the source. A silicide film is formed on the source and the drain. Insulative film spacers are formed on sidewalls of a trench, the trench being formed by etchin the semiconductor substrate between the source and the drain. A gate insulative film is formed on a lower portion of the trench and a metal gate is formed on the gate insulative film between the insulative film spacers. The metal gate is electrically isolated from the source and the drain by the insulative film spacers.
    • 提供了反向自对准场效应晶体管及其制造方法。 反向自对准晶体管包括形成在半导体衬底的有源区上的源极和形成在半导体衬底的有源区上的漏极,漏极位于与源极预定的距离处。 在源极和漏极上形成硅化物膜。 绝缘膜间隔物形成在沟槽的侧壁上,沟槽通过蚀刻在源极和漏极之间的半导体衬底形成。 栅极绝缘膜形成在沟槽的下部,并且在绝缘膜间隔物上的栅极绝缘膜上形成金属栅极。 金属栅极通过绝缘膜间隔物与源极和漏极电隔离。
    • 9. 发明授权
    • Storage node of DRAM cell
    • DRAM单元的存储节点
    • US06696722B1
    • 2004-02-24
    • US09708957
    • 2000-11-08
    • Hyoung-Sub Kim
    • Hyoung-Sub Kim
    • H01L27108
    • H01L27/10852H01L21/32137H01L21/76895H01L28/60
    • A storage node of a DRAM cell capacitor includes a first insulating layer in which a bit line pattern is formed, a second insulating layer formed on the first insulating layer of which material is different from that of the second insulating layer, a first conductive layer formed on the second insulating layer that has an etching rate different from that of the first conductive layer, a material layer formed on the first conductive layer, which has a smaller width than the first conductive layer and is made of material with different etching characteristics from that of the first conductive layer, a second conductive layer that is formed on the material layer and has the same width as that of the material layer, and a sidewall conductive spacer that is an contact with the second conductive layer and the material layer and is formed on the top surface of the first conductive layer and on sides of the material layer and the second conductive layer.
    • DRAM单元电容器的存储节点包括其中形成位线图形的第一绝缘层,形成在与第二绝缘层的材料不同的第一绝缘层上的第二绝缘层,形成的第一导电层 在具有与第一导电层不同的蚀刻速率的第二绝缘层上,形成在第一导电层上的材料层,其宽度小于第一导电层,并且由与第一导电层不同的蚀刻特性的材料制成 形成在所述材料层上并且具有与所述材料层的宽度相同的宽度的第二导电层,以及与所述第二导电层和所述材料层接触形成的侧壁导电间隔物, 在第一导电层的顶表面上以及材料层和第二导电层的侧面上。